CN112584631A - 层积结构体 - Google Patents

层积结构体 Download PDF

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Publication number
CN112584631A
CN112584631A CN202011038260.XA CN202011038260A CN112584631A CN 112584631 A CN112584631 A CN 112584631A CN 202011038260 A CN202011038260 A CN 202011038260A CN 112584631 A CN112584631 A CN 112584631A
Authority
CN
China
Prior art keywords
curable resin
resin layer
support
resin
cured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011038260.XA
Other languages
English (en)
Chinese (zh)
Inventor
冈本大地
管众
仲田和贵
中居弘进
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of CN112584631A publication Critical patent/CN112584631A/zh
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN202011038260.XA 2019-09-30 2020-09-28 层积结构体 Pending CN112584631A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019181042 2019-09-30
JP2019-181042 2019-09-30

Publications (1)

Publication Number Publication Date
CN112584631A true CN112584631A (zh) 2021-03-30

Family

ID=75119649

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011038260.XA Pending CN112584631A (zh) 2019-09-30 2020-09-28 层积结构体

Country Status (4)

Country Link
JP (1) JP7523303B2 (ja)
KR (1) KR20210038382A (ja)
CN (1) CN112584631A (ja)
TW (1) TW202128418A (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010023419A (ja) * 2008-07-23 2010-02-04 Nippon Steel Corp 有機樹脂ラミネート鋼板
CN105504677A (zh) * 2014-10-08 2016-04-20 太阳油墨制造株式会社 干膜、固化物及印刷电路板
CN105899633A (zh) * 2014-02-05 2016-08-24 大日本印刷株式会社 粘合剂组合物和使用了该粘合剂组合物的粘合膜
CN110177448A (zh) * 2018-02-20 2019-08-27 拓自达电线株式会社 电磁波屏蔽膜

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5659673B2 (ja) * 2010-10-06 2015-01-28 住友ベークライト株式会社 樹脂シート、積層板、電子部品、プリント配線板及び半導体装置
KR101907713B1 (ko) * 2011-03-14 2018-10-12 스미토모 베이클리트 컴퍼니 리미티드 빌드업용 프리프레그
JP6056387B2 (ja) * 2012-11-05 2017-01-11 味の素株式会社 離型フィルム、接着フィルム、及びプリント配線板の製造方法
JP6467774B2 (ja) 2014-02-28 2019-02-13 味の素株式会社 プリント配線板の製造方法
JP2015230901A (ja) * 2014-06-03 2015-12-21 三菱瓦斯化学株式会社 樹脂積層体及びプリント配線板
JP2016146394A (ja) * 2015-02-06 2016-08-12 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、プリント配線板およびその製造方法
SG11202005633XA (en) * 2017-12-27 2020-07-29 Toyo Boseki Release film for production of ceramic green sheet

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010023419A (ja) * 2008-07-23 2010-02-04 Nippon Steel Corp 有機樹脂ラミネート鋼板
CN105899633A (zh) * 2014-02-05 2016-08-24 大日本印刷株式会社 粘合剂组合物和使用了该粘合剂组合物的粘合膜
CN105504677A (zh) * 2014-10-08 2016-04-20 太阳油墨制造株式会社 干膜、固化物及印刷电路板
CN110177448A (zh) * 2018-02-20 2019-08-27 拓自达电线株式会社 电磁波屏蔽膜

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
王成;俞娟;王晓东;黄培;: "挠性覆铜板用高剥离强度环氧胶的制备及性能", 热固性树脂, no. 05, 30 September 2011 (2011-09-30) *

Also Published As

Publication number Publication date
TW202128418A (zh) 2021-08-01
KR20210038382A (ko) 2021-04-07
JP7523303B2 (ja) 2024-07-26
JP2021054079A (ja) 2021-04-08

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Effective date of registration: 20230801

Address after: Saitama Prefecture, Japan

Applicant after: TAIYO HOLDINGS Co.,Ltd.

Address before: Saitama Prefecture, Japan

Applicant before: TAIYO INK MFG. Co.,Ltd.