CN113056092A - 布线基板 - Google Patents

布线基板 Download PDF

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Publication number
CN113056092A
CN113056092A CN202011551560.8A CN202011551560A CN113056092A CN 113056092 A CN113056092 A CN 113056092A CN 202011551560 A CN202011551560 A CN 202011551560A CN 113056092 A CN113056092 A CN 113056092A
Authority
CN
China
Prior art keywords
ground
interlayer
conductor
conductors
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011551560.8A
Other languages
English (en)
Chinese (zh)
Inventor
久保昇
石崎正人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
NGK Electronics Devices Inc
Original Assignee
NGK Insulators Ltd
NGK Electronics Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd, NGK Electronics Devices Inc filed Critical NGK Insulators Ltd
Publication of CN113056092A publication Critical patent/CN113056092A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN202011551560.8A 2019-12-27 2020-12-24 布线基板 Pending CN113056092A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019238364 2019-12-27
JP2019-238364 2019-12-27

Publications (1)

Publication Number Publication Date
CN113056092A true CN113056092A (zh) 2021-06-29

Family

ID=76508208

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011551560.8A Pending CN113056092A (zh) 2019-12-27 2020-12-24 布线基板

Country Status (2)

Country Link
JP (1) JP7455730B2 (ja)
CN (1) CN113056092A (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11312760A (ja) * 1998-04-28 1999-11-09 Kyocera Corp 高周波用配線基板
JP2003282783A (ja) * 2002-03-26 2003-10-03 Kyocera Corp 高周波回路用パッケージ
CN105323956A (zh) * 2014-05-30 2016-02-10 京瓷电路科技株式会社 布线基板
CN109417054A (zh) * 2016-06-27 2019-03-01 Ngk电子器件株式会社 高频用陶瓷基板及高频用半导体元件收纳封装体
JP2019062114A (ja) * 2017-09-27 2019-04-18 住友電気工業株式会社 光受信モジュール用パッケージ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3346752B2 (ja) * 1999-11-15 2002-11-18 日本電気株式会社 高周波パッケージ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11312760A (ja) * 1998-04-28 1999-11-09 Kyocera Corp 高周波用配線基板
JP2003282783A (ja) * 2002-03-26 2003-10-03 Kyocera Corp 高周波回路用パッケージ
CN105323956A (zh) * 2014-05-30 2016-02-10 京瓷电路科技株式会社 布线基板
CN109417054A (zh) * 2016-06-27 2019-03-01 Ngk电子器件株式会社 高频用陶瓷基板及高频用半导体元件收纳封装体
JP2019062114A (ja) * 2017-09-27 2019-04-18 住友電気工業株式会社 光受信モジュール用パッケージ

Also Published As

Publication number Publication date
JP7455730B2 (ja) 2024-03-26
JP2021108359A (ja) 2021-07-29

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