CN113574689A - 带发电功能的半导体集成电路装置 - Google Patents

带发电功能的半导体集成电路装置 Download PDF

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Publication number
CN113574689A
CN113574689A CN202080020452.XA CN202080020452A CN113574689A CN 113574689 A CN113574689 A CN 113574689A CN 202080020452 A CN202080020452 A CN 202080020452A CN 113574689 A CN113574689 A CN 113574689A
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CN
China
Prior art keywords
semiconductor integrated
integrated circuit
thermoelectric element
circuit device
electrode portion
Prior art date
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Withdrawn
Application number
CN202080020452.XA
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English (en)
Chinese (zh)
Inventor
后藤博史
坂田稔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GCE Institute Co Ltd
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GCE Institute Co Ltd
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Filing date
Publication date
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Publication of CN113574689A publication Critical patent/CN113574689A/zh
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J45/00—Discharge tubes functioning as thermionic generators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202080020452.XA 2019-03-12 2020-03-02 带发电功能的半导体集成电路装置 Withdrawn CN113574689A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-044970 2019-03-12
JP2019044970 2019-03-12
PCT/JP2020/008578 WO2020184234A1 (ja) 2019-03-12 2020-03-02 発電機能付半導体集積回路装置

Publications (1)

Publication Number Publication Date
CN113574689A true CN113574689A (zh) 2021-10-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080020452.XA Withdrawn CN113574689A (zh) 2019-03-12 2020-03-02 带发电功能的半导体集成电路装置

Country Status (7)

Country Link
US (1) US20220149259A1 (https=)
EP (1) EP3940801A4 (https=)
JP (1) JPWO2020184234A1 (https=)
KR (1) KR20210136076A (https=)
CN (1) CN113574689A (https=)
CA (1) CA3131377A1 (https=)
WO (1) WO2020184234A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10559864B2 (en) 2014-02-13 2020-02-11 Birmingham Technologies, Inc. Nanofluid contact potential difference battery
JPWO2020071535A1 (ja) * 2018-10-04 2021-10-07 株式会社Ｇｃｅインスティチュート 発電機能付発光装置、照明装置、及び表示装置
US11124864B2 (en) 2019-05-20 2021-09-21 Birmingham Technologies, Inc. Method of fabricating nano-structures with engineered nano-scale electrospray depositions
US11649525B2 (en) 2020-05-01 2023-05-16 Birmingham Technologies, Inc. Single electron transistor (SET), circuit containing set and energy harvesting device, and fabrication method
US11417506B1 (en) 2020-10-15 2022-08-16 Birmingham Technologies, Inc. Apparatus including thermal energy harvesting thermionic device integrated with electronics, and related systems and methods
US11616186B1 (en) 2021-06-28 2023-03-28 Birmingham Technologies, Inc. Thermal-transfer apparatus including thermionic devices, and related methods

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060086118A1 (en) * 2004-10-22 2006-04-27 Research Triangle Insitute Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
JP2007299922A (ja) * 2006-04-28 2007-11-15 Sharp Corp 半導体装置
US20120299438A1 (en) * 2011-05-26 2012-11-29 Denso Corporation Thermionic generator
CN104103321A (zh) * 2013-04-04 2014-10-15 株式会社半导体能源研究所 脉冲发生电路及半导体装置
US20150229013A1 (en) * 2014-02-13 2015-08-13 Joseph G. Birmingham Nanofluid contact potential difference battery
JP6147901B1 (ja) * 2016-07-29 2017-06-14 株式会社Ｇｃｅインスティチュート 熱電素子及び熱電素子の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55113833A (en) 1979-02-21 1980-09-02 Kobe Steel Ltd Treating method for cast material by hot hydrostatic press
JPH06147901A (ja) 1992-11-02 1994-05-27 Murata Mfg Co Ltd 圧電振動ジャイロ
JP3252902B2 (ja) * 1998-12-21 2002-02-04 日本電気株式会社 温度制御ユニット
JP2001308395A (ja) * 2000-04-21 2001-11-02 Matsushita Electric Ind Co Ltd 電子機器における熱エネルギー再生装置
CA3131367A1 (en) * 2019-02-25 2020-09-03 Birmingham Technologies, Inc. Nano-scale energy conversion device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060086118A1 (en) * 2004-10-22 2006-04-27 Research Triangle Insitute Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
JP2007299922A (ja) * 2006-04-28 2007-11-15 Sharp Corp 半導体装置
US20120299438A1 (en) * 2011-05-26 2012-11-29 Denso Corporation Thermionic generator
CN104103321A (zh) * 2013-04-04 2014-10-15 株式会社半导体能源研究所 脉冲发生电路及半导体装置
US20150229013A1 (en) * 2014-02-13 2015-08-13 Joseph G. Birmingham Nanofluid contact potential difference battery
JP6147901B1 (ja) * 2016-07-29 2017-06-14 株式会社Ｇｃｅインスティチュート 熱電素子及び熱電素子の製造方法

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Publication number Publication date
US20220149259A1 (en) 2022-05-12
JPWO2020184234A1 (https=) 2020-09-17
CA3131377A1 (en) 2020-09-17
WO2020184234A1 (ja) 2020-09-17
EP3940801A4 (en) 2022-12-21
EP3940801A1 (en) 2022-01-19
KR20210136076A (ko) 2021-11-16

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