CN112584631A - 层积结构体 - Google Patents
层积结构体 Download PDFInfo
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- CN112584631A CN112584631A CN202011038260.XA CN202011038260A CN112584631A CN 112584631 A CN112584631 A CN 112584631A CN 202011038260 A CN202011038260 A CN 202011038260A CN 112584631 A CN112584631 A CN 112584631A
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- Prior art keywords
- curable resin
- resin layer
- support
- resin
- cured
- Prior art date
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
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| JP (1) | JP7523303B2 (ko) |
| KR (1) | KR20210038382A (ko) |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010023419A (ja) * | 2008-07-23 | 2010-02-04 | Nippon Steel Corp | 有機樹脂ラミネート鋼板 |
| CN105504677A (zh) * | 2014-10-08 | 2016-04-20 | 太阳油墨制造株式会社 | 干膜、固化物及印刷电路板 |
| CN105899633A (zh) * | 2014-02-05 | 2016-08-24 | 大日本印刷株式会社 | 粘合剂组合物和使用了该粘合剂组合物的粘合膜 |
| CN110177448A (zh) * | 2018-02-20 | 2019-08-27 | 拓自达电线株式会社 | 电磁波屏蔽膜 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5659673B2 (ja) | 2010-10-06 | 2015-01-28 | 住友ベークライト株式会社 | 樹脂シート、積層板、電子部品、プリント配線板及び半導体装置 |
| CN103444276A (zh) | 2011-03-14 | 2013-12-11 | 住友电木株式会社 | 积层用预浸料 |
| JP6056387B2 (ja) | 2012-11-05 | 2017-01-11 | 味の素株式会社 | 離型フィルム、接着フィルム、及びプリント配線板の製造方法 |
| JP6467774B2 (ja) | 2014-02-28 | 2019-02-13 | 味の素株式会社 | プリント配線板の製造方法 |
| JP2015230901A (ja) | 2014-06-03 | 2015-12-21 | 三菱瓦斯化学株式会社 | 樹脂積層体及びプリント配線板 |
| JP2016146394A (ja) | 2015-02-06 | 2016-08-12 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、プリント配線板およびその製造方法 |
| CN111527136B (zh) | 2017-12-27 | 2022-12-30 | 东洋纺株式会社 | 陶瓷生片制造用脱模膜 |
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- 2020-09-28 KR KR1020200126400A patent/KR20210038382A/ko not_active Application Discontinuation
- 2020-09-28 CN CN202011038260.XA patent/CN112584631A/zh active Pending
- 2020-09-29 JP JP2020164024A patent/JP7523303B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010023419A (ja) * | 2008-07-23 | 2010-02-04 | Nippon Steel Corp | 有機樹脂ラミネート鋼板 |
| CN105899633A (zh) * | 2014-02-05 | 2016-08-24 | 大日本印刷株式会社 | 粘合剂组合物和使用了该粘合剂组合物的粘合膜 |
| CN105504677A (zh) * | 2014-10-08 | 2016-04-20 | 太阳油墨制造株式会社 | 干膜、固化物及印刷电路板 |
| CN110177448A (zh) * | 2018-02-20 | 2019-08-27 | 拓自达电线株式会社 | 电磁波屏蔽膜 |
Non-Patent Citations (1)
| Title |
|---|
| 王成;俞娟;王晓东;黄培;: "挠性覆铜板用高剥离强度环氧胶的制备及性能", 热固性树脂, no. 05, 30 September 2011 (2011-09-30) * |
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| JP2021054079A (ja) | 2021-04-08 |
| TW202128418A (zh) | 2021-08-01 |
| KR20210038382A (ko) | 2021-04-07 |
| JP7523303B2 (ja) | 2024-07-26 |
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