CN113512222B - 一种透明聚酰亚胺导电膜 - Google Patents

一种透明聚酰亚胺导电膜 Download PDF

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CN113512222B
CN113512222B CN202110338844.7A CN202110338844A CN113512222B CN 113512222 B CN113512222 B CN 113512222B CN 202110338844 A CN202110338844 A CN 202110338844A CN 113512222 B CN113512222 B CN 113512222B
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解惠东
徐哲
邵成蒙
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Zhejiang Zhongke Jiuyuan New Material Co Ltd
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Abstract

本发明公开了一种透明聚酰亚胺导电膜,包括:透明聚酰亚胺基膜和附着在聚酰亚胺基膜表面的导电层;其中,透明聚酰亚胺基膜是由八氨基丙基笼型倍半硅氧烷、二胺单体和二酐单体原位聚合并亚胺化得到。本发明附着力好,银纳米线不易脱落,且透明性较好。

Description

一种透明聚酰亚胺导电膜
技术领域
本发明涉及导电膜技术领域,尤其涉及一种透明聚酰亚胺导电膜。
背景技术
随着柔性电子器件应用市场逐步扩张,如硅基太阳能电池、平板显示、发光二极管、可穿戴的电子器件等。氧化铟锡(Indium Tin Oxide,ITO)因其高透光度和电导率一直是透明导电膜的主要材料。但ITO固有的易脆使其不适合应用到柔性基底上。此外,金属铟价格昂贵,毒性大于铅且在地球上的储量较低等问题,需要研发一种新的材料且性能与ITO相似甚至更佳。纳米银线具有良好的导电性与透光度,可以替代ITO。但是银纳米线和基膜之间的附着力较差,容易脱落,影响导电性;且银纳米线在干燥过程中容易发生团聚,会导致导电薄膜的透明性和导电性降低。
发明内容
基于背景技术存在的技术问题,本发明提出了一种透明聚酰亚胺导电膜,本发明附着力好,银纳米线不易脱落,且透明性较好。
本发明提出了一种透明聚酰亚胺导电膜,包括:透明聚酰亚胺基膜和附着在聚酰亚胺基膜表面的导电层;其中,透明聚酰亚胺基膜是由八氨基丙基笼型倍半硅氧烷、二胺单体和二酐单体原位聚合并亚胺化得到。
优选地,二胺单体和二酐单体的摩尔比为0.99-0.995:1。
不限定上述二胺单体和二酐单体的结构,能得到透明聚酰亚胺即可。
优选地,八氨基丙基笼型倍半硅氧烷的用量为二胺单体和二酐单体总重的0.5-0.7%。
上述原位聚合的反应溶剂可以为N-甲基吡咯烷酮等。
优选地,导电层是由导电墨水涂覆在聚酰亚胺基膜表面,干燥获得;其中,导电墨水的原料按重量份包括:银纳米线0.15-0.25份、分散剂增稠助剂0.2-0.3份、胶黏剂2.5-3.5份、水100份。
优选地,胶黏剂为水溶性环氧树脂。
优选地,分散剂增稠助剂为聚乙烯吡咯烷酮和氟碳表面活性剂。
优选地,聚乙烯吡咯烷酮和氟碳表面活性剂的重量比为8-9:1-2。
优选地,干燥为热压干燥,干燥温度为140-160℃,干燥时间为30-40min。
上述水均为去离子水。
有益效果:
1.本发明选用适量的二胺单体、二酐单体、八氨基丙基笼型倍半硅氧烷原位聚合并亚胺化得到聚酰亚胺,在保持聚酰亚胺薄膜机械性能和透明性的同时,引入适量的活性氨基,涂覆导电墨水后,氨基可与银纳米线表面的离子螯合,提高银纳米线在薄膜表面的附着力,另外选用水溶性环氧树脂作为胶黏剂,环氧基团可以和薄膜中的活性氨基反应形成网络,固定银纳米线,从而大幅提高导电墨水的附着力,避免银纳米线脱落,降低方阻,保持良好的导电性;选用热压干燥的方式可以进一步提高导电墨水的附着力,并能降低方阻。
2.选用聚乙烯吡咯烷酮和氟碳表面活性剂相互配合,使得导电墨水中银纳米线均匀分布,并且在干燥过程中避免银纳米线团聚,从而提高导电薄膜的导电均匀性能;另外聚乙烯吡咯烷酮和氟碳表面活性剂相互配合还可以提高导电墨水对基膜的润湿性能,进一步提高导电墨水的粘附性能;此外氟碳表面活性剂不导电,选择合适的添加量,可以在提高粘附性和分散均匀性的同时,使得本发明保持良好的导电性能。
附图说明
图1为实施例3和对比例1的导电膜弯折500次方阻变化图。
具体实施方式
下面,通过具体实施例对本发明的技术方案进行详细说明。
实施例1
一种透明聚酰亚胺导电膜,包括:透明聚酰亚胺基膜和附着在聚酰亚胺基膜表面的导电层;
其中,在透明聚酰亚胺基膜的制备过程中,将0.1137g八氨基丙基笼型倍半硅氧烷加入60mlN-甲基吡咯烷酮中,超声分散30min后,加入0.0297mol2,2'-双(三氟甲基)-4,4'-二氨基联苯混匀,通入氮气,然后分3次加入1,2,4,5-环己烷四羧酸二酐(共0.03mol),于50℃反应8h,脱泡得到聚酰胺酸溶液;将聚酰胺酸溶液涂覆于基板表面,分别于110℃、160℃、220℃、270℃、300℃保温0.5h,冷却至室温得到透明聚酰亚胺基膜;
上述导电层是由导电墨水涂覆在聚酰亚胺基膜表面,于140℃热压干燥40min获得;其中,导电墨水的原料按重量份包括:银纳米线0.15g、聚乙烯吡咯烷酮0.16g、氟碳表面活性剂SM-FC-1000.04g、水溶性环氧树脂2.5g、水100g。
实施例2
一种透明聚酰亚胺导电膜,包括:透明聚酰亚胺基膜和附着在聚酰亚胺基膜表面的导电层;
其中,在透明聚酰亚胺基膜的制备过程中,将0.0814g八氨基丙基笼型倍半硅氧烷加入60mlN-甲基吡咯烷酮中,超声分散30min后,加入0.02985mol2,2'-双(三氟甲基)-4,4'-二氨基联苯混匀,通入氮气,然后分3次加入1,2,4,5-环己烷四羧酸二酐(共0.03mol),于50℃反应8h,脱泡得到聚酰胺酸溶液;将聚酰胺酸溶液涂覆于基板表面,分别于110℃、160℃、220℃、270℃、300℃保温0.5h,冷却至室温得到透明聚酰亚胺基膜;
上述导电层是由导电墨水涂覆在聚酰亚胺基膜表面,于160℃热压干燥30min获得;其中,导电墨水的原料按重量份包括:银纳米线0.25g、聚乙烯吡咯烷酮0.27g、氟碳表面活性剂SM-FC-100 0.03g、水溶性环氧树脂3.5g、水100g。
实施例3
一种透明聚酰亚胺导电膜,包括:透明聚酰亚胺基膜和附着在聚酰亚胺基膜表面的导电层;
其中,在透明聚酰亚胺基膜的制备过程中,将0.0976g八氨基丙基笼型倍半硅氧烷加入60mlN-甲基吡咯烷酮中,超声分散30min后,加入0.02978mol2,2'-双(三氟甲基)-4,4'-二氨基联苯混匀,通入氮气,然后分3次加入1,2,4,5-环己烷四羧酸二酐(共0.03mol),于50℃反应8h,脱泡得到聚酰胺酸溶液;将聚酰胺酸溶液涂覆于基板表面,分别于110℃、160℃、220℃、270℃、300℃保温0.5h,冷却至室温得到透明聚酰亚胺基膜;
上述导电层是由导电墨水涂覆在聚酰亚胺基膜表面,于150℃热压干燥35min获得;其中,导电墨水的原料按重量份包括:银纳米线0.2g、聚乙烯吡咯烷酮0.2g、氟碳表面活性剂SM-FC-100 0.05g、水溶性环氧树脂3g、水100g。
对比例1
不含八氨基丙基笼型倍半硅氧烷,其他同实施例3。
对比例2
将水溶性环氧树脂替换成水溶性丙烯酸酯树脂,其他同实施例3。
对比例3
将“聚乙烯吡咯烷酮0.2g、氟碳表面活性剂SM-FC-100 0.05g”替换成羟乙基纤维素0.25g,其他同实施例3。
实验1
检测1-3和对比例1-3制得的导电膜(透明聚酰亚胺基膜和导电层的厚度相同),结果如表1所示。
表1检测结果
检测项目 导电膜厚μm 500nm透光率% 附着力(百格法) 方阻Ω/□
实施例1 40 95.0 0 11.6
实施例2 41 93.6 0 10.0
实施例3 40 94.4 0 9.5
对比例1 40 96.1 3 38
对比例2 41 94.0 2 33
对比例3 40 88.9 1 50
由上表可以看出,本发明具有良好的附着力、透光率和导电性。
实验2
取实施例3和对比例1制得导电膜(透明聚酰亚胺基膜和导电层的厚度相同),在相同条件下弯折500次,每50次检测导电膜的方阻R,并与初始方阻R0比较,结果如图1所示,图1为实施例3和对比例1的导电膜弯折500次方阻变化图。
由图1可以看出本发明的基膜和导电层附着力好,银纳米线不容易脱落,经500次弯折其方阻变化较小。
以上所述,仅为本发明较佳的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,根据本发明的技术方案及其发明构思加以等同替换或改变,都应涵盖在本发明的保护范围之内。

Claims (2)

1.一种透明聚酰亚胺导电膜,其特征在于,包括:透明聚酰亚胺基膜和附着在聚酰亚胺基膜表面的导电层;其中,透明聚酰亚胺基膜是由八氨基丙基笼型倍半硅氧烷、二胺单体和二酐单体原位聚合并亚胺化得到;
二胺单体和二酐单体的摩尔比为0.99-0.995:1;
八氨基丙基笼型倍半硅氧烷的用量为二胺单体和二酐单体总重的0.5-0.7%;
导电层是由导电墨水涂覆在聚酰亚胺基膜表面,干燥获得;其中,导电墨水的原料按重量份包括:银纳米线0.15-0.25份、分散剂增稠助剂0.2-0.3份、胶黏剂2.5-3.5份、水100份;
胶黏剂为水溶性环氧树脂;分散剂增稠助剂为聚乙烯吡咯烷酮和氟碳表面活性剂SM-FC-100;
聚乙烯吡咯烷酮和氟碳表面活性剂SM-FC-100的重量比为8-9:1-2。
2.根据权利要求1所述透明聚酰亚胺导电膜,其特征在于,干燥为热压干燥,干燥温度为140-160℃,干燥时间为30-40min。
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