JPWO2020184234A1 - - Google Patents
Info
- Publication number
- JPWO2020184234A1 JPWO2020184234A1 JP2021504927A JP2021504927A JPWO2020184234A1 JP WO2020184234 A1 JPWO2020184234 A1 JP WO2020184234A1 JP 2021504927 A JP2021504927 A JP 2021504927A JP 2021504927 A JP2021504927 A JP 2021504927A JP WO2020184234 A1 JPWO2020184234 A1 JP WO2020184234A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J45/00—Discharge tubes functioning as thermionic generators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
- H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019044970 | 2019-03-12 | ||
| PCT/JP2020/008578 WO2020184234A1 (ja) | 2019-03-12 | 2020-03-02 | 発電機能付半導体集積回路装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2020184234A1 true JPWO2020184234A1 (https=) | 2020-09-17 |
Family
ID=72427980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021504927A Pending JPWO2020184234A1 (https=) | 2019-03-12 | 2020-03-02 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20220149259A1 (https=) |
| EP (1) | EP3940801A4 (https=) |
| JP (1) | JPWO2020184234A1 (https=) |
| KR (1) | KR20210136076A (https=) |
| CN (1) | CN113574689A (https=) |
| CA (1) | CA3131377A1 (https=) |
| WO (1) | WO2020184234A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10559864B2 (en) | 2014-02-13 | 2020-02-11 | Birmingham Technologies, Inc. | Nanofluid contact potential difference battery |
| JPWO2020071535A1 (ja) * | 2018-10-04 | 2021-10-07 | 株式会社Ｇｃｅインスティチュート | 発電機能付発光装置、照明装置、及び表示装置 |
| US11124864B2 (en) | 2019-05-20 | 2021-09-21 | Birmingham Technologies, Inc. | Method of fabricating nano-structures with engineered nano-scale electrospray depositions |
| US11649525B2 (en) | 2020-05-01 | 2023-05-16 | Birmingham Technologies, Inc. | Single electron transistor (SET), circuit containing set and energy harvesting device, and fabrication method |
| US11417506B1 (en) | 2020-10-15 | 2022-08-16 | Birmingham Technologies, Inc. | Apparatus including thermal energy harvesting thermionic device integrated with electronics, and related systems and methods |
| US11616186B1 (en) | 2021-06-28 | 2023-03-28 | Birmingham Technologies, Inc. | Thermal-transfer apparatus including thermionic devices, and related methods |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55113833A (en) | 1979-02-21 | 1980-09-02 | Kobe Steel Ltd | Treating method for cast material by hot hydrostatic press |
| JPH06147901A (ja) | 1992-11-02 | 1994-05-27 | Murata Mfg Co Ltd | 圧電振動ジャイロ |
| JP3252902B2 (ja) * | 1998-12-21 | 2002-02-04 | 日本電気株式会社 | 温度制御ユニット |
| JP2001308395A (ja) * | 2000-04-21 | 2001-11-02 | Matsushita Electric Ind Co Ltd | 電子機器における熱エネルギー再生装置 |
| US7523617B2 (en) * | 2004-10-22 | 2009-04-28 | Nextreme Thermal Solutions, Inc. | Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics |
| JP2007299922A (ja) * | 2006-04-28 | 2007-11-15 | Sharp Corp | 半導体装置 |
| JP5397414B2 (ja) * | 2011-05-26 | 2014-01-22 | 株式会社デンソー | 熱電子発電素子 |
| US9041453B2 (en) * | 2013-04-04 | 2015-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Pulse generation circuit and semiconductor device |
| US10559864B2 (en) * | 2014-02-13 | 2020-02-11 | Birmingham Technologies, Inc. | Nanofluid contact potential difference battery |
| JP6147901B1 (ja) * | 2016-07-29 | 2017-06-14 | 株式会社Ｇｃｅインスティチュート | 熱電素子及び熱電素子の製造方法 |
| CA3131367A1 (en) * | 2019-02-25 | 2020-09-03 | Birmingham Technologies, Inc. | Nano-scale energy conversion device |
-
2020
- 2020-03-02 CA CA3131377A patent/CA3131377A1/en not_active Abandoned
- 2020-03-02 US US17/435,810 patent/US20220149259A1/en not_active Abandoned
- 2020-03-02 CN CN202080020452.XA patent/CN113574689A/zh not_active Withdrawn
- 2020-03-02 WO PCT/JP2020/008578 patent/WO2020184234A1/ja not_active Ceased
- 2020-03-02 EP EP20770218.4A patent/EP3940801A4/en not_active Withdrawn
- 2020-03-02 KR KR1020217032068A patent/KR20210136076A/ko not_active Ceased
- 2020-03-02 JP JP2021504927A patent/JPWO2020184234A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20220149259A1 (en) | 2022-05-12 |
| CN113574689A (zh) | 2021-10-29 |
| CA3131377A1 (en) | 2020-09-17 |
| WO2020184234A1 (ja) | 2020-09-17 |
| EP3940801A4 (en) | 2022-12-21 |
| EP3940801A1 (en) | 2022-01-19 |
| KR20210136076A (ko) | 2021-11-16 |