CN107835584A - Quickly spray tin method in the surface of wiring board - Google Patents
Quickly spray tin method in the surface of wiring board Download PDFInfo
- Publication number
- CN107835584A CN107835584A CN201711023932.8A CN201711023932A CN107835584A CN 107835584 A CN107835584 A CN 107835584A CN 201711023932 A CN201711023932 A CN 201711023932A CN 107835584 A CN107835584 A CN 107835584A
- Authority
- CN
- China
- Prior art keywords
- tin
- wiring board
- carry out
- microetch
- spray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1344—Spraying small metal particles or droplets of molten metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention discloses a kind of surface of wiring board and quickly sprays tin method, comprises the following steps：A, cleaning treatment early stage, microetch processing is carried out to wiring board plate face and through hole；B, clean, the wiring board after microetch is rinsed with water, rinse after completing and carry out baked do；C, preheat, the wiring board plate face of cleaning is preheated, preheating uses infrared heating pipe；D, scaling powder is coated, when preheating temperature reaches between 120 170 degrees Celsius, dual coating scaling powder is carried out to wiring board；E, tin is sprayed, between temperature maintains 230 280 DEG C in solder furnace, ensures the molten condition of tin liquor, wiring board is delivered to below shower nozzle by horizontal transferring device and carries out spray tin, sprays 25 seconds tin time, and during spraying tin, upper lower air knife is blown hard, and completes quick spray tin；F, cooled down after the completion of spray tin and carry out later stage cleaning treatment.Present invention process flow is simple, can carry out quickly spraying tin, substantially increases the efficiency of production.
Description
Technical field
The invention belongs to wiring board manufacture technology field, and in particular to quickly spray tin method in a kind of surface of wiring board.
Background technology
At present, the application technology of wiring board has obtained huge development, therefore user couple with the development of electronic technology
Wiring board proposes higher requirement, but traditional tin spray process has instantaneous temperature height always, causes the rabbet ink to be difficult
High temperature is born, so as to expand, causes rabbet ink to be peeled off with hole wall, causes to overflow on hole side, serious bleed occurs and ask
Topic, cause product quality abnormal.
The content of the invention
The technical problems to be solved by the invention are to be directed to above-mentioned the deficiencies in the prior art, there is provided a kind of table of wiring board
Quickly spray tin method in face.
The technical solution adopted in the present invention is：Tin method is quickly sprayed on a kind of surface of wiring board, is comprised the following steps：
A, cleaning treatment early stage, microetch processing is carried out to wiring board plate face and through hole, and removes and be attached to the organic of copper face
Pollutant；
B, clean, the wiring board after microetch is rinsed with water, rinse after completing and carry out baked do；
C, preheat, the wiring board plate face of cleaning is preheated, preheating uses infrared heating pipe；
D, scaling powder is coated, when preheating temperature reaches between 120-170 degrees Celsius, dual coating is carried out to wiring board and helped
Solder flux；
E, tin is sprayed, between temperature maintains 230-280 DEG C in solder furnace, ensures the molten condition of tin liquor, wiring board passes through
Horizontal transferring device, which is delivered to below shower nozzle, carries out spray tin, sprays 2-5 seconds tin time, and during spraying tin, upper lower air knife is blown hard, and is completed
Quick spray tin；
F, cooled down after the completion of spray tin and carry out later stage cleaning treatment.
Preferably, wiring board plate face carries out uniform microetch processing in step a.
Preferably, the spacing in step e between upper lower air knife is 15-30mil.
Preferably, inclination of the air knife with vertical direction in 3-8 degree in step e.
The beneficial effects of the present invention are：Present invention process flow is simple, can carry out quickly spraying tin, substantially increases production
Efficiency.
Embodiment
The present invention is described in further detail below in conjunction with specific embodiment.
Embodiment
Tin method is quickly sprayed on the surface for the wiring board that the present embodiment provides, and is comprised the following steps：
A, cleaning treatment early stage, microetch processing is carried out to wiring board plate face and through hole, and removes and be attached to the organic of copper face
Pollutant；
B, clean, the wiring board after microetch is rinsed with water, rinse after completing and carry out baked do；
C, preheat, the wiring board plate face of cleaning is preheated, preheating uses infrared heating pipe；
D, scaling powder is coated, when preheating temperature reaches between 120-170 degrees Celsius, dual coating is carried out to wiring board and helped
Solder flux；
E, tin is sprayed, between temperature maintains 230-280 DEG C in solder furnace, ensures the molten condition of tin liquor, wiring board passes through
Horizontal transferring device, which is delivered to below shower nozzle, carries out spray tin, sprays 2-5 seconds tin time, and during spraying tin, upper lower air knife is blown hard, and is completed
Quick spray tin；
F, cooled down after the completion of spray tin and carry out later stage cleaning treatment.
In above-described embodiment, wiring board plate face carries out uniform microetch processing in step a.
In above-described embodiment, the spacing in step e between upper lower air knife is 15-30mil.
In above-described embodiment, inclination of the air knife with vertical direction in 3-8 degree in step e.
Uniform microetch processing is carried out to surface of circuit board in the present invention, microetch depth general control is in 0.60-0.90 microns
Between, uniform microetch can make surface of circuit board have good solderability；Hot blast knife tin scraping is added after quick horizontal tin-spraying, and
And air knife tilts with vertical direction in 3-8 degree, can more easily blow away the Xi Dui of the tin and wiring board plate face in hole.
Claims (4)
1. tin method is quickly sprayed on a kind of surface of wiring board, it is characterised in that：Comprise the following steps：
A, cleaning treatment early stage, microetch processing is carried out to wiring board plate face and through hole, and removes the organic contamination for being attached to copper face
Thing；
B, clean, the wiring board after microetch is rinsed with water, rinse after completing and carry out baked do；
C, preheat, the wiring board plate face of cleaning is preheated, preheating uses infrared heating pipe；
D, scaling powder is coated, when preheating temperature reaches between 120-170 degrees Celsius, dual coating is carried out to wiring board and helps weldering
Agent；
E, tin is sprayed, between temperature maintains 230-280 DEG C in solder furnace, ensures the molten condition of tin liquor, wiring board passes through level
Conveying device, which is delivered to below shower nozzle, carries out spray tin, sprays 2-5 seconds tin time, and during spraying tin, upper lower air knife is blown hard, and completes quick
Spray tin；
F, cooled down after the completion of spray tin and carry out later stage cleaning treatment.
2. tin method is quickly sprayed on the surface of wiring board according to claim 1, it is characterised in that：Wiring board plate in step a
Face carries out uniform microetch processing.
3. tin method is quickly sprayed on the surface of wiring board according to claim 1, it is characterised in that：Upper lower air knife in step e
Between spacing be 15-30mil.
4. tin method is quickly sprayed on the surface of wiring board according to claim 1, it is characterised in that：Air knife is with hanging down in step e
Nogata is to the inclination in 3-8 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711023932.8A CN107835584A (en) | 2017-10-27 | 2017-10-27 | Quickly spray tin method in the surface of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711023932.8A CN107835584A (en) | 2017-10-27 | 2017-10-27 | Quickly spray tin method in the surface of wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107835584A true CN107835584A (en) | 2018-03-23 |
Family
ID=61649934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711023932.8A Pending CN107835584A (en) | 2017-10-27 | 2017-10-27 | Quickly spray tin method in the surface of wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107835584A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112437549A (en) * | 2020-11-13 | 2021-03-02 | 南通华钰电子科技有限公司 | Full-automatic tin dipping and spraying device and using method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1833088A1 (en) * | 2006-03-07 | 2007-09-12 | Danfoss Silicon Power GmbH | Method of forming a crack-free connection between a heat sink and a substrate plate |
| CN203807543U (en) * | 2014-02-14 | 2014-09-03 | 温州瑞豪电子有限公司 | PCB (Printed Circuit Board) tin spraying machine |
| CN105188272A (en) * | 2015-10-08 | 2015-12-23 | 江门崇达电路技术有限公司 | Hot air leveling surface treatment method on PCB |
-
2017
- 2017-10-27 CN CN201711023932.8A patent/CN107835584A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1833088A1 (en) * | 2006-03-07 | 2007-09-12 | Danfoss Silicon Power GmbH | Method of forming a crack-free connection between a heat sink and a substrate plate |
| CN203807543U (en) * | 2014-02-14 | 2014-09-03 | 温州瑞豪电子有限公司 | PCB (Printed Circuit Board) tin spraying machine |
| CN105188272A (en) * | 2015-10-08 | 2015-12-23 | 江门崇达电路技术有限公司 | Hot air leveling surface treatment method on PCB |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112437549A (en) * | 2020-11-13 | 2021-03-02 | 南通华钰电子科技有限公司 | Full-automatic tin dipping and spraying device and using method thereof |
| CN112437549B (en) * | 2020-11-13 | 2021-11-05 | 南通华钰电子科技有限公司 | Full-automatic tin dipping and spraying device and using method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180323 |