CN105188272A - Hot air leveling surface treatment method on PCB - Google Patents
Hot air leveling surface treatment method on PCB Download PDFInfo
- Publication number
- CN105188272A CN105188272A CN201510649077.6A CN201510649077A CN105188272A CN 105188272 A CN105188272 A CN 105188272A CN 201510649077 A CN201510649077 A CN 201510649077A CN 105188272 A CN105188272 A CN 105188272A
- Authority
- CN
- China
- Prior art keywords
- pcb
- tin
- spray tin
- spray
- solder mask
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the circuit board production technical field, concretely to a hot air leveling surface treatment method on a PCB. The method includes employing ultraviolet to irradiate a solder-resist layer before copper surface treatment so as to more thoroughly polymerize and solidify the solder-resist printing ink in the solder-resist layer, thereby reducing external moisture absorption of the solder-resist layer, and mitigating the watermarking problem which constantly afflicts technical personnel in hot air leveling surface treatment. Accordingly, the method can reduce the step of arranging a baking sheet, shorten a production flow, increase production efficiency, and avoid PCB smearing rejection caused by transportation in arranging a baking sheet. The improved hot air leveling surface treatment method increases the watermarking treatment efficiency to 98% from 80%.
Description
Technical field
The present invention relates to board production technical field, particularly relate to a kind of method doing the process of spray tin surfaces on PCB.
Background technology
Spray tin is also known as hot air leveling (HotAirLeveling), that the production plate having done solder mask is immersed in the solder of melting, then by hot blast, the excess solder produced in plate surface and plated-through hole is blown off, thus obtain a solder-coated layer that is level and smooth, evenly light.But (there is plumbous spray tin: 235 ± 5 DEG C, 3-5sec because solder temperature in tin spray process is higher; Lead-free tin spray: 270 ± 5 DEG C, 3-5sec), produce plate after the process of spray tin, very easily there is watermark problem in solder mask surface, affects the outward appearance of PCB.The method of existing process watermark is fallen by the water evaporation in production plate by the method for bay baking sheet after spray tin, and the temperature of baking sheet is generally 150 DEG C, and the baking sheet time is generally 30min, the watermark issue handling efficiency about 80% of the method.Owing to adding the flow process of bay baking sheet, have impact on production efficiency.Further, in handling process, produce plate easily by wiping flower, affect the quality of PCB.
Summary of the invention
The present invention is directed to existing tin spray process easily makes the solder mask of production plate surface occur the problem of watermark, provide a kind of significantly can reduce spray tin after produce the spray tin surfaces processing method that watermark problem appears in plate surface.
For achieving the above object, the present invention by the following technical solutions.
A kind of method doing the process of spray tin surfaces on PCB, the surface of described PCB makes solder mask, described method comprises copper face treatment step, spray tin step, cooling step and rear cleaning step successively, and also comprise solder mask and reinforce step before copper face treatment step, described solder mask is reinforced step and is: with the solder mask on UV-irradiation PCB.
Preferably, the energy of described ultraviolet light is 1400mJ/cm
2, described PCB through the speed of ultraviolet light be 2.5m/min.
Described spray tin step comprises vertical spray tin flow process and hot blast cutter tin scraping flow process successively.
Preferably, carry out lead-free tin spray in described vertical spray tin flow process, the wicking time is 5s, and tin furnace temperature is 270 DEG C; Or preferred, carry out there is plumbous spray tin in described vertical spray tin flow process, the wicking time is 5s, and tin furnace temperature is 235 DEG C.
Preferably, in described hot blast cutter tin scraping flow process, air knife blow air temperature is 370 DEG C, and air knife air pressure is 3.5kg/cm
2, blow-time is 2s.
Preferably, the copper face in described copper face treatment step on microetch PCB, described microetch amount is 1.2 μm.
Preferably, in described copper face treatment step, in micro-corrosion liquid, the volumetric concentration of sulfuric acid is 4%, and the concentration of sodium peroxydisulfate is 100g/L, and microetch temperature is 30 DEG C, PCB with the speed of 2.5m/min through micro-corrosion liquid.
Preferably, in described cooling step, the time of cooling is 20-30s.
Compared with prior art, the invention has the beneficial effects as follows: spray tin surfaces treatment process of the present invention by using UV-irradiation solder mask before copper face treatment step, thus make the solder mask more thoroughly polymerizing curable in solder mask, reduce solder mask thus to the absorption of secondary water vapour, thus improve the watermark problem that always annoying technical staff in the process of spray tin surfaces, therefore bay baking sheet step can be reduced, shorten production procedure, enhance productivity, and carrying in bay baking sheet process can be avoided to cause PCB wiping to spend problems such as scrapping.Watermark issue handling efficiency, by optimizing the technological process of spray tin surfaces process, has been brought up to 98% by 80% of prior art by the present invention.
Embodiment
In order to understand technology contents of the present invention more fully, below in conjunction with specific embodiment, technical scheme of the present invention being described further and being illustrated.
Embodiment 1
The present embodiment provides a kind of on PCB, does lead-free tin spray surface-treated method, comprises solder mask successively and reinforces step, copper face treatment step, spray tin step, cooling step and rear cleaning step.PCB in the present embodiment has made outer-layer circuit and solder mask according to prior art, and the detailed process of lead-free tin spray is as follows:
First on existing general spray tin production line, a UV machine is installed, makes PCB can cross machine by disposable line.PCB is placed on spray tin production line, PCB with transmission equipment successively through the solder mask of production line reinforce section, copper face processing section, spray tin section, cooling section and after cleaning section, carry out solder mask reinforcing, copper face process, spray tin, cooling and rear matting successively.
(1) solder mask is reinforced
The energy of the ultraviolet light of UV machine is set to 1400mJ/cm
2, PCB through UV machine, makes the solder mask on UV-irradiation PCB with the speed of 2.5m/min, thus makes the solder mask more thoroughly polymerizing curable in solder mask, reduces solder mask thus to the absorption of secondary water vapour.
(2) copper face process
Removed the organic pollution be attached on copper face by microetch copper face, make real the cleaning of copper face, in rear operation, copper face effectively can contact with melting tin, generates IMC rapidly.Microetch amount is 1.2 μm, and in micro-corrosion liquid, the volumetric concentration of sulfuric acid is 4%, and the concentration of sodium peroxydisulfate is 100g/L, and microetch temperature is 30 DEG C, PCB with the speed of 2.5m/min through micro-corrosion liquid.
Then, according to prior art successively preheating PCB and apply solder resist on PCB.
(3) tin is sprayed
Vertical lead-free tin spray: the wicking time is 5s, tin furnace temperature is 270 DEG C.
Hot blast cutter tin scraping: air knife blow air temperature is 370 DEG C, and air knife air pressure is 3.5kg/cm
2, blow-time is 2s.
(4) cooling and rear cleaning
First blow from bottom to top on the air-bed of about 1.8 meters with cold wind, and floated in plate face, lower surface first cools, and continues to blow from top to bottom at about 1.2 meters of runner supporting region cold wind, and the time of cooling is 20-30s.
The concrete parameter of each workshop section is as shown in the table.
Embodiment 2
The present embodiment provides a kind of method being made with the process of plumbous spray tin surfaces on PCB, comprises solder mask successively and reinforces step, copper face treatment step, spray tin step, cooling step and rear cleaning step.PCB in the present embodiment has made outer-layer circuit and solder mask according to prior art, and the process of detailed process and the embodiment 1 of spray tin is basically identical, and difference is: carry out in Pen Xi workshop section having and plumbously spray tin, the temperature of tin stove is 235 DEG C.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by protection of the present invention.
Claims (9)
1. one kind is done the method for spray tin surfaces process on PCB, the surface of described PCB makes solder mask, described method comprises copper face treatment step, spray tin step, cooling step and rear cleaning step successively, it is characterized in that, before copper face treatment step, also comprise solder mask reinforce step, described solder mask is reinforced step and is: with the solder mask on UV-irradiation PCB.
2. a kind of method doing spray tin surfaces process on PCB according to claim 1, it is characterized in that, the energy of described ultraviolet light is 1400mJ/cm
2, described PCB through the speed of ultraviolet light be 2.5m/min.
3. a kind of method doing spray tin surfaces process on PCB according to claim 1, it is characterized in that, described spray tin step comprises vertical spray tin flow process and hot blast cutter tin scraping flow process successively.
4. a kind of method doing spray tin surfaces process on PCB according to claim 3, it is characterized in that, carry out lead-free tin spray in described vertical spray tin flow process, the wicking time is 5s, and tin furnace temperature is 270 DEG C.
5. a kind of method doing spray tin surfaces process on PCB according to claim 3, it is characterized in that, carry out there is plumbous spray tin in described vertical spray tin flow process, the wicking time is 5s, and tin furnace temperature is 235 DEG C.
6. a kind of method doing spray tin surfaces process on PCB according to claim 3, it is characterized in that, in described hot blast cutter tin scraping flow process, air knife blow air temperature is 370 DEG C, and air knife air pressure is 3.5kg/cm
2, blow-time is 2s.
7. a kind of method doing spray tin surfaces process on PCB according to claim 1, it is characterized in that, the copper face in described copper face treatment step on microetch PCB, described microetch amount is 1.2 μm.
8. a kind of method doing spray tin surfaces process on PCB according to claim 7, is characterized in that, in described copper face treatment step, in micro-corrosion liquid, the volumetric concentration of sulfuric acid is 4%, the concentration of sodium peroxydisulfate is 100g/L, and microetch temperature is 30 DEG C, PCB with the speed of 2.5m/min through micro-corrosion liquid.
9. a kind of method doing spray tin surfaces process on PCB according to claim 1, it is characterized in that, in described cooling step, the time of cooling is 20-30s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510649077.6A CN105188272A (en) | 2015-10-08 | 2015-10-08 | Hot air leveling surface treatment method on PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510649077.6A CN105188272A (en) | 2015-10-08 | 2015-10-08 | Hot air leveling surface treatment method on PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105188272A true CN105188272A (en) | 2015-12-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510649077.6A Pending CN105188272A (en) | 2015-10-08 | 2015-10-08 | Hot air leveling surface treatment method on PCB |
Country Status (1)
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| CN (1) | CN105188272A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106658984A (en) * | 2016-10-27 | 2017-05-10 | 江门崇达电路技术有限公司 | Process and device for eliminating water stains appearing after tin sprayed plate washing |
| CN106686904A (en) * | 2017-02-15 | 2017-05-17 | 深圳市景旺电子股份有限公司 | Method for reducing ionic contaminants of PCB after tin deposition surface treatment |
| CN107580424A (en) * | 2017-08-30 | 2018-01-12 | 奥士康精密电路（惠州）有限公司 | LED circuit board sprays tin thickness and the optimization method of flatness |
| CN107835584A (en) * | 2017-10-27 | 2018-03-23 | 遂宁市力源印制电路板有限公司 | Quickly spray tin method in the surface of wiring board |
| CN107994106A (en) * | 2017-08-02 | 2018-05-04 | 宏齐光电子(深圳)有限公司 | A kind of LED encapsulation PCB substrate for spraying tin and its spray tin surfaces processing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001111215A (en) * | 1999-10-12 | 2001-04-20 | Nippon Circuit Kogyo Kk | Method of filling holes |
| CN102162991A (en) * | 2011-04-02 | 2011-08-24 | 深南电路有限公司 | Solder resisting exposure substrate and circuit board manufacturing process |
| CN104955283A (en) * | 2015-06-17 | 2015-09-30 | 安徽达胜电子有限公司 | Circuit board tin spraying process |
-
2015
- 2015-10-08 CN CN201510649077.6A patent/CN105188272A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001111215A (en) * | 1999-10-12 | 2001-04-20 | Nippon Circuit Kogyo Kk | Method of filling holes |
| CN102162991A (en) * | 2011-04-02 | 2011-08-24 | 深南电路有限公司 | Solder resisting exposure substrate and circuit board manufacturing process |
| CN104955283A (en) * | 2015-06-17 | 2015-09-30 | 安徽达胜电子有限公司 | Circuit board tin spraying process |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106658984A (en) * | 2016-10-27 | 2017-05-10 | 江门崇达电路技术有限公司 | Process and device for eliminating water stains appearing after tin sprayed plate washing |
| CN106686904A (en) * | 2017-02-15 | 2017-05-17 | 深圳市景旺电子股份有限公司 | Method for reducing ionic contaminants of PCB after tin deposition surface treatment |
| CN107994106A (en) * | 2017-08-02 | 2018-05-04 | 宏齐光电子(深圳)有限公司 | A kind of LED encapsulation PCB substrate for spraying tin and its spray tin surfaces processing method |
| CN107580424A (en) * | 2017-08-30 | 2018-01-12 | 奥士康精密电路（惠州）有限公司 | LED circuit board sprays tin thickness and the optimization method of flatness |
| CN107835584A (en) * | 2017-10-27 | 2018-03-23 | 遂宁市力源印制电路板有限公司 | Quickly spray tin method in the surface of wiring board |
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Application publication date: 20151223 |