CN113141785A - 一种带围框的电子器件、带电子器件的电路板和电子设备 - Google Patents
一种带围框的电子器件、带电子器件的电路板和电子设备 Download PDFInfo
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- CN113141785A CN113141785A CN201980018870.2A CN201980018870A CN113141785A CN 113141785 A CN113141785 A CN 113141785A CN 201980018870 A CN201980018870 A CN 201980018870A CN 113141785 A CN113141785 A CN 113141785A
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- 239000000565 sealant Substances 0.000 claims description 126
- 230000017525 heat dissipation Effects 0.000 claims description 112
- 238000007789 sealing Methods 0.000 claims description 46
- 229920001971 elastomer Polymers 0.000 claims description 25
- 238000003466 welding Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 abstract description 64
- 230000007797 corrosion Effects 0.000 abstract description 46
- 238000010586 diagram Methods 0.000 description 33
- 229910052751 metal Inorganic materials 0.000 description 23
- 239000002184 metal Substances 0.000 description 23
- 239000003292 glue Substances 0.000 description 21
- 238000001816 cooling Methods 0.000 description 15
- 239000004033 plastic Substances 0.000 description 14
- 229920003023 plastic Polymers 0.000 description 14
- 239000000463 material Substances 0.000 description 9
- 230000009286 beneficial effect Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000005855 radiation Effects 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000000356 contaminant Substances 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 239000003344 environmental pollutant Substances 0.000 description 4
- 230000003631 expected effect Effects 0.000 description 4
- 231100000719 pollutant Toxicity 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
- H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
一种带围框的电子器件、带电子器件的电路板和电子设备,涉及电子设备技术领域,能够对电路板进行有效的防腐蚀保护,延长电子设备的使用寿命;应用于给新能源电动汽车充电的充电桩。该带围框的电子器件(32)包括:围框(33)和电子器件(32),围框(33)围成封闭或一端开口的空腔(34),或者,当带围框的电子器件(32)连接于电路板(3)上时,围框(33)能够与电路板(3)围成封闭或一端开口的空腔(34),或者,当带围框的电子器件(32)连接于电路板(3)上时,围框(33)能够与另外一个带围框的电子器件(32)的围框(33)围成封闭或一端开口的空腔(34),或者,当带围框的电子器件(32)连接于电路板(3)上时,围框(33)能够与电路板(3)和另外一个带围框的电子器件(32)的围框(33)围成封闭或一端开口的空腔(34);电子器件(32)包括电子器件主体(321)和管脚(322)。
Description
PCT国内申请,说明书已公开。
Claims (31)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2019/119297 WO2021097633A1 (zh) | 2019-11-18 | 2019-11-18 | 一种带围框的电子器件、带电子器件的电路板和电子设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113141785A true CN113141785A (zh) | 2021-07-20 |
CN113141785B CN113141785B (zh) | 2022-10-18 |
Family
ID=75981120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201980018870.2A Active CN113141785B (zh) | 2019-11-18 | 2019-11-18 | 一种带围框的电子器件、带电子器件的电路板和电子设备 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20220279643A1 (zh) |
EP (2) | EP4307850A3 (zh) |
CN (1) | CN113141785B (zh) |
WO (1) | WO2021097633A1 (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070091564A1 (en) * | 2005-10-25 | 2007-04-26 | Malone Christopher G | Air duct with airtight seal |
CN208210525U (zh) * | 2018-01-10 | 2018-12-07 | 李思洁 | 一种防水防尘散热系统 |
CN208272839U (zh) * | 2018-06-13 | 2018-12-21 | 成都光电传感技术研究所有限公司 | 一种散热结构及电源变换器 |
CN109952007A (zh) * | 2019-04-24 | 2019-06-28 | 深圳英飞源技术有限公司 | 一种高防护的电子产品 |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3641474A (en) * | 1970-05-11 | 1972-02-08 | Rca Corp | Semiconductor mounting structure |
US4288839A (en) * | 1979-10-18 | 1981-09-08 | Gould Inc. | Solid state device mounting and heat dissipating assembly |
GB8423618D0 (en) * | 1984-09-18 | 1984-10-24 | Howood Ind Ltd | Heat sink structures |
FR2578710B1 (fr) * | 1985-03-07 | 1988-03-04 | Bendix Electronics Sa | Agrafe multiple de fixation et dispositif de montage collectif de composants electroniques de puissance |
US5184281A (en) * | 1992-03-03 | 1993-02-02 | Digital Equipment Corporation | Heat dissipation apparatus |
US5309979A (en) * | 1993-06-08 | 1994-05-10 | Delco Electronics Corp. | Self clamping heat sink assembly |
US5343362A (en) * | 1994-01-07 | 1994-08-30 | Zytec Corporation | Heat sink assembly |
US5450284A (en) * | 1994-02-17 | 1995-09-12 | Spacelabs Medical, Inc. | Heat sink and transistor retaining assembly |
EP0855089B1 (en) * | 1995-10-13 | 2004-07-07 | Aavid Thermalloy LLC | Solderable transistor clip and heat sink |
US5909358A (en) * | 1997-11-26 | 1999-06-01 | Todd Engineering Sales, Inc. | Snap-lock heat sink clip |
US6088226A (en) * | 1999-03-31 | 2000-07-11 | Lucent Technologies, Inc. | Multiple-component clamp and related method for attaching multiple heat-generating components to a heatsink |
JP2005331945A (ja) * | 2004-05-18 | 2005-12-02 | Samsung Sdi Co Ltd | プラズマ表示装置 |
SE529673C2 (sv) * | 2004-09-20 | 2007-10-16 | Danaher Motion Stockholm Ab | Kretsarrangemang för kylning av ytmonterade halvledare |
JP4457895B2 (ja) * | 2005-01-14 | 2010-04-28 | 船井電機株式会社 | 電源装置、並びにそれに適用可能な放熱部材固定構造及び回路基板 |
CN101202529A (zh) * | 2006-12-11 | 2008-06-18 | 丹佛斯传动有限公司 | 电子装置及电动机变频器 |
JP2008218840A (ja) * | 2007-03-06 | 2008-09-18 | Funai Electric Co Ltd | Ic固定構造 |
TW200846881A (en) * | 2007-05-18 | 2008-12-01 | Acbel Polytech Inc | Mounting device for chips and heat dissipating fins |
JP5728865B2 (ja) * | 2010-01-07 | 2015-06-03 | 株式会社リコー | 放熱機構、及び放熱板の支え金具 |
TW201217809A (en) * | 2010-10-27 | 2012-05-01 | Hon Hai Prec Ind Co Ltd | Memory load adapter board |
US9312201B2 (en) * | 2010-12-30 | 2016-04-12 | Schneider Electric It Corporation | Heat dissipation device |
US8893770B2 (en) * | 2011-07-29 | 2014-11-25 | Schneider Electric It Corporation | Heat sink assembly for electronic components |
CN102646648B (zh) * | 2012-03-30 | 2014-12-03 | 台达电子企业管理(上海)有限公司 | 半导体开关绝缘保护装置以及电源组件 |
KR101859095B1 (ko) * | 2012-04-27 | 2018-05-17 | 엘나 가부시키가이샤 | 알루미늄 전해 콘덴서 및 그 밀봉 고무 |
US20160057891A1 (en) * | 2013-05-03 | 2016-02-25 | Schneider Electric USA, Inc. | Heat sink and method of assemblying |
US9313923B2 (en) * | 2014-05-07 | 2016-04-12 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Multi-component heatsink with self-adjusting pin fins |
CN206042603U (zh) * | 2016-09-20 | 2017-03-22 | 深圳市好盈科技有限公司 | 一种电子调速器电路板的防水防腐蚀结构 |
GB2563186A (en) * | 2017-01-30 | 2018-12-12 | Yasa Motors Ltd | Semiconductor arrangement |
GB2559180B (en) * | 2017-01-30 | 2020-09-09 | Yasa Ltd | Semiconductor cooling arrangement |
CN207706609U (zh) * | 2017-12-26 | 2018-08-07 | 天津诚意创达科技有限公司 | 一种可快速导热的开关电源散热装置 |
JP7155571B2 (ja) * | 2018-03-27 | 2022-10-19 | ブラザー工業株式会社 | 電子部品実装装置 |
US10861767B2 (en) * | 2018-05-11 | 2020-12-08 | Semiconductor Components Industries, Llc | Package structure with multiple substrates |
JP7176318B2 (ja) * | 2018-09-19 | 2022-11-22 | Tdk株式会社 | 電気機器及び放熱器 |
JP7288363B2 (ja) * | 2019-07-10 | 2023-06-07 | ダイヤゼブラ電機株式会社 | 電子機器および電子制御装置 |
-
2019
- 2019-11-18 EP EP23192848.2A patent/EP4307850A3/en active Pending
- 2019-11-18 CN CN201980018870.2A patent/CN113141785B/zh active Active
- 2019-11-18 EP EP19953431.4A patent/EP4054299B1/en active Active
- 2019-11-18 WO PCT/CN2019/119297 patent/WO2021097633A1/zh unknown
-
2022
- 2022-05-18 US US17/747,810 patent/US20220279643A1/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070091564A1 (en) * | 2005-10-25 | 2007-04-26 | Malone Christopher G | Air duct with airtight seal |
CN208210525U (zh) * | 2018-01-10 | 2018-12-07 | 李思洁 | 一种防水防尘散热系统 |
CN208272839U (zh) * | 2018-06-13 | 2018-12-21 | 成都光电传感技术研究所有限公司 | 一种散热结构及电源变换器 |
CN109952007A (zh) * | 2019-04-24 | 2019-06-28 | 深圳英飞源技术有限公司 | 一种高防护的电子产品 |
Also Published As
Publication number | Publication date |
---|---|
EP4054299A1 (en) | 2022-09-07 |
WO2021097633A1 (zh) | 2021-05-27 |
US20220279643A1 (en) | 2022-09-01 |
EP4054299B1 (en) | 2023-10-11 |
CN113141785B (zh) | 2022-10-18 |
EP4054299A4 (en) | 2022-11-16 |
EP4307850A2 (en) | 2024-01-17 |
EP4307850A3 (en) | 2024-04-17 |
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