CN113411991A - Method for transferring pattern of PCB to align target - Google Patents
Method for transferring pattern of PCB to align target Download PDFInfo
- Publication number
- CN113411991A CN113411991A CN202110474572.3A CN202110474572A CN113411991A CN 113411991 A CN113411991 A CN 113411991A CN 202110474572 A CN202110474572 A CN 202110474572A CN 113411991 A CN113411991 A CN 113411991A
- Authority
- CN
- China
- Prior art keywords
- hole
- pcb
- alignment target
- alignment
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 claims abstract description 43
- 239000010949 copper Substances 0.000 claims abstract description 43
- 238000012545 processing Methods 0.000 claims abstract description 26
- 238000007747 plating Methods 0.000 claims abstract description 17
- 238000012546 transfer Methods 0.000 claims abstract description 14
- 238000005553 drilling Methods 0.000 claims abstract description 4
- 238000009713 electroplating Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 238000013461 design Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a PCB (printed circuit board) pattern transfer alignment target method, which comprises the following steps of: drilling alignment target holes on the PCB; continuously processing a shunting hole along the outer side edge of the alignment target hole; processing a laser through hole on the PCB; copper is plated on the PCB, and redundant copper at the position of the alignment target hole is shunted to the shunt hole; and carrying out pattern transfer alignment by using the alignment target hole to generate a circuit conductive pattern of the PCB. In the copper plating process, the shunt holes are designed around the counterpoint target holes for protection, the effect of shunting electroplating density and increasing electroplating area is achieved in the complex waveform pulse electroplating process, the diameter consistency of the counterpoint target holes can be effectively protected, the stability is improved, the influence of copper thickness protrusions is reduced, the uniformity of copper thickness in the holes of the counterpoint target holes is improved, the problems of exposure rejection, deviation of pattern PAD and laser holes and other products in the pattern transfer process are avoided, the production efficiency is improved, and the alignment degree of the pattern PAD and the laser holes is improved.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a method for transferring patterns of a PCB (printed circuit board) to align targets.
Background
At present, with the development of a PCB board towards light, thin, short and small directions, the design of laser holes becomes smaller and smaller, which is very easy to cause laser hole collapse, and recently, the laser blind hole design has been developed to the level of laser drill through hole design (i.e. X-via).
However, the conventional pattern transfer alignment target method has the following defects:
at the copper facing in-process to counterpoint target hole, because the copper facing evenly can form the thick arch of copper around counterpoint target hole, the degree of accuracy of the diameter of counterpoint target hole is seriously influenced, the problem of not conforming of counterpoint target diameter size often appears, has reduced production efficiency, has caused the bad defect of figure PAD and radium-shine hole skew.
Disclosure of Invention
In order to overcome the defects of the prior art, an objective of the present invention is to provide a method for transferring alignment targets of a PCB, which can solve the problems of different diameters of the alignment targets and reduced production efficiency.
One of the purposes of the invention is realized by adopting the following technical scheme:
a PCB pattern transfer alignment target method comprises the following steps:
hole site processing: drilling alignment target holes on the PCB;
shunting processing: continuously processing a shunting hole along the outer side edge of the alignment target hole;
a laser step: processing a laser through hole on the PCB;
copper plating step: copper is plated on the PCB, and redundant copper at the position of the alignment target hole is shunted to the shunt hole;
and (3) aligning: and carrying out pattern transfer alignment by using the alignment target hole to generate a circuit conductive pattern of the PCB.
Further, in the hole site processing step, the alignment target hole is processed into a circular shape.
Further, in the shunting processing step, a circle of shunting holes with the same diameter are processed around the circular alignment target hole.
Further, in the shunt processing step, the diameter of the shunt hole is defined to be between one tenth and one fifth of the diameter of the alignment target hole.
Further, in the branching processing step, the diameter of the branching hole is defined to be 0.15 times the diameter of the alignment target hole.
Further, in the copper plating step, it is checked whether or not a copper thickness bump is present and corresponds to a mark.
Further, in the copper plating step, whether the copper thickness bump meets the requirement is checked, if yes, the next step is executed, and if not, the copper thickness bump is scrapped.
Further, in the copper plating step, the pattern at the position of the position alignment target hole is identified, and a position alignment target picture is generated.
Furthermore, in the copper plating step, the alignment target patterns are marked and correspond to the corresponding alignment target holes.
Further, the method also comprises the plate changing step: and replacing another PCB and repeating the processing steps.
Compared with the prior art, the invention has the beneficial effects that:
in the copper plating process, the shunt holes are designed around the counterpoint target holes for protection, the effect of shunting electroplating density and increasing electroplating area is achieved in the complex waveform pulse electroplating process, the diameter consistency of the counterpoint target holes can be effectively protected, the stability is improved, the influence of copper thickness protrusions is reduced, the uniformity of copper thickness in the holes of the counterpoint target holes is improved, the problems of exposure rejection, deviation of pattern PAD and laser holes and other products in the pattern transfer process are avoided, the production efficiency is improved, and the alignment degree of the pattern PAD and the laser holes is improved.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a flow chart of a method for transferring patterns to alignment targets on a PCB according to the present invention;
FIG. 2 is an image of a copper plated alignment target without shunt holes;
FIG. 3 is an image of the alignment targets after copper plating after shunt hole design.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that any combination of the embodiments or technical features described below can be used to form a new embodiment without conflict.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-3, a method for transferring a pattern of a PCB to an alignment target includes the following steps:
hole site processing: drilling alignment target holes on the PCB;
shunting processing: continuously processing a shunting hole along the outer side edge of the alignment target hole;
a laser step: processing a laser through hole on the PCB;
copper plating step: copper is plated on the PCB, and redundant copper at the position of the alignment target hole is shunted to the shunt hole;
and (3) aligning: and carrying out pattern transfer alignment by using the alignment target hole to generate a circuit conductive pattern of the PCB. In the copper plating process, the shunt holes are designed around the counterpoint target holes for protection, the effect of shunting electroplating density and increasing electroplating area is achieved in the complex waveform pulse electroplating process, the diameter consistency of the counterpoint target holes can be effectively protected, the stability is improved, the influence of copper thickness protrusions is reduced, the uniformity of copper thickness in the holes of the counterpoint target holes is improved, the problems of exposure rejection, deviation of pattern PAD and laser holes and other products in the pattern transfer process are avoided, the production efficiency is improved, and the alignment degree of the pattern PAD and the laser holes is improved.
Specifically, in the actual operation process of the method for transferring the patterns of the PCB to the alignment targets, the patterns of the PCB are transferred by using halogen lamp exposure equipment, and direct imaging is performed by using DI equipment.
Preferably, in the hole site processing step, the alignment target hole is processed to be circular. Specifically, in the shunting processing step, a circle of shunting holes with the same diameter are processed around the circular alignment target hole. In the splitting process step, the diameter of the splitting hole is defined to be between one tenth and one fifth of the diameter of the alignment target hole. In this embodiment, in the branching processing step, the diameter of the branching hole is defined to be 0.15 times the diameter of the registration target hole. For example, when the diameter of the alignment target hole is 4mm, a circle of shunting holes with the diameter of 0.55mm is designed around the alignment target hole with the diameter of 4.0 mm.
Preferably, in the copper plating step, it is checked whether a copper thickness bump is present and corresponds to a mark. And (5) checking whether the copper thick bulge meets the requirement, if so, executing the next step, and if not, performing scrapping treatment.
Preferably, in the copper plating step, the pattern at the alignment target holes is identified to generate an alignment target pattern. And marking the alignment target graph and corresponding to the corresponding alignment target hole. The alignment target graph of each circuit board can be identified, and management is convenient.
Preferably, the method further comprises the plate replacing step: and replacing another PCB and repeating the processing steps.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Claims (10)
1. A PCB pattern transfer alignment target method is characterized by comprising the following steps:
hole site processing: drilling alignment target holes on the PCB;
shunting processing: continuously processing a shunting hole along the outer side edge of the alignment target hole;
a laser step: processing a laser through hole on the PCB;
copper plating step: copper is plated on the PCB, and redundant copper at the position of the alignment target hole is shunted to the shunt hole;
and (3) aligning: and carrying out pattern transfer alignment by using the alignment target hole to generate a circuit conductive pattern of the PCB.
2. The method of claim 1, wherein the method comprises: in the hole position processing step, the alignment target hole is processed into a circular shape.
3. The method of claim 2, wherein the alignment targets are transferred by the pattern transfer of the PCB board, and the method comprises the following steps: in the shunting processing step, a circle of shunting holes with the same diameter are processed around the circular alignment target hole.
4. The method of claim 3, wherein the alignment targets are transferred by the PCB pattern transfer method, and the method comprises the following steps: in the splitting process step, the diameter of the splitting hole is defined to be between one tenth and one fifth of the diameter of the alignment target hole.
5. The method of claim 4, wherein the alignment targets are transferred by the PCB pattern transfer method, and the method comprises the following steps: in the splitting process step, the diameter of the splitting hole is limited to 0.15 times of the diameter of the alignment target hole.
6. The method of claim 1, wherein the method comprises: in the copper plating step, it is checked whether a copper thickness bump is present and corresponds to a mark.
7. The method of claim 1, wherein the method comprises: in the copper plating step, whether the copper thick bulge meets the requirement is checked, if so, the next step is executed, and if not, the copper thick bulge is scrapped.
8. The method of claim 1, wherein the method comprises: in the copper plating step, the patterns at the positions of the alignment target holes are identified, and an alignment target picture is generated.
9. The method of claim 8, wherein the method comprises: in the copper plating step, the alignment target graph is marked and corresponds to the corresponding alignment target hole.
10. The method of claim 1, further comprising the step of changing the board: and replacing another PCB and repeating the processing steps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110474572.3A CN113411991B (en) | 2021-04-29 | 2021-04-29 | PCB pattern transfer alignment target method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110474572.3A CN113411991B (en) | 2021-04-29 | 2021-04-29 | PCB pattern transfer alignment target method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113411991A true CN113411991A (en) | 2021-09-17 |
| CN113411991B CN113411991B (en) | 2024-06-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110474572.3A Active CN113411991B (en) | 2021-04-29 | 2021-04-29 | PCB pattern transfer alignment target method |
Country Status (1)
| Country | Link |
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| CN (1) | CN113411991B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02188989A (en) * | 1989-01-17 | 1990-07-25 | Hitachi Chem Co Ltd | Electrically plating method for printed circuit board |
| JP2002237679A (en) * | 1997-02-03 | 2002-08-23 | Ibiden Co Ltd | Printed circuit board and its manufacturing method |
| CN1392829A (en) * | 2000-10-11 | 2003-01-22 | 松下电器产业株式会社 | Circuit board production method and circuit board production data |
| CN104470227A (en) * | 2014-12-05 | 2015-03-25 | 深圳崇达多层线路板有限公司 | Method for improving high multilayer circuit board slice position and BGA position plated-through hole copper thickness unevenness |
| CN105555040A (en) * | 2016-02-03 | 2016-05-04 | 江门崇达电路技术有限公司 | Method for fabricating PCB capable of improving positional accuracy between outer pattern and drilled holes |
| CN105578734A (en) * | 2016-03-10 | 2016-05-11 | 广州美维电子有限公司 | Circuit board external layer alignment structure and generation method thereof |
| CN106028682A (en) * | 2016-06-07 | 2016-10-12 | 江门崇达电路技术有限公司 | PCB hole plating method |
| CN107567198A (en) * | 2017-08-31 | 2018-01-09 | 惠州市永隆电路有限公司 | A kind of pcb board separate lines copper facing uniformity ameliorative way |
| CN112930033A (en) * | 2021-01-22 | 2021-06-08 | 景旺电子科技(珠海)有限公司 | Circuit board manufacturing method |
-
2021
- 2021-04-29 CN CN202110474572.3A patent/CN113411991B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02188989A (en) * | 1989-01-17 | 1990-07-25 | Hitachi Chem Co Ltd | Electrically plating method for printed circuit board |
| JP2002237679A (en) * | 1997-02-03 | 2002-08-23 | Ibiden Co Ltd | Printed circuit board and its manufacturing method |
| CN1392829A (en) * | 2000-10-11 | 2003-01-22 | 松下电器产业株式会社 | Circuit board production method and circuit board production data |
| CN104470227A (en) * | 2014-12-05 | 2015-03-25 | 深圳崇达多层线路板有限公司 | Method for improving high multilayer circuit board slice position and BGA position plated-through hole copper thickness unevenness |
| CN105555040A (en) * | 2016-02-03 | 2016-05-04 | 江门崇达电路技术有限公司 | Method for fabricating PCB capable of improving positional accuracy between outer pattern and drilled holes |
| CN105578734A (en) * | 2016-03-10 | 2016-05-11 | 广州美维电子有限公司 | Circuit board external layer alignment structure and generation method thereof |
| CN106028682A (en) * | 2016-06-07 | 2016-10-12 | 江门崇达电路技术有限公司 | PCB hole plating method |
| CN107567198A (en) * | 2017-08-31 | 2018-01-09 | 惠州市永隆电路有限公司 | A kind of pcb board separate lines copper facing uniformity ameliorative way |
| CN112930033A (en) * | 2021-01-22 | 2021-06-08 | 景旺电子科技(珠海)有限公司 | Circuit board manufacturing method |
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| Publication number | Publication date |
|---|---|
| CN113411991B (en) | 2024-06-21 |
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