CN113507786A - Matte ink tin plate deposition process - Google Patents
Matte ink tin plate deposition process Download PDFInfo
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- CN113507786A CN113507786A CN202110706052.0A CN202110706052A CN113507786A CN 113507786 A CN113507786 A CN 113507786A CN 202110706052 A CN202110706052 A CN 202110706052A CN 113507786 A CN113507786 A CN 113507786A
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- pcb
- treatment
- tin
- washing
- water washing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention discloses a matte ink tin plate deposition process, which comprises the following steps: step A: firstly, baking the PCB in an oven to solidify the ink on the surface of the PCB, so that the ink can be prevented from being separated out in the tin precipitation process, and the ion pollution is reduced; and B: then carrying out surface tin deposition treatment on the PCB; and C: finally, the PCB is subjected to deionization cleaning treatment, so that ion residues on the solder resist ink layer and the tin surface can be reduced, and the content of ionic pollutants on the surface of the PCB can be effectively reduced; wherein, in the step C, 15-25 ml/l of deionization agent is added in the deionization cleaning treatment. The application provides a tin plate technology is sunk to light printing ink can improve printing ink solidification effect, reduces the separation out when sinking the tin, reduces ion pollution and reduces and prevents welding the ionic residual on ink layer and the tin face to accord with national standard, reduce the influence to the user.
Description
Technical Field
The invention relates to the technical field of PCB manufacturing, in particular to a matte ink tin plate deposition process.
Background
The tin immersion surface treatment has the advantages of low cost, difficult color change, reworking, high flatness, high copper-tin welding reliability, capability of meeting the lead-free welding requirement and the like, and along with the wide implementation of lead-free welding, the proportion of the tin immersion surface treatment in various surface treatments of PCBs is increased year by year, and the tin immersion surface treatment is more and more widely applied to automobile circuit boards with high reliability requirements. However, after the tin deposition surface treatment, the content of ionic pollutants on the board surface is higher than that of other surface treatments, and if the ionic pollutants cannot be effectively removed, the reliability of the PCB can be affected, the PCB can be disabled in serious cases, and meanwhile, the national regulations are not met, and the body health of a user is affected. Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides a matte ink tin plate deposition process, which improves the ink curing effect, reduces the precipitation during tin deposition, reduces ion pollution and reduces ion residues on a solder-proof ink layer and a tin surface so as to meet the national standard and reduce the influence on users.
According to a first aspect of the invention, there is provided a matte ink tin plate deposition process, comprising the steps of:
step A: firstly, baking the PCB in an oven to solidify the ink on the surface of the PCB, so that the ink can be prevented from being separated out in the tin precipitation process, and the ion pollution is reduced;
and B: then carrying out surface tin deposition treatment on the PCB;
and C: finally, the PCB is subjected to deionization cleaning treatment, so that ion residues on the solder resist ink layer and the tin surface can be reduced, and the content of ionic pollutants on the surface of the PCB can be effectively reduced;
wherein the content of the first and second substances,
in the step C, 15-25 ml/l of deionizing agent is added in the deionization cleaning treatment.
The matte ink tin plate deposition process disclosed by the invention at least has the following beneficial effects: the embodiment comprises the following steps: firstly, baking the PCB in an oven to solidify the ink on the surface of the PCB, so that the ink can be prevented from being separated out in the tin precipitation process, and the ion pollution is reduced; and B: then carrying out surface tin deposition treatment on the PCB; and C: finally, the PCB is subjected to deionization cleaning treatment, so that ion residues on the solder resist ink layer and the tin surface can be reduced, and the content of ionic pollutants on the surface of the PCB can be effectively reduced; wherein, in the step C, 15-25 ml/l of deionization agent is added in the deionization cleaning treatment. The application provides a tin plate technology is sunk to light printing ink can improve printing ink solidification effect, reduces the separation out when sinking the tin, reduces ion pollution and reduces and prevents welding the ionic residual on ink layer and the tin face to accord with national standard, reduce the influence to the user.
According to the matte ink tin plate deposition process of the first aspect of the invention, after the step A and before the step B, the PCB subjected to baking and curing treatment by an oven is subjected to oil removal treatment. The purpose of the degreasing treatment is to clean the PCB surface so as to ensure the tin deposition effect.
According to the matte ink tin plate deposition process of the first aspect of the invention, the PCB is subjected to micro-etching treatment after oil removal treatment. The purpose of the microetching treatment is to clean the copper surface and form a micro-concavo-convex surface to increase the bonding force.
According to the matte ink tin plate deposition process of the first aspect of the invention, the PCB is subjected to a pre-dipping treatment after the microetching treatment and before the step B. The purpose of the pre-dipping treatment is to protect the tin cylinder and avoid the pollution of the tin immersion cylinder.
According to the matte ink tin plate settling process of the first aspect of the invention, the deionized water washing treatment of the step C comprises one deionized water washing, two ultrasonic water washing and one high-pressure water washing. The purpose of one-time deionized water washing, two-time ultrasonic water washing and one-time high-pressure water washing is to further clean the board surface and reduce the ion pollution.
According to the matte ink tin plate deposition process in the first aspect of the invention, the washing time of deionized water washing in the step C is not less than 60S, wherein the deionizing agent contains 20-30% of isopropanol. The isopropanol is an organic compound, can effectively remove residues on the board surface, improves the cleaning effect and reduces the ion pollution.
According to the matte ink tin plate depositing process in the first aspect of the invention, the ultrasonic water washing power in the step C is 1200-2000W, the water washing time is 45-60S, and the treatment temperature of the deionization cleaning is 50-60 ℃. Aims to reduce ion residues on the anti-welding ink layer and effectively improve ion pollution.
According to the matte ink tin plate depositing process in the first aspect of the invention, the spraying pressure of the high-pressure water washing in the step C is 1.0-2.0 kg/cm2The plate washing time is 60-120S, and the washing temperature is 60-70 ℃. Aims to reduce ion residues of the anti-welding ink layer and effectively improveAnd (4) ion pollution.
According to the matte ink tin plate immersion process in the first aspect of the invention, deionized water washing, ultrasonic water washing and high-pressure water washing in the step C are sequentially carried out, and overflow water washing is carried out after the deionized water washing and before the first ultrasonic water washing, after the first ultrasonic water washing and before the second ultrasonic water washing, after the second ultrasonic water washing and before the high-pressure water washing and after the high-pressure water washing. The purpose of overflow washing is to ensure the cleaning effect of the PCB, improve the cleaning cleanliness and reduce the residues on the PCB surface so as to reduce the ion pollution.
According to the matte ink tin plate depositing process of the first aspect of the invention, after the step C is finished, the step D is carried out: and finally, sequentially carrying out Postdip.270K treatment and drying treatment on the PCB. The purpose of postdip.270k treatment is to protect the tin surface from contamination.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The invention is further described below with reference to the accompanying drawings and examples;
FIG. 1 is a flow chart of a matte ink tin plate deposition process;
FIG. 2 is a process flow diagram of a deionization clean.
Reference numerals:
step A S1; step B S2; step C S3; step D S4.
Detailed Description
Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1 to 2, an embodiment of the present invention provides a matte ink tin plate deposition process, including the following steps:
step A: firstly, baking the PCB in an oven to solidify the ink on the surface of the PCB, so that the ink can be prevented from being separated out in the tin precipitation process, and the ion pollution is reduced;
and B: then carrying out surface tin deposition treatment on the PCB;
and C: finally, the PCB is subjected to deionization cleaning treatment, so that ion residues on the solder resist ink layer and the tin surface can be reduced, and the content of ionic pollutants on the surface of the PCB can be effectively reduced;
wherein, in the step C, 15-25 ml/l of deionization agent is added in the deionization cleaning treatment.
It should be noted that, in step a of the present application, the baking time of the oven is preferably 1 hour, on one hand, it is avoided that the too long baking time affects the production efficiency and progress, and also results in difficulty in cleaning the board surface of the pre-processed panel, and on the other hand, it is avoided that the insufficient baking time causes low board surface curing quality and affects the subsequent tin deposition process.
It should be noted that, in step a of the present application, the temperature of the oven is preferably 150 ℃, on one hand, it is avoided that the plate edge is exploded due to too high temperature, which affects the product quality and increases the loss, and on the other hand, it is avoided that the production efficiency and the progress are affected due to too long time of the oven caused by insufficient temperature.
Preferably, after the step a and before the step B, the method further includes performing an oil removing treatment on the PCB after the curing treatment by baking in an oven, and the purpose of the oil removing treatment is to clean the board surface so as to ensure the tin deposition effect.
Preferably, after the PCB board is finished with the baking process and before the oil removal treatment, the board inspection process is performed on the baked PCB board to prevent the defective product from entering the subsequent process treatment, which affects the product quality.
Preferably, the PCB board is subjected to a degreasing process followed by a microetching process for the purpose of cleaning the copper surface and forming a micro concavo-convex surface to increase the bonding force.
Preferably, the PCB board is gone into after the deoiling is handled, before carrying out the microetching and handling, need through the washing processing, the preferred tertiary washing of this application, and the microetching of PCB board is handled for wasing the residue of deoiling back PCB board face, avoids influencing the PCB board is handled, helps improving heavy tin quality and effect.
Preferably, the PCB is pre-dipped after the microetching treatment and before the step B, in order to protect the tin cylinder and avoid the contamination of the tin cylinder.
Preferably, after the PCB is subjected to microetching treatment and before the PCB is subjected to presoaking treatment, the PCB needs to be subjected to water washing treatment and inspection, and three-level water washing is preferably adopted in the application, so that residues on the surface of the PCB after the microetching treatment are cleaned, and the improvement of the tin deposition quality and effect is facilitated.
Preferably, after the PCB is subjected to the tin immersion procedure and before the PCB is subjected to deionized washing, the PCB is subjected to post tin immersion treatment and multiple times of washing treatment in sequence, wherein the purpose of post tin immersion treatment is to perform tin immersion on the surface of the PCB uniformly, and the tin immersion quality is improved. A lot of washing processing in this step of this application preferred is washing and twice tertiary washing in proper order, and its purpose is the PCB board after preliminary washing heavy tin processing, helps improving subsequent deionization and washes the cleaning performance. It should be noted that after the water washing and before the deionization washing, the PCB still needs to be inspected to remove the defective products, thereby improving the product quality.
As shown in fig. 2, according to some embodiments of the present application, a detailed cleaning procedure is provided with respect to step C deionization washing: plate entering → hot water washing → deionized water washing → overflow water washing → 2 → ultrasonic water washing → overflow water washing → high pressure water washing → overflow water washing → clear water washing → strong wind and 3 hot air drying → cold air blowing → plate collection.
In the present application, the cleaning time of the deionization washing is preferably not less than 60S, and the cleaning time of the deionization washing is preferably 60S to 120S in order to prevent excessive residue on the plate surface.
The deionization agent contains 20-30% of isopropanol, so that residues on the board surface can be effectively removed, the cleaning effect is improved, and ion pollution is reduced.
Preferably, in the step C, before deionized water washing, the PCB is first hot water washed, so as to perform a pre-washing treatment on the PCB surface before deionized water washing, thereby preventing contamination of the ion washing tank.
As shown in fig. 2, the deionization cleaning process of step C includes one deionized water wash, two ultrasonic water washes, and one high pressure water wash, which are used to further clean the board surface and reduce the ion contamination.
It should be noted that the ultrasonic washing power in step C is 1200-2000W, the washing time is 45-60S, and the treatment temperature of the deionization cleaning is 50-60 ℃, so as to reduce the ionic residues on the anti-welding ink layer and effectively improve the ionic contamination.
The spraying pressure of the high-pressure water washing in the step C is 1.0-2.0 kg/cm2The plate washing time is 60-120S, the washing temperature is 60-70 ℃, and the purpose is to reduce the ion residues of the anti-welding ink layer and effectively improve the ion pollution.
Preferably, the deionized water washing, the ultrasonic water washing and the high-pressure water washing in the step C are sequentially performed, and the overflow water washing is performed after the deionized water washing and before the first ultrasonic water washing, after the first ultrasonic water washing and before the second ultrasonic water washing, after the second ultrasonic water washing and before the high-pressure water washing and after the high-pressure water washing. The purpose of overflow washing is to ensure the cleaning effect of the PCB, improve the cleaning cleanliness and reduce the residues on the PCB surface so as to reduce the ion pollution.
Note that, the number of times of overflow water washing is not limited in the present application, and the present application preferably:
after deionized water washing, before first ultrasonic washing, after the first ultrasonic washing and before second ultrasonic washing, the PCB needs to be subjected to twice overflow washing;
after the second ultrasonic washing, before the high-pressure washing and after the high-pressure washing, the PCB needs to be subjected to primary overflow washing.
Preferably, after the high-pressure water washing, the PCB is subjected to postdip.270k treatment after one-time overflow water washing, which aims to protect the tin surface from being polluted. And after the Postdip.270K treatment is finished, washing the PCB with water, wherein three-level washing is preferred in the application.
As shown in fig. 1 and fig. 2, after the postdip.270k treatment is finished, the PCB board is subjected to a drying treatment, wherein the drying treatment includes strong wind drying and cold wind cooling in sequence.
It should be noted that, in the present application, it is preferable that the strong wind in the process is hot wind, and three times of strong hot wind drying are required to ensure the drying effect of the substrate.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. The matte ink tin plate deposition process is characterized by comprising the following steps:
step A: firstly, baking the PCB in an oven to solidify the ink on the surface of the PCB, so that the ink can be prevented from being separated out in the tin precipitation process, and the ion pollution is reduced;
and B: then carrying out surface tin deposition treatment on the PCB;
and C: finally, the PCB is subjected to deionization cleaning treatment, so that ion residues on the solder resist ink layer and the tin surface can be reduced, and the content of ionic pollutants on the surface of the PCB can be effectively reduced;
wherein the content of the first and second substances,
and in the step C, 15-25 ml/l of deionizing agent is added in the deionization cleaning treatment.
2. The matte ink tin plate process according to claim 1, characterized in that: and after the step A and before the step A, the PCB subjected to baking and curing treatment by an oven is subjected to oil removal treatment.
3. The matte ink tin plate process according to claim 2, characterized in that: and (4) carrying out micro-etching treatment on the PCB after the oil removal treatment.
4. The matte ink tin plate process according to claim 3, characterized in that: and B, performing pre-dipping treatment on the PCB after the micro-etching treatment and before the step B.
5. The matte ink tin plate process according to claim 1, characterized in that: and the deionized water cleaning treatment in the step C comprises one-time deionized water cleaning, two-time ultrasonic water cleaning and one-time high-pressure water cleaning.
6. The matte ink tin plate process according to claim 5, wherein: and C, washing with deionized water in the step C for not less than 60S, wherein the deionizing agent contains 20-30% of isopropanol.
7. The matte ink tin plate process according to claim 5, wherein: and C, the power of ultrasonic washing in the step C is 1200-2000W, the washing time is 45-60S, and the treatment temperature of deionization washing is 50-60 ℃.
8. The matte ink tin plate process according to claim 5, wherein: the spraying pressure of the high-pressure water washing in the step C is 1.0-2.0 kg/cm2The plate washing time is 60-120S, and the washing temperature is 60-70 ℃.
9. The matte ink tin plate process according to claim 5, wherein: and D, sequentially performing deionized water washing, ultrasonic water washing and high-pressure water washing in the step C, wherein the steps of performing overflow water washing are arranged before the deionized water washing and the first ultrasonic water washing, after the first ultrasonic water washing and the second ultrasonic water washing, after the second ultrasonic water washing and the high-pressure water washing and after the high-pressure water washing.
10. The matte ink tin plate process according to claim 1, characterized in that: after the step C is finished, the step D is carried out: and finally, sequentially carrying out Postdip.270K treatment and drying treatment on the PCB.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110706052.0A CN113507786A (en) | 2021-06-24 | 2021-06-24 | Matte ink tin plate deposition process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110706052.0A CN113507786A (en) | 2021-06-24 | 2021-06-24 | Matte ink tin plate deposition process |
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| CN113507786A true CN113507786A (en) | 2021-10-15 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007116077A (en) * | 2005-09-26 | 2007-05-10 | Hitachi Chem Co Ltd | Pretreatment of copper surface and wiring substrate using the same |
| CN108012438A (en) * | 2017-11-24 | 2018-05-08 | 江门市奔力达电路有限公司 | A kind of pcb board ink cleaning |
| CN109302809A (en) * | 2017-07-25 | 2019-02-01 | 王家富 | A kind of printed circuit board surface treatment process |
| CN109661115A (en) * | 2018-11-27 | 2019-04-19 | 广东创辉鑫材科技股份有限公司东莞分公司 | A method of it reducing heavy tin ion and pollutes content |
| CN109769346A (en) * | 2019-01-02 | 2019-05-17 | 江门荣信电路板有限公司 | A kind of manufacturing process using horizontal heavy tin production pcb board |
-
2021
- 2021-06-24 CN CN202110706052.0A patent/CN113507786A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007116077A (en) * | 2005-09-26 | 2007-05-10 | Hitachi Chem Co Ltd | Pretreatment of copper surface and wiring substrate using the same |
| CN109302809A (en) * | 2017-07-25 | 2019-02-01 | 王家富 | A kind of printed circuit board surface treatment process |
| CN108012438A (en) * | 2017-11-24 | 2018-05-08 | 江门市奔力达电路有限公司 | A kind of pcb board ink cleaning |
| CN109661115A (en) * | 2018-11-27 | 2019-04-19 | 广东创辉鑫材科技股份有限公司东莞分公司 | A method of it reducing heavy tin ion and pollutes content |
| CN109769346A (en) * | 2019-01-02 | 2019-05-17 | 江门荣信电路板有限公司 | A kind of manufacturing process using horizontal heavy tin production pcb board |
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Application publication date: 20211015 |
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