CN102162991A - Solder resisting exposure substrate and circuit board manufacturing process - Google Patents
Solder resisting exposure substrate and circuit board manufacturing process Download PDFInfo
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- CN102162991A CN102162991A CN 201110083726 CN201110083726A CN102162991A CN 102162991 A CN102162991 A CN 102162991A CN 201110083726 CN201110083726 CN 201110083726 CN 201110083726 A CN201110083726 A CN 201110083726A CN 102162991 A CN102162991 A CN 102162991A
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- welding resistance
- egative film
- solder mask
- wiring board
- light
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Abstract
The invention discloses a solder resisting exposure substrate, which is used for improving the binding ability of a protective layer and a solder resisting layer. The solder resisting exposure substrate comprises a solder resisting exposure substrate body (2), wherein a plurality of light blocking points (201) are arranged on the solder resisting exposure substrate body (2) at intervals. By the solder resisting exposure substrate with the plurality of light blocking points, the binding ability of the protective layer and the solder resisting layer can be improved; a coarsening effect on the surface of the solder resisting layer can be improved to make the surface of the solder resisting layer coarsened after the solder resisting exposure substrate is used for performing exposure and development processing on the solder resisting layer, so that the binding ability of the protective layer and the solder resisting layer is improved, and the defects that the protective layer does not exist on the solder resisting layer or the protective layer falls are overcome. The invention also provides a circuit board manufacturing process by using the solder resisting exposure substrate.
Description
Technical field
The present invention relates to the wiring board manufacture technology field, particularly a kind of welding resistance exposure egative film and wiring board manufacture craft.
Background technology
The Coating technology of printed wiring board (a kind of technology that is used for the protection circuit plate on the wiring board finished product that the material that shields is sprayed on) is mainly used in some and is in above the wiring board that uses under the rugged surroundings; as the airline plate, the protective layer that this Coating technology generates plays important protective effect to the wiring board that uses under rugged surroundings.
See also Fig. 1-Fig. 3; Fig. 1 is the process chart of printed wiring board welding resistance and subsequent step; Fig. 2 is the structural representation of printed wiring board behind the welding resistance exposure imaging in the prior art, and Fig. 3 is the structural representation of back printed wiring board behind the spraying protective layer in the prior art.
Usually the manufacture craft that has the printed wiring board of protective layer specifically comprises:
Step S11: the silk-screen welding resistance, solder mask 12 is a kind of protective seams, is coated on the circuit and base material that printed wiring board 11 need not weld.The short circuit that causes when being used to prevent wave soldering, and the consumption of saving scolding tin prevent that circuit from being injured by moisture, various electrolyte and external mechanical force.
Step S12:; Exposure and development; be will the printed board of solder mask 12 be arranged behind the silk-screen; with the welding resistance negative pad in the printed board is covered; make it in exposure, not be subjected to ultraviolet irradiation; and the welding resistance protective seam through UV-irradiation more solid attached on the printed board face; pad is not subjected to UV-irradiation, can expose copper pad, so that slicker solder on when hot air leveling.
Step S13: spraying protective layer 13, adopt Coating technology that protective layer 13 is sprayed on the solder mask.
But because conventional wiring board solder mask 12 surfaces that make are smooth, when protective layer 13 sprays in the circuit board, protective layer 13 generally is very weak with the adhesion of solder mask 12, is easy to occur the defective that unshielded layer 13 on the solder mask 12 or protective layer 13 come off.
Summary of the invention
In view of this, the invention provides a kind of welding resistance exposure egative film wiring board manufacture craft, to improve the binding ability of solder mask and protective layer, the defective of avoiding on the solder mask unshielded layer or protective layer to come off.
For achieving the above object, the invention provides following technical scheme:
A kind of welding resistance exposure egative film is used to improve the binding ability of protective layer and welding resistance, comprises the invention of welding resistance exposure egative film body, and this welding resistance exposure egative film body is invented and is arranged at intervals with a plurality of invention of being in the light.
Preferably, in above-mentioned welding resistance exposure egative film, in the invention of the described welding resistance exposure of a plurality of described being distributed in of an invention rectangular array of being in the light egative film body.
Preferably, in above-mentioned welding resistance exposure egative film, the be in the light spacing of an invention of adjacent two of described every row or every row is 1～3mm.
Preferably, in above-mentioned welding resistance exposure egative film, in the invention of the described welding resistance exposure of a plurality of described being distributed in of an invention annular array of being in the light egative film body.
Preferably, in above-mentioned welding resistance exposure egative film, a described invention of being in the light is for circular, and diameter is 0.2～0.5mm.
Preferably, in above-mentioned welding resistance exposure egative film, described being in the light a little is triangle, rhombus or abnormity.
A kind of wiring board manufacture craft comprises step: 1) circuit board substrate is made; 2) at circuit board substrate surface silk-screen solder mask; 3) preliminary drying wiring board; 4) to solder mask exposure and development; 5) at the solder mask of wiring board surface spraying protective layer, described step 4) be specially employing as above each described welding resistance exposure egative film to described solder mask exposure with develop.
Preferably, in above-mentioned wiring board manufacture craft, described step 3) is specially and adopts 60～80 degrees centigrade temperature to dry by the fire 30～50 minutes to wiring board.
Preferably, in above-mentioned wiring board manufacture craft, the development time of described step 4) is 100～140 seconds.
Preferably, in above-mentioned wiring board manufacture craft, the development time of described step 4) is 120 seconds.
From above-mentioned technical scheme as can be seen, provided by the invention have a plurality of welding resistances exposures egative films that are in the light a little, can improve the binding ability of protective layer and solder mask, this welding resistance exposure egative film exposed to solder mask and development treatment after, can improve the alligatoring effect on solder mask surface, make the solder mask rough surface, thereby improved the binding ability of solder mask and protective layer, the defective of having avoided unshielded layer on the solder mask or protective layer to come off.
Description of drawings
Fig. 1 is the process chart of printed wiring board welding resistance and subsequent step;
Fig. 2 is the structural representation of printed wiring board behind the welding resistance exposure imaging in the prior art;
Fig. 3 is the structural representation of printed wiring board behind the spraying protective layer in the prior art;
The structural representation of the welding resistance exposure egative film that Fig. 4 provides for the embodiment of the invention;
The structural representation of the welding resistance exposure egative film that Fig. 5 provides for another embodiment of the present invention;
The structural representation of printed wiring board behind the welding resistance exposure imaging that Fig. 6 provides for the embodiment of the invention;
The structural representation of printed wiring board behind the spraying protective layer that Fig. 7 provides for the embodiment of the invention.
Embodiment
The invention discloses a kind of welding resistance exposure egative film wiring board manufacture craft, to improve the binding ability of solder mask and protective layer, the defective of avoiding on the solder mask unshielded layer or protective layer to come off.
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that is obtained under the creative work prerequisite.
See also Fig. 4 and Fig. 5, the structural representation of the welding resistance exposure egative film that the structural representation of the welding resistance exposure egative film that Fig. 4 provides for the embodiment of the invention, Fig. 5 provide for another embodiment of the present invention
Welding resistance provided by the invention exposure egative film is used to improve the binding ability of protective layer and solder mask, comprises welding resistance exposure egative film body 2, and wherein, this welding resistance is exposed to being arranged at intervals with on egative film body 2 and a plurality ofly is in the light a little 201.It will be appreciated by persons skilled in the art that being in the light a little on the welding resistance exposure egative film 201 is lightproof area, washed out the most at last, and the zone that chopping point is not set will be hardened by UV-irradiation, and finally be attached to the plate face at the solder mask that is covered by this lightproof area.The solder mask partial flushing that exposure can be provided with the time lightproof area by the development treatment after the exposure is fallen, thereby forms rugged rough surface.
See also Fig. 6 and Fig. 7, the structural representation of printed wiring board behind the spraying protective layer that the structural representation of printed wiring board behind the welding resistance exposure imaging that Fig. 6 provides for the embodiment of the invention, Fig. 7 provide for the embodiment of the invention.
The present invention utilizes the characteristic of exposure and development that solder mask 22 partial flushing that solder mask 22 surfaces are provided with lightproof area are fallen just, thereby make solder mask 22 surfaces be uneven, and then make solder mask 22 rough surface (as shown in Figure 6), to improve its adhesive ability.Provided by the invention have a plurality of welding resistance exposure egative films of 201 of being in the light a little, can improve the binding ability of protective layer 23 and solder mask 21, this welding resistance exposure egative film exposed to solder mask 22 and development treatment after, can improve the alligatoring effect on solder mask 22 surfaces, make solder mask 22 rough surface, thereby improved the binding ability of solder mask 22 and protective layer 23, the defective of having avoided unshielded layer 23 on the solder mask 22 or protective layer 23 to come off.
It will be understood by those skilled in the art that, for the binding ability (being roughness) that satisfies each position on the solder mask identical or close, this should be in the light a little 201 is evenly distributed on the welding resistance exposure egative film body 2, and the 201 whole welding resistance egative film bodies 2 that expose of should arranging that are in the light a little.
As shown in Figure 4, a plurality of a little being distributed on the welding resistance exposure egative film body 2 of 201 rectangular arrays of being in the light, promptly be in the light and a little 201 can be arranged on along the mode of multiple lines and multiple rows on the welding resistance exposure egative film body 2,9 row for example can be set on welding resistance is exposed egative film body 2 altogether be in the light a little 201, it 201 is 9 that every row is in the light a little, and promptly being in the light a little, 201 modes according to 9 row, 9 row are arranged on the welding resistance exposure egative film body 2.Adjacent two of every row or every row are in the light a little that 201 spacing can be 1～3mm, by to the some roughness of the control may command solder mask of 201 spacings that is in the light, promptly can adjust the binding ability of solder mask and protective layer by be in the light 201 spacing a little of adjustment.Being in the light a little 201 can be multiple shape, geometric configuratioies such as triangle, rhombus, circle, abnormity for example, and 201 shape does not limit to being in the light a little in the present invention.Because circle more easily process, so the present invention preferably adopts and circular is in the light a little 201, and diameter is 0.2～0.5mm, enhancing productivity, by adjustment a little 201 the diameter that is in the light, can control the degree of depth that the solder mask surface is rinsed pit partly.
As shown in Figure 5, a plurality of a little being distributed on the welding resistance exposure egative film body 2 of 201 annular arrays of being in the light.Promptly being in the light a little 201 can be arranged on along the mode of multi-layer annular on the welding resistance exposure egative film body 2,5 a rings group that is in the light for example can be set on welding resistance is exposed egative film body 2, and outer field diameter is bigger, and skin being in the light a little of a group of being in the light is 201 more.Distance between concrete adjacent two rings can set up on their own as required, by to the some roughness of the control may command solder mask of 201 spacings that is in the light, promptly can adjust the binding ability of solder mask and protective layer by be in the light 201 spacing a little of adjustment.Being in the light a little 201 can be multiple shape, geometric configuratioies such as triangle, rhombus, circle, abnormity for example, and 201 shape does not limit to being in the light a little in the present invention.Because circle more easily process, so the present invention preferably adopts and circular is in the light a little 201, and diameter is 0.2～0.5mm, enhancing productivity, by adjustment a little 201 the diameter that is in the light, can control the degree of depth that the solder mask surface is rinsed pit partly.
Protective layer painting method provided by the invention comprises step: at the solder mask surface spraying protective layer of wiring board, wherein, also comprised step before step spraying protective layer: adopting as mentioned above, welding resistance exposure egative film exposes to described solder mask and develops.
Before the spraying protective layer, solder mask adopted and above-mentionedly have the welding resistance that the is in the light a little egative film that exposes and expose and develop, utilization is added being in the light a little of a kind of specific dimensions as mentioned above and spacing on conventional welding resistance exposure egative film, realize the effect of alligatoring solder mask smooth surface, and then realize strengthening the purpose of adhesion between solder mask and protective layer.Especially can be by control be in the light a little size and the spacing size of coming freely to regulate and control adhesion.
Wiring board manufacture craft provided by the invention comprises step: 1, circuit board substrate is made; 2, at circuit board substrate surface silk-screen solder mask; 3, preliminary drying wiring board; 4, to solder mask exposure and development; 5, at the surperficial spraying of the solder mask protective layer of wiring board, wherein, described step 4 is specially and adopts aforesaid welding resistance exposure egative film to solder mask exposure and development.
When making wiring board, before the spraying protective layer, solder mask adopted and above-mentionedly have the welding resistance that the is in the light a little egative film that exposes and expose and develop, utilization is added being in the light a little of a kind of specific dimensions as mentioned above and spacing on conventional welding resistance welding resistance exposure egative film, realize the effect of alligatoring solder mask smooth surface, and then realize strengthening the purpose of adhesion between solder mask and protective layer.Especially can be by control be in the light a little size and the spacing size of coming freely to regulate and control adhesion.
Step 3 is specially and adopts 60～80 degrees centigrade temperature to dry by the fire 30～50 minutes to wiring board, preferably adopts 45 minutes modes of 73 degrees centigrade of bakings, to drive the solvent in the welding resistance printing ink away, makes the welding resistance partially hardened, the unlikely welding resistance exposure egative film that clings when exposing.
The development time of step 4 can be 100～140 seconds, is preferably 120 seconds; The welding resistance exposure egative film that exposure uses the foregoing description to provide, exposure parameter is 11 grades of Residual oils.
By control, can realize that the solder mask surface is by alligatoring uniformly to welding resistance preliminary drying parameter, exposure parameter and photographic parameter in the welding resistance.
Each embodiment adopts the mode of going forward one by one to describe in this instructions, and what each embodiment stressed all is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined herein General Principle can realize under the situation that does not break away from the spirit or scope of the present invention in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.
Claims (10)
1. welding resistance exposure egative film is used to improve the binding ability of protective layer and solder mask, comprises welding resistance exposure egative film body (2), it is characterized in that, this welding resistance is exposed and is arranged at intervals with a plurality of points (201) that are in the light on egative film body (2).
2. welding resistance exposure egative film as claimed in claim 1 is characterized in that, on the described welding resistance exposure egative film bodies of a plurality of described being distributed in of point (201) rectangular array of being in the light (2).
3. welding resistance exposure egative film as claimed in claim 2 is characterized in that the adjacent two described spacings that are in the light point (201) of every row or every row are 1～3mm.
4. welding resistance exposure egative film as claimed in claim 1 is characterized in that, on the described welding resistance exposure egative film bodies of a plurality of described being distributed in of point (201) annular array of being in the light (2).
5. as each described welding resistance exposure egative film of claim 1-4, it is characterized in that the described point (201) that is in the light is for circular, and diameter is 0.2～0.5mm.
6. as each described welding resistance exposure egative film of claim 1-4, it is characterized in that the described point (201) that is in the light is triangle, rhombus or abnormity.
7. a wiring board manufacture craft comprises step: 1) circuit board substrate making; 2) at circuit board substrate surface silk-screen solder mask; 3) preliminary drying wiring board; 4) to solder mask exposure and development; 5) at the solder mask of wiring board surface spraying protective layer, it is characterized in that, described step 4) be specially employing as claim 1-6 as described in each welding resistance exposure egative film to as described in solder mask exposure and developing.
8. wiring board manufacture craft as claimed in claim 7 is characterized in that, described step 3) is specially and adopts 60～80 degrees centigrade temperature to dry by the fire 30～50 minutes to wiring board.
9. wiring board manufacture craft as claimed in claim 8 is characterized in that, the development time of described step 4) is 100～140 seconds.
10. wiring board manufacture craft as claimed in claim 9 is characterized in that, the development time of described step 4) is 120 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110083726 CN102162991A (en) | 2011-04-02 | 2011-04-02 | Solder resisting exposure substrate and circuit board manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110083726 CN102162991A (en) | 2011-04-02 | 2011-04-02 | Solder resisting exposure substrate and circuit board manufacturing process |
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| Publication Number | Publication Date |
|---|---|
| CN102162991A true CN102162991A (en) | 2011-08-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110083726 Pending CN102162991A (en) | 2011-04-02 | 2011-04-02 | Solder resisting exposure substrate and circuit board manufacturing process |
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| CN (1) | CN102162991A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188272A (en) * | 2015-10-08 | 2015-12-23 | 江门崇达电路技术有限公司 | Hot air leveling surface treatment method on PCB |
| CN110493973A (en) * | 2019-08-08 | 2019-11-22 | 华东计算技术研究所（中国电子科技集团公司第三十二研究所） | Method, system and the medium that conducting wire is worn on anti-printed circuit board |
| CN114076771A (en) * | 2020-08-19 | 2022-02-22 | 南通深南电路有限公司 | Method for inspecting negative film and negative film inspection assembly |
Citations (4)
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|---|---|---|---|---|
| US20020184757A1 (en) * | 2001-06-07 | 2002-12-12 | Lee Sung Gue | Hole plugging method for printed circuit boards, and hole plugging device |
| CN101248708A (en) * | 2005-06-22 | 2008-08-20 | 3M创新有限公司 | Dielectric substrate with holes and method of manufacture |
| CN101471269A (en) * | 2007-12-27 | 2009-07-01 | 新光电气工业株式会社 | Method of manufacturing semiconductor device |
| CN101534612A (en) * | 2009-04-10 | 2009-09-16 | 深圳市博敏电子有限公司 | Resistance welding superposition technology for PCB thick copper lines |
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2011
- 2011-04-02 CN CN 201110083726 patent/CN102162991A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020184757A1 (en) * | 2001-06-07 | 2002-12-12 | Lee Sung Gue | Hole plugging method for printed circuit boards, and hole plugging device |
| CN101248708A (en) * | 2005-06-22 | 2008-08-20 | 3M创新有限公司 | Dielectric substrate with holes and method of manufacture |
| CN101471269A (en) * | 2007-12-27 | 2009-07-01 | 新光电气工业株式会社 | Method of manufacturing semiconductor device |
| CN101534612A (en) * | 2009-04-10 | 2009-09-16 | 深圳市博敏电子有限公司 | Resistance welding superposition technology for PCB thick copper lines |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188272A (en) * | 2015-10-08 | 2015-12-23 | 江门崇达电路技术有限公司 | Hot air leveling surface treatment method on PCB |
| CN110493973A (en) * | 2019-08-08 | 2019-11-22 | 华东计算技术研究所（中国电子科技集团公司第三十二研究所） | Method, system and the medium that conducting wire is worn on anti-printed circuit board |
| CN110493973B (en) * | 2019-08-08 | 2020-11-24 | 华东计算技术研究所（中国电子科技集团公司第三十二研究所） | Method, system and medium for preventing abrasion of lead on printed circuit board |
| CN114076771A (en) * | 2020-08-19 | 2022-02-22 | 南通深南电路有限公司 | Method for inspecting negative film and negative film inspection assembly |
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Application publication date: 20110824 |