CN109769346A - A kind of manufacturing process using horizontal heavy tin production pcb board - Google Patents
A kind of manufacturing process using horizontal heavy tin production pcb board Download PDFInfo
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- CN109769346A CN109769346A CN201910000716.4A CN201910000716A CN109769346A CN 109769346 A CN109769346 A CN 109769346A CN 201910000716 A CN201910000716 A CN 201910000716A CN 109769346 A CN109769346 A CN 109769346A
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- pcb board
- tin
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Abstract
The invention discloses a kind of manufacturing process using horizontal heavy tin production pcb board, including, it executes manufacturing process: pcb board being made to pass through horizontally disposed each tin cylinder；When executing manufacturing process, the following steps are executed: UV curing process is carried out to pcb board；Pre-preg is carried out to each tin cylinder；Heavy tin surfaces processing is carried out to pcb board.Compared to traditional technology, step of the present invention is clearly easy, by handling pcb board and tin cylinder, the pcb board of standard stabiliser can be obtained, and using the heavy tin of horizontally disposed tin cylinder, is conducive to promote pcb board production quality.
Description
Technical field
The present invention relates to PCB manufacturing field, especially a kind of manufacturing process using horizontal heavy tin production pcb board.
Background technique
Heavy tin is a kind of significant surfaces treatment process of circuit board, has irreplaceable role in pcb board production field.
Currently, most of factories are easy to produce liquid medicine mark when changing cylinder, since it remains in cylinder using vertical heavy tin production line
On, it is not easy to it takes off, therefore influences whether the quality of pcb board when executing heavy tin to pcb board.
Summary of the invention
To solve the above-mentioned problems, the object of the present invention is to provide a kind of manufacture works using horizontal heavy tin production pcb board
Skill generates liquid medicine mark when can prevent from changing cylinder using horizontally disposed tin cylinder heavy tin, is conducive to promote pcb board production quality.
In order to make up for the deficiencies of the prior art, technical solution used in the embodiment of the present invention is:
A kind of manufacturing process using horizontal heavy tin production pcb board, including, it executes manufacturing process: pcb board being made to pass through level
Each tin cylinder being arranged；When executing manufacturing process, the following steps are executed:
UV curing process is carried out to pcb board；
Pre-preg is carried out to each tin cylinder；
Heavy tin surfaces processing is carried out to pcb board.
Further, pre-preg is carried out to each tin cylinder, comprising:
To each tin cylinder successively carry out water knife embathe, overflow washing and dirt removal；
Each tin cylinder progress ultrasonic wave is embathed, any number of processing in high-pressure washing and overflow washing, repeats n times；The N
For positive integer.
Further, the value of the N is 1-3.
Further, heavy tin surfaces processing is carried out to pcb board, comprising:
Heavy tin processing is carried out to pcb board；
Pcb board after heavy tin is successively embathed and is dried.
Further, the pcb board after heavy tin is successively embathed and is dried, wherein embathing includes: successively to carry out
Deionization is washed, hot water is embathed and washed with ultrasonic heat.
Further, the pcb board after heavy tin is successively embathed and is dried, wherein being dried includes blotting
Processing and drying processing.
Further, UV curing process is being carried out to pcb board and each tin cylinder is being carried out between pre-preg, further including step
It is rapid: blasting treatment is carried out to pcb board.
Further, the transmission speed of pcb board is 1.1-1.4m/min when the tin surfaces that sink are handled.
Further, the quantity of the tin cylinder is at least 11.
The one or more technical solutions provided in the embodiment of the present invention at least have the following beneficial effects: using horizontal
The heavy tin of the tin cylinder of setting makes pcb board by horizontally disposed each tin cylinder, generates liquid medicine mark when can prevent from changing cylinder, be conducive to mention
It rises pcb board and produces quality；Meanwhile it being convenient to UV curing process is carried out to pcb board with reducing pcb board surface ion pollutant
Subsequent heavy tin operation, and pre-preg is carried out to each tin cylinder, to guarantee tin cylinder without miscellaneous pure, so that heavy tin effect can be more preferable, most
Afterwards by carrying out heavy tin surfaces processing to pcb board, it can be achieved that heavy tin and its subsequent processing, so that the PCB of standard stabiliser can be obtained
Plate.Therefore, step of the present invention is clearly easy, and by handling pcb board and tin cylinder, the pcb board of standard stabiliser can be obtained, and
And using the heavy tin of horizontally disposed tin cylinder, be conducive to promote pcb board production quality.
Detailed description of the invention
Present pre-ferred embodiments are provided, with reference to the accompanying drawing with the embodiment that the present invention will be described in detail.
Fig. 1 is the step flow diagram of the embodiment of the present invention.
Specific embodiment
Referring to Fig.1, the embodiment provides a kind of manufacturing process using horizontal heavy tin production pcb board, including,
It executes manufacturing process: pcb board being made to pass through horizontally disposed each tin cylinder；When executing manufacturing process, the following steps are executed:
UV curing process is carried out to pcb board；
Pre-preg is carried out to each tin cylinder；
Heavy tin surfaces processing is carried out to pcb board.
In the present embodiment, UV solidification be ultra-violet curing, wherein UV is the english abbreviation of ultraviolet light, solidification refer to substance from
Low molecule is changed into high molecular process, and UV solidifies coating (paint), the ink, gluing for generally referring to need with ultraviolet curing
The condition of cure or requirement of agent (glue) or other encapsulating sealants；Using the heavy tin of horizontally disposed tin cylinder, pcb board is made to pass through water
Each tin cylinder of flat setting generates liquid medicine mark when can prevent from changing cylinder, is conducive to promote pcb board production quality；Meanwhile to PCB
Plate carries out UV curing process, to reduce pcb board surface ion pollutant, is convenient to subsequent heavy tin operation, and carry out to each tin cylinder
Pre-preg, to guarantee that tin cylinder without miscellaneous pure, so that heavy tin effect can be more preferable, carry out at heavy tin surfaces finally by pcb board
Reason is, it can be achieved that heavy tin and its subsequent processing, so that the pcb board of standard stabiliser can be obtained.Therefore, step of the present invention is clearly easy,
By handling pcb board and tin cylinder, the pcb board of standard stabiliser can be obtained, and using the heavy tin of horizontally disposed tin cylinder, have
Quality is produced conducive to pcb board is promoted.
Further, another embodiment of the present invention additionally provides a kind of manufacture work using horizontal heavy tin production pcb board
Skill, wherein pre-preg is carried out to each tin cylinder, comprising:
To each tin cylinder successively carry out water knife embathe, overflow washing and dirt removal；
Each tin cylinder progress ultrasonic wave is embathed, any number of processing in high-pressure washing and overflow washing, repeats n times；The N
For positive integer.
In the present embodiment, two sections are divided into embathing for tin cylinder, the last period is successively to carry out water knife to each tin cylinder to embathe, overflow
Flowing water is washed and dirt removal, it is therefore an objective to realization slightly wash, first slightly larger dirt on tin cylinder is got rid of, wherein water knife embathe for from
Impurity and pollutant are leached on tin cylinder, overflow is washed for washing away impurity and pollutant, later again will be above-mentioned miscellaneous by dirt removal
Matter and pollutant wash out, and can achieve the goal；Latter section is then realized carefully washing to tin cylinder, can be embathed in ultrasonic wave, high pressure water
It washes with arbitrarily being selected in overflow washing and carries out, repeatable n times are set when all having good cleaning function, and carefully washing,
It can carry out repeatedly carefully washing, this is conducive to the physical property for promoting tin cylinder, so as to more stably heavy tin；Wherein, high pressure
Washing, which refers to, is forced into hundreds of atmospheric pressure or more for water by high pressure water generating device, then passes through the injection with tiny aperture
Device is converted to the fine water jet of high speed, is a kind of industrial common technology.
Further, another embodiment of the present invention additionally provides a kind of manufacture work using horizontal heavy tin production pcb board
Skill, wherein the value of the N is 1-3.In the present embodiment, it is at least repeated once carefully to wash and be necessary, while in order to produce
Cost consideration, repeated washing number are preferably more than 3 times, this is that have actual production according to obtained from the experience of inventor
Meaning.
Further, another embodiment of the present invention additionally provides a kind of manufacture work using horizontal heavy tin production pcb board
Skill, wherein heavy tin surfaces processing is carried out to pcb board, comprising:
Heavy tin processing is carried out to pcb board；
Pcb board after heavy tin is successively embathed and is dried.
In the present embodiment, it is being sunk after tin to pcb board, then it is successively embathed and be dried, the secondary leaching
The purpose washed is the attachment and pollutant for removing PCB surface, achievees the purpose that cleaning purification, the purpose of drying process is to leaching
Pcb board after washing carries out reprocessing, to reach finished product level.
Further, another embodiment of the present invention additionally provides a kind of manufacture work using horizontal heavy tin production pcb board
Skill, wherein the pcb board after heavy tin is successively embathed and is dried, wherein embathe include: successively carry out deionization wash,
Hot water is embathed to be washed with ultrasonic heat.
In the present embodiment, the ionic species except pcb board surface are washed away using deionization first, is then embathed using hot water
Impurity substances are precipitated, are finally washed ionic species and impurity substances using ultrasonic wave, it is very convenient effective；Wherein,
The temperature of hot water can be between 50 to 100 DEG C.
Further, another embodiment of the present invention additionally provides a kind of manufacture work using horizontal heavy tin production pcb board
Skill, wherein the pcb board after heavy tin is successively embathed and is dried, wherein being dried includes blotting processing and drying
Processing.
In the present embodiment, blotting can be carried out with air filter, and succinct convenient, drying can be carried out according to situation,
Usually: the drying of first high wind, then hot blast drying, last cold wind drying, the purpose arranged in this way be make the rate of drying of pcb board by
Near slow, meet the approach principle of technique, and high wind and hot blast drying setting step in front, can finally be dried up by cold wind
Come reduce temperature brought by high wind and hot blast drying increase, can play the role of protect pcb board, prevent its heat up it is excessively high and by
To damage.
Further, another embodiment of the present invention additionally provides a kind of manufacture work using horizontal heavy tin production pcb board
Skill, wherein UV curing process is being carried out to pcb board and each tin cylinder further comprise the steps of: between pre-preg to PCB
Plate carries out blasting treatment.In the present embodiment, to pcb board carry out blasting treatment, be in order to obtain more good heavy tin effect,
It is realized and applying a certain pressure to pcb board, applies stressed ranging preferably from 30-40ps i.
Further, another embodiment of the present invention additionally provides a kind of manufacture work using horizontal heavy tin production pcb board
Skill, wherein the transmission speed of pcb board is 1.1-1.4m/min when heavy tin surfaces processing.In the present embodiment, it is heavy suitably to reduce
(traditional is general in 2m/min or more), can be more orderly reasonably to pcb board for the transmission speed of pcb board when tin surfaces processing
Carry out heavy tin surfaces processing.
Further, another embodiment of the present invention additionally provides a kind of manufacture work using horizontal heavy tin production pcb board
Skill, wherein the quantity of the tin cylinder is at least 11.It in the present embodiment, can be good when the quantity of the tin cylinder is 11
Primary heavy tin process with several pcb boards, according to inventor's experience, such heavy solder will not seem too long, but can also take
Greater than 11, to be at this time to extend heavy solder, the whole effect or identical realized.
Presently preferred embodiments of the present invention and basic principle is discussed in detail in the above content, but the invention is not limited to
Above embodiment, those skilled in the art should be recognized that also have on the premise of without prejudice to spirit of the invention it is various
Equivalent variations and replacement, these equivalent variations and replacement all fall within the protetion scope of the claimed invention.
Claims (9)
1. a kind of manufacturing process using horizontal heavy tin production pcb board, which is characterized in that including executing manufacturing process: making PCB
Plate passes through horizontally disposed each tin cylinder；When executing manufacturing process, the following steps are executed:
UV curing process is carried out to pcb board；
Pre-preg is carried out to each tin cylinder；
Heavy tin surfaces processing is carried out to pcb board.
2. a kind of manufacturing process using horizontal heavy tin production pcb board according to claim 1, which is characterized in that each
Tin cylinder carries out pre-preg, comprising:
To each tin cylinder successively carry out water knife embathe, overflow washing and dirt removal；
Each tin cylinder progress ultrasonic wave is embathed, any number of processing in high-pressure washing and overflow washing, repeats n times；The N is positive
Integer.
3. a kind of manufacturing process using horizontal heavy tin production pcb board according to claim 2, which is characterized in that the N
Value be 1-3.
4. a kind of manufacturing process using horizontal heavy tin production pcb board according to claim 1, which is characterized in that PCB
Plate carries out heavy tin surfaces processing, comprising:
Heavy tin processing is carried out to pcb board；
Pcb board after heavy tin is successively embathed and is dried.
5. a kind of manufacturing process using horizontal heavy tin production pcb board according to claim 4, which is characterized in that heavy
Pcb board after tin is successively embathed and is dried, wherein embathing includes: that deionization is washed, hot water embathes and surpasses for successively progress
Sound wave hot water wash.
6. a kind of manufacturing process using horizontal heavy tin production pcb board according to claim 4, which is characterized in that heavy
Pcb board after tin is successively embathed and is dried, wherein being dried includes blotting processing and drying processing.
7. a kind of manufacturing process using horizontal heavy tin production pcb board according to claim 1, which is characterized in that right
Pcb board carries out UV curing process and further comprise the steps of: between pre-preg and carry out at sandblasting pcb board to each tin cylinder
Reason.
8. a kind of manufacturing process using horizontal heavy tin production pcb board according to claim 1, which is characterized in that heavy tin
The transmission speed of pcb board is 1.1-1.4m/min when surface treatment.
9. a kind of -8 any manufacturing process using horizontal heavy tin production pcb board, feature exist according to claim 1
In the quantity of the tin cylinder is at least 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910000716.4A CN109769346A (en) | 2019-01-02 | 2019-01-02 | A kind of manufacturing process using horizontal heavy tin production pcb board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910000716.4A CN109769346A (en) | 2019-01-02 | 2019-01-02 | A kind of manufacturing process using horizontal heavy tin production pcb board |
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| CN109769346A true CN109769346A (en) | 2019-05-17 |
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| CN201910000716.4A Pending CN109769346A (en) | 2019-01-02 | 2019-01-02 | A kind of manufacturing process using horizontal heavy tin production pcb board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113507786A (en) * | 2021-06-24 | 2021-10-15 | 东莞泰山电子有限公司 | Matte ink tin plate deposition process |
| CN117896914A (en) * | 2024-03-18 | 2024-04-16 | 江苏上达半导体有限公司 | Surface treatment method of copper-clad printed circuit board |
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| US20040055503A1 (en) * | 2002-09-23 | 2004-03-25 | Hasan Syed M. | Method and solution for treating fluorocarbon surfaces |
| CN101951727A (en) * | 2010-09-10 | 2011-01-19 | 广东依顿电子科技股份有限公司 | Method for producing electroplated board edge of circuit board |
| CN106686904A (en) * | 2017-02-15 | 2017-05-17 | 深圳市景旺电子股份有限公司 | Method for reducing ionic contaminants of PCB after tin deposition surface treatment |
| CN207369430U (en) * | 2017-08-29 | 2018-05-15 | 红板（江西）有限公司 | A kind of full-automatic circuit board leveling sinks copper connecting lines VCP electroplanting devices |
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2019
- 2019-01-02 CN CN201910000716.4A patent/CN109769346A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040055503A1 (en) * | 2002-09-23 | 2004-03-25 | Hasan Syed M. | Method and solution for treating fluorocarbon surfaces |
| CN101951727A (en) * | 2010-09-10 | 2011-01-19 | 广东依顿电子科技股份有限公司 | Method for producing electroplated board edge of circuit board |
| CN106686904A (en) * | 2017-02-15 | 2017-05-17 | 深圳市景旺电子股份有限公司 | Method for reducing ionic contaminants of PCB after tin deposition surface treatment |
| CN207369430U (en) * | 2017-08-29 | 2018-05-15 | 红板（江西）有限公司 | A kind of full-automatic circuit board leveling sinks copper connecting lines VCP electroplanting devices |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113507786A (en) * | 2021-06-24 | 2021-10-15 | 东莞泰山电子有限公司 | Matte ink tin plate deposition process |
| CN117896914A (en) * | 2024-03-18 | 2024-04-16 | 江苏上达半导体有限公司 | Surface treatment method of copper-clad printed circuit board |
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