TW202128418A - 積層結構 - Google Patents
積層結構 Download PDFInfo
- Publication number
- TW202128418A TW202128418A TW109132300A TW109132300A TW202128418A TW 202128418 A TW202128418 A TW 202128418A TW 109132300 A TW109132300 A TW 109132300A TW 109132300 A TW109132300 A TW 109132300A TW 202128418 A TW202128418 A TW 202128418A
- Authority
- TW
- Taiwan
- Prior art keywords
- curable resin
- resin layer
- support
- resin
- peeled
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP2019-181042 | 2019-09-30 | ||
JP2019181042 | 2019-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202128418A true TW202128418A (zh) | 2021-08-01 |
Family
ID=75119649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109132300A TW202128418A (zh) | 2019-09-30 | 2020-09-18 | 積層結構 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20210038382A (ja) |
CN (1) | CN112584631A (ja) |
TW (1) | TW202128418A (ja) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5146171B2 (ja) * | 2008-07-23 | 2013-02-20 | 新日鐵住金株式会社 | 有機樹脂ラミネート鋼板 |
JP5858347B2 (ja) * | 2014-02-05 | 2016-02-10 | 大日本印刷株式会社 | 粘着剤組成物およびそれを用いた粘着フィルム |
JP6467774B2 (ja) | 2014-02-28 | 2019-02-13 | 味の素株式会社 | プリント配線板の製造方法 |
JP2016074849A (ja) * | 2014-10-08 | 2016-05-12 | 太陽インキ製造株式会社 | ドライフィルム、硬化物およびプリント配線板 |
JP6426865B1 (ja) * | 2018-02-20 | 2018-11-21 | タツタ電線株式会社 | 電磁波シールドフィルム |
-
2020
- 2020-09-18 TW TW109132300A patent/TW202128418A/zh unknown
- 2020-09-28 KR KR1020200126400A patent/KR20210038382A/ko not_active Application Discontinuation
- 2020-09-28 CN CN202011038260.XA patent/CN112584631A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN112584631A (zh) | 2021-03-30 |
JP2021054079A (ja) | 2021-04-08 |
KR20210038382A (ko) | 2021-04-07 |
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