CN110607530A

CN110607530A - Deplating liquid for deplating organic glue layer on metal and deplating method thereof

Info

Publication number: CN110607530A
Application number: CN201810621107.6A
Authority: CN
Inventors: 周群飞; 饶桥兵; 钟耀辉
Original assignee: Lansi Technology (changsha) Co Ltd
Current assignee: Lansi Technology (changsha) Co Ltd; Lens Technology Changsha Co Ltd
Priority date: 2018-06-15
Filing date: 2018-06-15
Publication date: 2019-12-24

Abstract

The invention provides a deplating solution for an organic adhesive layer on deplated metal, which comprises the following components in percentage by mass: 20-30% of methyl ethyl ketone, 5-10% of xylene, 5-10% of N, N-dimethylformamide, 5-10% of acetone and the balance of organic solvent; the xylene is at least one of m-xylene, p-xylene and o-xylene; the organic solvent is at least one of ethanol and diethyl ether. The deplating liquid can effectively remove the organic glue layer on the metal layer. The invention also discloses a deplating method adopting the deplating liquid, which has the advantages of simple process steps, easy control of process parameters and easy industrial production.

Description

Deplating liquid for deplating organic glue layer on metal and deplating method thereof

Technical Field

The invention relates to the technical field of deplating, in particular to a deplating liquid for an organic adhesive layer on deplated metal and a deplating method thereof.

Background

The sapphire wafer processed by the optical processing process has the excellent characteristics of lightness, thinness, transparency, cleanness, fingerprint resistance, anti-glare, scratch resistance, weather resistance and the like, and is applied to various electronic products, wherein the sapphire wafer is most widely applied in the field of mobile phone cameras.

The camera assembly is mainly formed by assembling an optical wafer and a metal ring in a laminating way under the high-temperature vacuum condition through a Halfyd adhesive, wherein the wafer can be a finished sapphire lens which is finished with silk screen printing and optical coating, the metal ring is mainly a double-hole oval or single-hole round body made of stainless steel, and a metal coating or film layer made of special materials is electroplated on the upper part of the stainless steel ring and is used for decoration, scratch prevention, fingerprint resistance, glare prevention and the like. And the camera assembly defective products such as the non-tight adhesion between the sapphire lens and the metal ring, the adhesion deviation, the scratch of the sapphire lens, the scratch of the metal ring and the like are inevitably generated in the camera assembly processing procedure.

At present, the deplating method of the defective camera assembly mainly comprises the following steps:

(1) the camera defective assembly part is soaked in a strong-acid and strong-alkaline deplating chemical agent for a long time, and the sapphire lens and the stainless steel metal ring are stripped and removed of glue at a high temperature, but the method is easy to damage an electroplated metal coating on the metal ring, so that an electroplated layer falls off, and the product signal resistance is seriously influenced. The main reasons are: the metal coatings of Fe, Cr and the like on the stainless steel metal ring are not resistant to strong acid and strong alkali deplating liquid, the camera assembly is formed by assembling an optical lens and the metal ring in a laminating way through haver glue under the high-temperature vacuum condition, the lens and the metal ring are combined very tightly to reach nm-level seamless connection, and chemical liquid medicine basically cannot normally seep into the haver glue layer to dissolve the haver glue layer in a short time under the auxiliary environmental condition without ultrasonic waves or high temperature so that the lens and the metal ring are stripped. If the camera assembly is soaked in a strong acid and strong alkali deplating chemical agent for a long time, the metal coatings of Fe, Cr and the like on the stainless steel metal ring can go over back to become naked colors, and the problems of heterochromatic metal ring, metal coating falling and the like are caused, so that the appearance and functional defects of the product are caused.

(2) When the existing neutral deplating solution is adopted for deplating, such as the HR-4121 neutral deplating agent deplating solution produced by Zhongshan latitude surface technology Limited company, the situation that an adhesive layer cannot be deplated completely and has residues is found, and the requirement cannot be met.

Therefore, it is urgently needed to develop a deplating solution and a deplating method capable of effectively removing the organic glue layer on the metal layer so as to meet the practical requirements.

Disclosure of Invention

The first purpose of the invention is to provide a deplating solution capable of effectively removing an organic glue layer on a metal layer, and the specific technical scheme is as follows:

the deplating liquid for an organic glue layer on deplated metal comprises the following components in percentage by mass: 20-30% of methyl ethyl ketone, 5-10% of xylene, 5-10% of N, N-dimethylformamide, 5-10% of acetone and the balance of organic solvent;

the xylene is at least one of m-xylene, p-xylene and o-xylene;

the organic solvent is at least one of ethanol and diethyl ether.

In the above technical scheme, the composition preferably comprises the following components in percentage by mass: 25-30% of methyl ethyl ketone, 5-10% of xylene, 5-10% of N, N-dimethylformamide, 5-9% of acetone and the balance of organic solvent.

In the above technical solution, preferably, the organic solvent is an ethanol solution or absolute ethanol, and the volume fraction of ethanol in the ethanol solution is greater than or equal to 95.4%.

In the above technical scheme, preferably, the xylene is a mixture composed of, by mass percentage, 45% to 70% of m-xylene, 15% to 25% of p-xylene, and 10% to 15% of o-xylene.

In the above technical scheme, the xylene is preferably a mixture of 48 to 68 mass percent of m-xylene, 18 to 23 mass percent of p-xylene and 10 to 13 mass percent of o-xylene.

The deplating liquid applied by the invention has the following effects:

1. the deplating liquid takes methyl ethyl ketone as a main agent of a deplating organic glue layer, improves the reaction rate of the deplating liquid and the organic glue layer by matching with the action of a reagent with strong dissolving polarity of dimethylbenzene and N, N-dimethylformamide and combining the easy flowability and the permeation promoting action of an organic solvent, can effectively deplate effective components such as nitrile rubber, phenolic resin and the like in the organic glue layer, and then strips the organic glue layer from a metal layer (such as a stainless steel metal ring).

2. The pH value of the deplating liquid is neutral, the deplating liquid does not react with a metal coating (containing Fe, Cr and the like) on the metal layer, the over-retreating phenomenon cannot be caused, the yield can reach 90 percent, and the product quality is ensured.

The second purpose of the invention is to disclose a deplating method for deplating by adopting the deplating solution, which specifically comprises the following steps:

firstly, placing a product in a deplating solution of an organic glue layer on the deplating metal for soaking;

secondly, cleaning the soaked product;

and thirdly, drying the cleaned product to obtain the deplated product.

Preferably, in the above technical solution, the soaking in the first step specifically comprises: the soaking temperature is normal temperature, and the soaking time is 50-60 minutes;

the cleaning in the second step is specifically as follows: washing with water at 30-55 deg.c under ultrasonic vibration with ultrasonic current of 2-4A;

the drying in the third step is specifically: drying is carried out by adopting a drying furnace of a groove type ultrasonic cleaner, and the temperature of the drying furnace is set to be 30-80 ℃.

The application of the deplating method of the invention has the following effects:

1. the deplating method has the advantages of simple process steps, easy control of process parameters, simple and convenient operation and suitability for industrial production.

2. The deplating liquid can effectively remove the organic adhesive layer on the metal ring of the camera in a short time at normal temperature, cannot cause over-retreating phenomenon, cannot change the metal ring of the camera into naked color, and has good appearance and high yield of the metal ring deplated by the deplating liquid.

3. The deplating is carried out at normal temperature, extra heating or cooling operation is not needed to change the temperature, and the cost is saved; the selection of the length of the soaking time is very critical, and if the soaking time is too long, the production efficiency is low; if the soaking time is too short, a good deplating effect cannot be achieved, and the organic glue layer cannot be completely removed; the method is used for washing after deplating, so that the deplating liquid can be prevented from remaining on the metal layer to influence the cleanliness of the metal layer; the cleaning and drying can be carried out on a groove type ultrasonic cleaning machine of special mechanical equipment for cleaning the metal ring of the camera, and the cleaning part of the cleaning machine is provided with ultrasonic waves and spraying, so that the metal ring of the camera can be effectively cleaned; high drying efficiency, easy operation, and reduced influence of environmental factors on product cleanliness.

In addition to the objects, features and advantages described above, other objects, features and advantages of the present invention are also provided. The present invention will be described in further detail with reference to examples.

Detailed Description

The solution according to the invention is explained in detail below with reference to examples, but the invention can be implemented in many different ways, as defined and covered by the claims.

Example 1:

the deplating solution for removing the organic adhesive layer on the metal of the deplating metal is used for removing the organic adhesive layer on a metal ring of a camera (can also be suitable for deplating the organic adhesive layer on a key metal ring), and comprises the following components in percentage by mass: 20% of methyl ethyl ketone, 10% of xylene, 10% of N, N-dimethylformamide, 8% of acetone and 52% of an organic solvent.

The xylene is a mixture composed of 60% of m-xylene, 25% of p-xylene and 15% of o-xylene in percentage by mass.

The organic solvent is ethanol solution or absolute ethanol, the volume fraction of ethanol in the ethanol solution is more than or equal to 95.4%, and the ethanol solution can be preferably selected from a plurality of ethanol solutions in Table 1:

TABLE 1 statistics of several ethanol solutions

The method for deplating by adopting the deplating solution specifically comprises the following steps:

firstly, placing a product in a deplating solution of an organic glue layer on a deplating metal for soaking, and specifically: soaking for 60 minutes at normal temperature;

and step two, cleaning the soaked product, specifically: cleaning with a tank type ultrasonic cleaning machine (under the conditions of ultrasonic waves and spray water), wherein the cleaning water temperature is 50 ℃, and the ultrasonic current is 2 amperes;

thirdly, drying the cleaned product to obtain a deplated product, which comprises the following specific steps: drying is carried out by adopting a drying oven of the groove type ultrasonic cleaner, and the temperature of the drying oven is set to be 60 ℃.

Example 2:

the difference from the embodiment 1 is that:

1. the deplating solution for removing the organic adhesive layer on the metal of the deplating metal is used for removing the organic adhesive layer on the metal ring of the camera, and comprises the following components in percentage by mass: 30% of methyl ethyl ketone, 5% of xylene, 5% of N, N-dimethylformamide, 10% of acetone and 50% of organic solvent.

2. The xylene is a mixture composed of 70% of meta-xylene, 20% of para-xylene and 10% of ortho-xylene in percentage by mass.

3. And soaking for 50 minutes at normal temperature in the deplating process.

Comparative example 1:

the difference from the embodiment 1 is that: adopts SH-508 strong acid deplating solution (manufacturer: Shihui surface treatment science and technology Co., Ltd., Dongguan city).

Comparative example 2:

the difference from the embodiment 1 is that: SP-513 weak acid deplating solution (manufacturer: Santa Purchase chemical technology Co., Ltd., Dongguan) is adopted.

Comparative example 3:

the difference from the embodiment 1 is that: adopts HRL-1007 strong alkaline deplating solution (manufacturer: Zhongshan Shi latitude surface technology Co., Ltd.).

Comparative example 4:

the difference from the embodiment 1 is that: YA-800D weakly alkaline sapphire degumming solution (manufacturer: Shenzhen Yongan Fine chemical Co., Ltd.) is adopted.

Comparative example 5:

the difference from the embodiment 1 is that: adopts HR-4121 neutral depainting agent to deplating liquid (manufacturer: Zhongshan Shi latitude surface technology Co., Ltd.).

Taking 700 camera metal ring assemblies, randomly dividing into 7 groups, each group comprising 100 cameras, deplating each group of camera metal ring assemblies according to the deplating solution and the process of the embodiment 1-2 and the comparative example 1-5, performing overall appearance inspection on each group of products with the organic adhesive layer removed, checking the deplating effect of the organic adhesive layer of the metal ring and the condition of plating failure of the surface coating of the metal ring, and calculating the yield of each group: after the metal ring is removed, no residual organic glue layer exists on the surface of the metal ring, no over-withdrawing condition occurs, and the surface coating of the metal ring is free of falling electroplating and is marked as qualified; after the metal ring is removed, the surface of the metal ring has residual organic glue layer and/or over-retreating and/or the surface coating of the metal ring has electric plating, the metal ring is marked as unqualified, and the test result is shown in table 2:

TABLE 2 statistical tables of Effect of examples 1-2 and comparative examples 1-5

Group of	Removal effect of organic glue layer	With or without metal coating falling	Pass/fail	Yield of
					Example 1	Has no residue	Is free of	Qualified	95％
Example 2	Has no residue	Is free of	Qualified	90％
					Comparative example 1	Has no residue	Is provided with	Fail to be qualified	0
Comparative example 2	Has no residue	Is provided with	Fail to be qualified	5％
					Comparative example 3	Has no residue	Is provided with	Fail to be qualified	0
Comparative example 4	Has no residue	Is provided with	Fail to be qualified	10％
					Comparative example 5	Has residue	Is free of	Fail to be qualified	50％

As can be seen from table 2, when the deplating solution of the present invention is used to deplate an organic glue layer of a metal ring, the pH value of the deplating solution is neutral, and the deplating solution does not react with a metal coating on the metal ring, so that an over-retreating phenomenon is not caused, and the product tolerance problem is not affected, and the metal ring deplated by using the deplating solution has good appearance and high yield, wherein the yield can reach over 90%; by adopting the deplating solution of 20kg to 30kg, the deplating of 800-1200 pieces of products can be finished (when the number of the deplated products in a batch is determined according to actual requirements), and the yield can reach more than 90 percent. If the traditional deplating solution is used at normal temperature, the deplating effect is poor, and the phenomenon of over-deplating is easy to occur in the deplating process by adopting strong alkali, weak alkali, strong acid, weak acid or high-temperature deplating solution, so that the condition of power failure of the surface coating of the metal ring is caused.

Therefore, the deplating solution provided by the invention can be used at normal temperature for a short time to completely remove the organic glue layer, the over-retreating problem is avoided, meanwhile, the metal coating is not damaged, the signal resistance problem of a product is not influenced, and the metal ring after deplating by using the deplating solution has good appearance and high yield.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A deplating liquid for deplating an organic glue layer on metal is characterized in that: the composite material comprises the following components in percentage by mass: 20-30% of methyl ethyl ketone, 5-10% of xylene, 5-10% of N, N-dimethylformamide, 5-10% of acetone and the balance of organic solvent;

the xylene is at least one of m-xylene, p-xylene and o-xylene; the organic solvent is at least one of ethanol and diethyl ether.

2. The deplating solution for deplating an organic glue layer on a metal according to claim 1, characterized in that: the composite material comprises the following components in percentage by mass: 25-30% of methyl ethyl ketone, 5-10% of xylene, 5-10% of N, N-dimethylformamide, 5-9% of acetone and the balance of organic solvent.

3. The deplating solution for deplating an organic glue layer on a metal according to any one of claims 1 to 2, characterized in that: the organic solvent is ethanol solution or absolute ethanol, and the volume fraction of ethanol in the ethanol solution is more than or equal to 95.4%.

4. The deplating solution for deplating an organic glue layer on a metal according to claim 3, characterized in that: the dimethylbenzene is a mixture consisting of 45-70% of m-dimethylbenzene, 15-25% of p-dimethylbenzene and 10-15% of o-dimethylbenzene in percentage by mass.

5. The deplating solution for deplating an organic glue layer on a metal according to claim 4, wherein the deplating solution comprises the following components in percentage by weight: the dimethylbenzene is a mixture consisting of 48-68% of m-dimethylbenzene, 18-23% of p-dimethylbenzene and 10-13% of o-dimethylbenzene in percentage by mass.

6. A deplating method is characterized in that: the deplating liquid for deplating the organic glue layer on the metal, as claimed in any one of claims 1 to 5, specifically comprises the following steps:

secondly, cleaning the soaked product;

and thirdly, drying the cleaned product to obtain the deplated product.

7. The deplating method according to claim 6, wherein the soaking in the first step is specifically: the soaking temperature is normal temperature, and the soaking time is 50-60 minutes; the cleaning in the second step is specifically as follows: washing with water at 30-55 deg.c under ultrasonic vibration with ultrasonic current of 2-4A; the drying in the third step is specifically: drying is carried out by adopting a drying furnace of a groove type ultrasonic cleaner, and the temperature of the drying furnace is set to be 30-80 ℃.