JPWO2020184235A1 - - Google Patents
Info
- Publication number
- JPWO2020184235A1 JPWO2020184235A1 JP2021504928A JP2021504928A JPWO2020184235A1 JP WO2020184235 A1 JPWO2020184235 A1 JP WO2020184235A1 JP 2021504928 A JP2021504928 A JP 2021504928A JP 2021504928 A JP2021504928 A JP 2021504928A JP WO2020184235 A1 JPWO2020184235 A1 JP WO2020184235A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
- H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J45/00—Discharge tubes functioning as thermionic generators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
- H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019044971 | 2019-03-12 | ||
| PCT/JP2020/008579 WO2020184235A1 (ja) | 2019-03-12 | 2020-03-02 | 発電機能付半導体集積回路装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2020184235A1 true JPWO2020184235A1 (https=) | 2020-09-17 |
Family
ID=72427828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021504928A Pending JPWO2020184235A1 (https=) | 2019-03-12 | 2020-03-02 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20220149022A1 (https=) |
| EP (1) | EP3940800A4 (https=) |
| JP (1) | JPWO2020184235A1 (https=) |
| KR (1) | KR20210136077A (https=) |
| CN (1) | CN113614937A (https=) |
| CA (1) | CA3131406A1 (https=) |
| WO (1) | WO2020184235A1 (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10559864B2 (en) | 2014-02-13 | 2020-02-11 | Birmingham Technologies, Inc. | Nanofluid contact potential difference battery |
| JPWO2020071535A1 (ja) * | 2018-10-04 | 2021-10-07 | 株式会社Ｇｃｅインスティチュート | 発電機能付発光装置、照明装置、及び表示装置 |
| US11124864B2 (en) | 2019-05-20 | 2021-09-21 | Birmingham Technologies, Inc. | Method of fabricating nano-structures with engineered nano-scale electrospray depositions |
| US11649525B2 (en) | 2020-05-01 | 2023-05-16 | Birmingham Technologies, Inc. | Single electron transistor (SET), circuit containing set and energy harvesting device, and fabrication method |
| US12527220B2 (en) | 2020-09-30 | 2026-01-13 | Nil Technology Aps | Manufacture of thermoelectric generators and other devices that include metastructures |
| US11417506B1 (en) | 2020-10-15 | 2022-08-16 | Birmingham Technologies, Inc. | Apparatus including thermal energy harvesting thermionic device integrated with electronics, and related systems and methods |
| KR102894753B1 (ko) * | 2021-05-06 | 2025-12-02 | 삼성전자주식회사 | 반도체 패키지 |
| US11616186B1 (en) | 2021-06-28 | 2023-03-28 | Birmingham Technologies, Inc. | Thermal-transfer apparatus including thermionic devices, and related methods |
| JP7518395B2 (ja) * | 2021-12-20 | 2024-07-18 | 日亜化学工業株式会社 | 回路基板、発光装置及びそれらの製造方法 |
| US20240243545A1 (en) * | 2023-01-17 | 2024-07-18 | Lawrence Livermore National Security, Llc | Systems and methods for cooling high power devices |
| US12446468B2 (en) * | 2024-03-18 | 2025-10-14 | William N Carr | Integrated battery comprising a secondary battery with charge maintained by a semiconductor battery |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55113833A (en) | 1979-02-21 | 1980-09-02 | Kobe Steel Ltd | Treating method for cast material by hot hydrostatic press |
| JPH06147901A (ja) | 1992-11-02 | 1994-05-27 | Murata Mfg Co Ltd | 圧電振動ジャイロ |
| JP3252902B2 (ja) * | 1998-12-21 | 2002-02-04 | 日本電気株式会社 | 温度制御ユニット |
| JP2001308395A (ja) * | 2000-04-21 | 2001-11-02 | Matsushita Electric Ind Co Ltd | 電子機器における熱エネルギー再生装置 |
| US20130192655A1 (en) * | 2007-08-29 | 2013-08-01 | Texas Instruments Incorporated | Thermoelectric device embedded in a printed circuit board |
| JP5397414B2 (ja) * | 2011-05-26 | 2014-01-22 | 株式会社デンソー | 熱電子発電素子 |
| US10559864B2 (en) * | 2014-02-13 | 2020-02-11 | Birmingham Technologies, Inc. | Nanofluid contact potential difference battery |
| JPWO2015166654A1 (ja) * | 2014-05-01 | 2017-04-20 | パナソニックＩｐマネジメント株式会社 | 半導体装置および半導体モジュール |
| CN104200864B (zh) * | 2014-08-25 | 2017-05-03 | 厦门大学 | 一种基于宽禁带半导体纳米管阵列薄膜结构的同位素电池 |
| JP6147901B1 (ja) * | 2016-07-29 | 2017-06-14 | 株式会社Ｇｃｅインスティチュート | 熱電素子及び熱電素子の製造方法 |
-
2020
- 2020-03-02 JP JP2021504928A patent/JPWO2020184235A1/ja active Pending
- 2020-03-02 CN CN202080020554.1A patent/CN113614937A/zh not_active Withdrawn
- 2020-03-02 CA CA3131406A patent/CA3131406A1/en not_active Abandoned
- 2020-03-02 EP EP20769782.2A patent/EP3940800A4/en not_active Withdrawn
- 2020-03-02 US US17/435,937 patent/US20220149022A1/en not_active Abandoned
- 2020-03-02 KR KR1020217032070A patent/KR20210136077A/ko not_active Ceased
- 2020-03-02 WO PCT/JP2020/008579 patent/WO2020184235A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| EP3940800A1 (en) | 2022-01-19 |
| EP3940800A4 (en) | 2022-12-21 |
| CA3131406A1 (en) | 2020-09-17 |
| WO2020184235A1 (ja) | 2020-09-17 |
| US20220149022A1 (en) | 2022-05-12 |
| KR20210136077A (ko) | 2021-11-16 |
| CN113614937A (zh) | 2021-11-05 |