CN112970198A - 高速开关电路配置 - Google Patents
高速开关电路配置 Download PDFInfo
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- CN112970198A CN112970198A CN201980071990.9A CN201980071990A CN112970198A CN 112970198 A CN112970198 A CN 112970198A CN 201980071990 A CN201980071990 A CN 201980071990A CN 112970198 A CN112970198 A CN 112970198A
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Abstract
一种低电感电开关电路布局(200),包括双面基板(202),该双面基板(202)具有贯穿基板的多个电通孔(220、222)。电容器(212)被布置基板的第一面且在第一通孔(220)上方,电接收器(214)被设置基板的第一面且在第二通孔(222)上方。被配置为产生多个电流脉冲的开关组件(216)被布置在基板的第二面且在第一通孔和第二通孔下方。
Description
相关申请的交叉引用
本申请要求于2018年10月30日提交的题为“高速开关电路配置”、序列号为62/752,460的美国临时专利申请的权益,该临时专利申请的全部内容通过引用被完全并入本文。
技术领域
本申请涉及用于电子电路系统,尤其涉及一种高速开关电路。
背景技术
图1A示出了基本的开关电路100,其中,具有漏极D和源极S的电子开关116穿过负载(或电接收器114)被连接到电容器112。该电容器112可以通过CA连接进行充电。在本申请中,通向电容器112被表示为通过CA连接。目前,这种电路的电路布局对于开关电路100而言,不足以产生满足特定幅度和持续时间规范的脉冲。当产生快速大电流脉冲(例如,脉冲的脉冲宽度是10纳秒或更短的持续时间且幅度大于一安培)时,电路元件的物理布局将对性能产生影响。不正确的布局(尤其是元件之间过大的电引线距离)使得如图1B所示的电流回路180中的电感和/或电阻增大,从而减小了可流经电路100的最大电流并且增大了脉冲宽度(持续时间)。因此,工业上需要解决上述缺陷。
发明内容
本发明的实施例提供了一种高速开关电路配置及其制造方法。简而言之,本发明涉及一种采用双面基板的低电感电开关电路布局,并且该双面基板具有多个贯穿基板的电通孔。在基板的第一面上、在第一通孔上方设置有电容器,在基板的第一面上、在第二通孔上方设置有电接收器。被配置为产生多个电流脉冲的开关组件被布置在基板的第二面上且在第一通孔和第二通孔下方。
在研究以下附图和具体实施方式之后,本发明的其它系统、方法和特征对于本领域的普通技术人员而言将是或者变得是显而易见。所有这些附加的系统、方法和特征都被包括在本说明书中,同时也都被涵盖在本发明的范围中并由所附的权利要求所保护。
附图说明
本申请中包括附图以提供对本发明的进一步理解,并且其包含在本说明书中并构成本说明书的一部分。附图示出了本发明的实施例,并与说明书一同用于解释本发明的原理。
图1A为一开关电路的电路图。
图1B示出了图1A所示的开关电路的电路图,其表明了电流回路。
图2A为从侧面看开关电路的第一实施例的电路布局的示意图。
图2B为图2A所示的开关电路200的细节,其表明了电流回路。
图3A为从侧面看开关电路的第二实施例的电路布局的示意图。
图3B为图3A所示的第二实施例的电路布局的示意图,其显示了表面安装封装部分。
图4为从侧面看开关电路的第三实施例的电路布局的示意图。
图5为从侧面看开关电路的第四实施例的电路布局的示意图。
图6为示出了电容器和负载阵列的第一实施例的电路图。
图7为用于布置低电感电开关电路的方法的示例性第一实施例的流程图。
具体实施方式
现在将详细参考本发明的实施例,其示例在附图中示出。在可能的情况下,可以在附图和说明书中使用相同的附图标记来表示相同或相似的部件。
如本公开中所使用的,“横向”或“水平”的电流路径是指沿着电路板表面的电流方向,例如经由电路板迹线的电流路径。“垂直”的电流路径是指基本上垂直于电路板表面的电流方向,例如,使用通孔经由电路板从电路板顶表面到电路板底表面的电流路径。如本文所用,“基本上”是指“非常接近”,或在典型的制造公差内。
如上文中背景技术部分所指出的,图1A为现有技术中一开关电路的电路图,其包括如下组件:电容器112、电接收器114(激光二极管)和开关116(场效应晶体管(FieldEffect Transistor,FET)开关元件)。开关116具有端子118(G)以用于输入触发脉冲以接通开关116,并且通过CA通向电容器112以允许将电容器112充电至电压电平。尽管图1A中是通过具有源极(S)、漏极(D)和栅极(G)的FET的符号来描述电开关116,但是也可以使用具有类似功能的任何电子开关,即输入端子、输出端子和触发端子。
图2A为从侧面示出了开关电路200的示例性实施例的示意图。基板202(例如但不限于印刷电路板(Printed Circuit Board,PCB))被配置为对第一面204上以及在与第一面204相对的第二面206上的电路元件。第一面204和第二面206隔开一基板厚度208,例如,小于1000微米,优选地小于500微米,并且理想地小于175微米。基板202包括被定向为基本上垂直于基板202的至少两个贯穿基板的电通孔220、222。图2A示出了具有第一中心轴线260的第一通孔220和具有第二中心轴线262的第二通孔222。第一中心轴线260从第一面204延伸穿过基板202到第二面206。第二中心轴线262从第一面204延伸到第二面206。每个通孔220、222可以在第一面204上设置第一电触点并且在第二面206上设置第二电触点,使得被设置在第一面204上且具有到第一电触点的电连接的第一组件可以被电连接到被设置在第二面206上且具有到第二电触点的电连接的第二组件。这种电连接可以具有比典型的(较长的)电连接低得多的电感,典型的电连接例如通过引线接合连接或电路板迹线将组件横向电连接。为了清楚起见,图2A中并未示出通孔220、222的第一电触点/第二电触点,而是示出了直接到通孔220、222的电连接。
电容器212具有电连接,例如在电接收器214的第一面上的第一电容器引线接合焊盘274和第二电容器引线接合焊盘275,以及在电容器212的第二面上的电路板连接器232。引线接合焊盘274和275之间可以电连接。例如,引线接合焊盘274、275可以为较大焊盘的不同区域。在替选实施例中,可以使用不同类型的电连接,例如金属接片,以及其它可能的电连接。电容器212具有厚度209,例如,小于1000微米,优选小于500微米,并且理想地小于175微米。电容器212被布置为在基板第一面204上被附接到基板202,例如经由电容器电路板连接器232和第一通孔220之间的焊料连接。值得注意的是,虽然图2A中为了直观清楚起见所示出的电容器电路板连接器232相对较厚,但是该电容器电路板连接器通常可以是非常薄的,例如可以为导电金属的薄迹线或箔。
开关组件216被配置成产生多个电流脉冲,该开关组件216被布置为被附接在基板202的第二面206上。开关组件216可以使用开关组件216上的栅极电触点238,通过通孔220被电连接到电容器212。尽管为了简单起见,图2A中仅示出了单个漏极电触点238,但是漏极电触点238还可以通过一个、两个或更多个的物理电触点来实现。将开关组件216布置为通过基板202与电容器212直接相对,以在电容器212和开关组件216之间提供了非常小的连接长度,从而减小了电阻和电感;否则,在传统的单面电路板中所使用的横向电连接(例如,电路板迹线和/或引线接合)可能会引入这些电阻和电感。
电接收器214(例如激光二极管或激光二极管阵列)具有电连接,例如在电接收器214的第一面上的电接收器引线接合焊盘276,以及在电接收器214的第二面上的电路板连接器234。在替选实施例中,可以使用不同类型的电连接,例如金属接片,以及其它可能的电连接。电接收器214通过电接收器电路板连接器234被布置在基板202的第一面204上,该电接收器电路板连接器234相邻并电连接于第二通孔222,第二通孔222穿过基板202将电接收器214电连接到开关组件216上的源极电触点238。开关组件216可以使用开关组件216上的源极电触点236经由通孔222被电连接到电接收器214。尽管为了简单起见,图2A中仅示出了单个源极电触点236,但是源极电触点236可以通过一个、两个或更多个的物理电触点来实现。为了清楚起见,在附图中并未示出开关组件216的栅极和触发信号。应当注意的是,尽管此处为了清楚起见,在某种程度上简化了对上述电流路径电路的描述,但是下文中将对整个电路路径进行描述。
尽管如图2A所示,电接收器214可以具有与电容器212相同的厚度209,但在替选实施例中,电接收器214可以比电容器212更厚或更薄。
尽管图2A中仅示出了单个的第一通孔220,以将基板202的第一面204上的电容器212连接到基板202的第二面206上的开关组件216,但是还可以使用两个或更多个的第一通孔220来增加导电性和导热性,并且减小基板202的第一面204和第二面206之间的电感。同样,还可以通过多于一个的第二通孔222将开关组件216连接到电接收器214。一个或多个引线接合226可用于通过电容器212上的第二电容器引线接合焊盘275和电接收器214上的电接收器引线接合焊盘276,来将电容器212与电接收器214进行电连接。在替选实施例中,可以使用不同类型的电连接,例如金属接片,以及其它可能的电连接。
通过减小开关组件216、电容器212和电接收器214之间的互连长度,可以改善脉冲产生特性。在第一实施例中,经由电容器212、开关组件216和电接收器214之间电连接的电流回路280(如图2B所示)可以具有低于5纳亨的总电感水平。优选地,每个互连电感小于5纳亨,更优选地每个互连电感小于1纳亨,甚至进一步优选地总互连电感小于1纳亨。在电容器212、开关组件216和电接收器214之间的电流回路280(如图2B所示)的电连接的累计长度优选地小于5毫米。每个互连长度小于5毫米,优选地小于1毫米。例如,当互连为诸如焊料或导电环氧树脂之类的导电材料制成的接合线时,互连长度可以短至10微米。通过这种对互连的改进,可以实现具有至少一安培的电流幅度和小于1纳秒的脉冲持续时间的脉冲。
开关组件216、电容器212和电接收器214在基板202的两个面204、206的布置将被调节至具有最小的互连长度。为了清楚起见,在附图中并未示出开关组件216的栅极和触发信号。图2B为图2A的开关电路200的细节,其将电流回路280显示为黑线。在第一实施例中,经由电容器212、电接收器214和开关组件216的电流回路280将不横穿基板202的任一表面上的横向电路路径/迹线。电流回路280被表示为开始于电容器212,横穿经过电接收器214、基板202和开关组件216,然后再次穿过基板202,并且终止于电容器212处。包括连接组件在内,电流回路280横穿以下元件:212-275-226-276-214-234-222-236-216-238-220-232-212。相比于以前的电路布局中电路板的表面上包括有横向电流路径,电路200的布局显著减小了电流回路280中的电感。如图2A所示,每个通孔220、222均具有基本上垂直于基板202的轴线260、262。通过将电容器212和开关组件216中的每一个都布置为与第一通孔的轴线260相交,可以在基板的第一面204和/或基板的第二面206的表面上没有任何横向连接(例如引线接合或迹线)的情况下,实现电容器212和开关组件216之间的电互连。类似地,通过将电接收器214和开关组件216中的每一个都布置为与第二通孔的轴线262相交,可以在基板的第一面204和/或基板的第二面206的表面上没有任何横向连接的情况下,实现电接收器214和开关组件216之间的电互连。
电路200中还可以包括额外的电路元件,例如,电容器充电元件230可以被附接到基板202的第一面204,并且被电连接到电容器212,例如,经由第二充电元件引线接合焊盘273至第一电容器引线接合焊盘274之间的引线接合连接224进行电连接;或者替选地,经由基板上的迹线(未示出)进行电连接。在替选实施例中,例如,在具有电容器/负载阵列的实施例中,电路200中可以包括多于一个的充电元件230。诸如控制器250之类的其它电路元件可以以类似的方式被包含在电路200中,例如,经由第一充电元件引线接合焊盘272与控制器引线接合焊盘271之间的引线接合连接240。
由控制器250、电容器充电元件230和电容器212之间的电连接240、224所增加的电感将不会降低电流回路280的脉冲产生性能。优选地,额外的电路元件230、250和电容器212之间的引线接合连接224相对于电流回路280具有更大的电感,从而有助于将额外的电路元件230、250的电寄生效应与电流回路280隔开。
应当注意的是,尽管此处所描述的实施例是基于图1A所示的电路,但是各种修改均是可能的。例如,在实施例中所实现的组件112、114和/或116的布置顺序和电走向可以不同于图1A所示的电路布置,并且例如开关116可以为任何类型的电开关。同样地,尽管图2A示出了单个开关电路,但是类似的配置也可以被实现于开关电路阵列中。例如,图1所示的电容器212可以被电路600(如图6所示)所代替,该电路600具有电容器和/或电接收器阵列,例如用于多通道开关的电容器和/或电接收器阵列。控制器250(如图2A所示)可以被配置为控制哪一电容器112(如图6所示)被充电,并且因此由哪一负载信道来接收脉冲电流。
尽管通常可以通过使用线连在一起的数个电容器来调节通道的电容值,但是这种布置可能会不期望地增加电路中的电感,从而降低性能。因此,可能希望使用尽可能少的电容器;使用单个电容器,而并非是将数个电容器组合在一起;通过调整电容器的物理尺寸来调整该单个电容器的电容参数。例如,被串联在一起的一系列单独的电容器可以由单个电容器所代替,该单个电容器的诸如长度之类的尺寸被指定以具有所期望的电特性。具体地,这可以用于调整开关电路的电容,而不会引入不期望的电感增加。
图3A为从侧面看开关电路的第二实施例300的电路布局的示意图。在第二实施例300中,第一基板301和第二基板302采用背对背的方式被布置,并且经过通孔320来连接该两个电路板301、302,还利用该通孔320来在第一电路板301的前面的第一电路板组件312、314和第二电路板302的前面的第二电路板组件316、318之间提供电连接;而与第一实施例200类似,其可以使得组件312、314、316之间的横向连接最小,其中,组件312和314具有顶部触点和底部触点,而组件316在一面上具有触点。例如,第一电路板组件可以包括电容器312和激光二极管(电接收器)314,并且第二电路板组件可以包括芯片电阻器318和开关316。图3A示出了通孔接触焊盘325,其在电路板301、302的前表面/后表面上提供到通孔320的电连接表面。各组件的顶表面之间的电连接可以通过引线接合324、326来实现。焊料328可以在组件底表面和通孔接触焊盘325之间提供电连接。同样地,第一电路板301和第二电路板302的通孔接触焊盘325可以与焊料328电连接。
尽管第一基板301可以为电路板,但是替选地,如图3B所示,第一基板可以包括用于引线框式的表面安装封装390的引线框395,其由点划线表示。此处,电容器312和电接收器314被安装到表面安装封装390中的引线框底板(第一基板301)上,引线框焊盘395为封装390的顶部电接触焊盘和底部电接触焊盘提供了导电表面,其中,顶部焊盘提供到电容器312和电接收器314的电接触,而底部焊盘提供到第二基板302(例如基板302)的电接触。引线框焊盘395可以代替通孔320在第一基板301的顶部和底部之间提供导电性,其中,引线框接触焊盘396(例如金属层)可以用作类似于通孔接触焊盘325的电接触表面。该表面安装封装390可以是例如但不限于方形扁平无引脚(Quad Flat No-leads,QFN)封装或双平面无引线(Dual Flat No-leads,DFN)封装。
图4为从侧面看开关电路的第三实施例400的电路布局的示意图。在第三实施例中,具有被安装到组件基板202的两个表面之一的组件312、314、318、316中的每一个,该组件基板202类似于第一实施例的双面基板202。在第三实施例400中,如同第一实施例200,电容器312和电接收器314被安装在组件基板202上与开关316相对的一面,并且电流回路480的电连接通过基板通孔320来实现。第三实施例中增加了与组件基板202背对背安装、且位于电接收器314下方的导热基板404,并且在组件基板202和导热基板404中均具有通孔320,以将热量从电接收器314传递到被安装在导热基板404的前面上的散热器450,同时仍使得横向电连接最小。被设置在组件基板202和导热基板404之间的热导体和电绝缘体329在组件基板202和导热基板404之间提供热导管,而并不在组件基板202和导热基板404之间提供电导管。替选地,基板404和电绝缘体329可由任何不导电的材料形成的单个导热组件所代替。替选地,散热器450可由导热但不导电的材料制成,而在这种情况下,尽管不需要电绝缘体,但其仍可被使用。
图5为从侧面看开关电路的第四实施例500的电路布局的示意图。第四实施例500类似于第三实施例400。与第三实施例一样,第一面组件312、314被安装在双面基板202的第一表面上,而第二面组件316、318被安装在双面基板202的第二表面上。而与第三实施例400相反的是,第四实施例500并不使用第三实施例400中的导热基板404,而是物理地布置散热器550,以使得散热器550可以通过热导体和电绝缘体329被热附接到双面基板202上。与第三实施例一样,热量通过基板202中的通孔320从散热器314被传递到散热器550,同时仍使得横向电连接最小。
在替选实施例中,例如,在不需要电绝缘体的情况下,散热器550可以由导热但不导电的材料制成。
在一些操作条件下,电接收器314可能发热。第一实施例和第二实施例的组件布置可以使得通孔320在开关316和电接收器314之间传导热量。上文所述的第三实施例和第四实施例包括散热器404、505,从而为电接收器314提供热冷却并且降低电接收器314和开关316之间的导热性。这种布置的折衷是沿着基板202增加短的(优选地)横向电流路径460,以在电接收器314和开关316之间传递电流。
图7为用于布置低电感电开关电路的方法的示例性第一实施例的流程图700。值得注意的是,流程图中的任何过程描述或流程框图均应被理解为表示包括用于在过程中实现特定逻辑功能的一个或多个指令的模块、片段、代码部分或步骤,并且其替选的实现方式均被包括在本发明的范围内。在本发明的范围内,根据所涉及的功能,正如本领域技术人员所理解的那样,本发明的功能模块可以按照与所示或所讨论的顺序不同的顺序执行,包括按照基本上同时或按照相反的顺序执行。在此参考图2所示的低电感电开关电路布局(200)来描述该方法。
如框710所示,本发明设置有双面基板(202)。该基板具有贯穿基板的多个电通孔(220、222),其被定向为基本上垂直于基板的第一面和第二面,并且每个通孔均具有被设置在第一面上的第一电触点,该第一电触点通过基板被电连接到第二电触点,而该第二电触点被设置在第二面且与第一电触点相对。如框720所示,电容器(212)通过电容器电路板连接器被附接到基板的第一面,该电容器电路板连接器邻近且电连接于第一通孔(220)。如框730所示,电接收器(214)通过电接收器电路板连接器被附接到基板的第一面,该电接收器电路板连接器邻近且电连接于第二通孔(222)。如框740所示,开关组件(216)被附接到基板的第二面,并且邻近且电连接于第一通孔。在一些实施例中,该开关组件还邻近且电连接于第二通孔。
对于本领域技术人员显而易见的是,在不脱离本发明的范围或精神的情况下,可以对本发明的结构进行各种修改和变化。鉴于上文的记载,本发明旨在覆盖落入所附权利要求及其等同物的范围内的本发明的修改和变化。
Claims (15)
1.一种低电感电开关电路布局(200),包括:
基板(202),其进一步包括:
第一面(204);
第二面(206),其与所述第一面相对并且与所述第一面隔开一基板厚度(208);和
贯穿基板的多个电通孔(220、222),其中,所述通孔被定向为基本上垂直于所述基板的所述第一面和所述第二面,每个所述通孔还包括被设置在所述第一面上的第一电触点,所述第一电触点通过所述基板被电连接到第二电触点,所述第二电触点被设置在所述第二面上且与所述第一电触点相对;
电容器(212),其中,所述电容器包括在电容器第一面上的第一面电触点(274、275)和在电容器第二面上的电路板连接器(232),所述电容器(212)通过所述电容器电路板连接器被布置在所述基板的所述第一面上,所述电容器电路板连接器邻近并电连接于第一通孔(220);
电接收器(214),其中,所述电接收器包括在电接收器第一面上的第一面电触点(276)和在电接收器第二面上的电接收器电路板连接器(234),所述电接收器通过所述电接收器电路板连接器被布置在所述基板的所述第一面上,所述电接收器电路板连接器邻近且电连接于第二通孔(222);和
开关组件(216),其中,所述开关组件被配置为产生多个电流脉冲,所述开关组件被布置在所述基板的所述第二面上、邻近且电连接于所述第一通孔。
2.根据权利要求1所述的电路,其中,所述开关组件(216)被布置在所述基板的所述第二面上、邻近且电连接于所述第一通孔和所述第二通孔。
3.根据权利要求1所述的电路,其中,所述电容器被配置为通过所述开关和所述电接收器释放电流脉冲。
4.根据权利要求1所述的电路,还包括导电元件(226),其中,所述导电元件被配置为将所述电容器的所述第一面电触点电连接到所述电接收器的所述第一面电触点。
5.根据权利要求4所述的电路,其中,包括所述电容器、所述开关组件和所述电接收器之间电连接的电流回路(280)的总电感水平低于5nH。
6.根据权利要求4所述的电路,其中,包括所述电容器、所述开关组件和所述电接收器之间电连接的电流回路的累计长度小于5mm。
7.根据权利要求1所述的电路,其中,
所述多个通孔中的每一个通孔的轴线基本上垂直于所述基板的所述第一面和所述第二面;
所述电容器和所述开关组件与所述第一通孔的轴线相交;
所述开关组件与所述第一通孔和/或所述第二通孔的轴线相交;和
所述电接收器组件与所述第二通孔的轴线相交。
8.根据权利要求1所述的电路,其中,所述基板包括印刷电路板。
9.根据权利要求1所述的电路,还包括散热器(450、550),其中,所述散热器包括导热表面,所述导热表面被布置在所述基板的所述第二面上且与所述电接收器相对、并且与所述第二通孔热连通。
10.一种布置低电感电开关电路(200)的方法,包括:
设置基板(202),其中,所述基板进一步包括:
第一面(204);
第二面(206),其与所述第一面相对;和
贯穿基板的多个电通孔(220、222),其中,所述通孔被定向为基本上垂直于所述基板的所述第一面和所述第二面,每个所述通孔还包括被设置在所述第一面上的第一电触点,所述第一电触点通过所述基板被电连接到第二电触点,所述第二电触点被设置在所述第二面上且与所述第一电触点相对;
通过电容器电路板连接器将电容器(212)附接到所述基板的所述第一面,其中,所述电容器电路板连接器邻近且电连接于第一通孔(220);
通过电接收器电路板连接器将电接收器(214)附接到所述基板的所述第一面,其中,所述电接收器电路板连接器邻近且电连接于所述第一通孔和第二通孔(222);和
将开关组件(216)附接到所述基板的所述第二面,其中,所述开关组件邻近且电连接于所述第一通孔。
11.根据权利要求10所述的方法,其中,所述开关组件(216)还与所述第二通孔电连接。
12.根据权利要求10所述的方法,还包括:附接散热器(450、550);其中,所述散热器包括导热表面,所述导热表面被布置在所述基板的所述第二面上且与所述电接收器相对、并且与所述第二通孔热连通。
13.一种低电感电开关电路布局(300),包括:
第一基板(301)和第二基板(302),其中,每个基板进一步包括:
第一面;
第二面,其与所述第一面相对并且与所述第一面隔开一基板厚度;和
贯穿基板的多个电通孔(320),其中,所述通孔(320)被定向为基本上垂直于所述基板的所述第一面和所述第二面,每个所述通孔还包括被设置在所述第一面上的第一电触点,所述第一电触点通过所述基板被电连接到第二电触点,所述第二电触点被设置在所述第二面上且与所述第一电触点相对;
其中,所述第一基板和所述第二基板被背对背布置,所述第一基板的第二面邻近所述第二基板的第二面;
电容器(312),其中,所述电容器被布置在所述第一基板的第一面上、邻近并电连接于第一电路板第一通孔;
电接收器(314),其中,所述电接收器被布置在所述第一基板的第一面上、邻近且电连接于第二通孔;和
开关组件(316),其中,所述开关组件被配置为产生多个电流脉冲,所述开关组件被布置在所述第二基板的第一面上、邻近且电连接于所述第一通孔和所述第二通孔,
其中,所述第一基板第一通孔被布置为邻近且电连接于所述第二基板第一通孔,所述第一基板第二通孔被布置为邻近且电连接于所述第二基板第二通孔,所述第一电路板第一通孔和第二电路板第一通孔以及所述第一电路板第二通孔和第二电路板第二通孔被布置为提供从所述开关组件到所述电接收器以及所述电容器到所述开关组件的垂直电流路径。
14.根据权利要求13所述的低电感电开关电路布局,还包括:
引线框样式表面安装封装,其中,所述引线框样式表面安装封装包括引线框,
其中,所述第一基板包括所述引线框,并且所述电接收器和所述电容器被安装到所述引线框并且与所述引线框电连接和热连通。
15.根据权利要求14所述的低电感电开关电路布局,其中,所述第二基板包括印刷电路板,并且所述引线框样式表面安装封装被安装在所述印刷电路板上。
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