TW202128418A - 積層結構 - Google Patents

積層結構 Download PDF

Info

Publication number
TW202128418A
TW202128418A TW109132300A TW109132300A TW202128418A TW 202128418 A TW202128418 A TW 202128418A TW 109132300 A TW109132300 A TW 109132300A TW 109132300 A TW109132300 A TW 109132300A TW 202128418 A TW202128418 A TW 202128418A
Authority
TW
Taiwan
Prior art keywords
curable resin
resin layer
support
resin
peeled
Prior art date
Application number
TW109132300A
Other languages
English (en)
Chinese (zh)
Inventor
岡本大地
管衆
仲田和貴
中居弘進
Original Assignee
日商太陽油墨製造股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商太陽油墨製造股份有限公司 filed Critical 日商太陽油墨製造股份有限公司
Publication of TW202128418A publication Critical patent/TW202128418A/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW109132300A 2019-09-30 2020-09-18 積層結構 TW202128418A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019181042 2019-09-30
JPJP2019-181042 2019-09-30

Publications (1)

Publication Number Publication Date
TW202128418A true TW202128418A (zh) 2021-08-01

Family

ID=75119649

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109132300A TW202128418A (zh) 2019-09-30 2020-09-18 積層結構

Country Status (4)

Country Link
JP (1) JP2021054079A (ja)
KR (1) KR20210038382A (ja)
CN (1) CN112584631A (ja)
TW (1) TW202128418A (ja)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5146171B2 (ja) * 2008-07-23 2013-02-20 新日鐵住金株式会社 有機樹脂ラミネート鋼板
JP5659673B2 (ja) * 2010-10-06 2015-01-28 住友ベークライト株式会社 樹脂シート、積層板、電子部品、プリント配線板及び半導体装置
KR101907713B1 (ko) * 2011-03-14 2018-10-12 스미토모 베이클리트 컴퍼니 리미티드 빌드업용 프리프레그
JP6056387B2 (ja) * 2012-11-05 2017-01-11 味の素株式会社 離型フィルム、接着フィルム、及びプリント配線板の製造方法
JP5858347B2 (ja) * 2014-02-05 2016-02-10 大日本印刷株式会社 粘着剤組成物およびそれを用いた粘着フィルム
JP6467774B2 (ja) 2014-02-28 2019-02-13 味の素株式会社 プリント配線板の製造方法
JP2015230901A (ja) * 2014-06-03 2015-12-21 三菱瓦斯化学株式会社 樹脂積層体及びプリント配線板
JP2016074849A (ja) * 2014-10-08 2016-05-12 太陽インキ製造株式会社 ドライフィルム、硬化物およびプリント配線板
JP2016146394A (ja) * 2015-02-06 2016-08-12 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、プリント配線板およびその製造方法
MY192990A (en) * 2017-12-27 2022-09-20 Toyo Boseki Mold release film for production of ceramic green sheet
JP6426865B1 (ja) * 2018-02-20 2018-11-21 タツタ電線株式会社 電磁波シールドフィルム

Also Published As

Publication number Publication date
KR20210038382A (ko) 2021-04-07
JP2021054079A (ja) 2021-04-08
CN112584631A (zh) 2021-03-30

Similar Documents

Publication Publication Date Title
TWI721070B (zh) 乾薄膜及印刷配線板
KR100884290B1 (ko) 절연용 수지조성물 및 이를 이용한 적층체
JP2016074849A (ja) ドライフィルム、硬化物およびプリント配線板
TW201839040A (zh) 乾膜、硬化物、印刷配線板、及硬化物之製造方法
JP2016079384A (ja) ドライフィルム、硬化物およびプリント配線板
TWI788292B (zh) 樹脂組成物、樹脂片、多層印刷電路板及半導體裝置
KR102053322B1 (ko) 감광성 수지 조성물 및 감광성 절연 필름
JP6710034B2 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
TWI744332B (zh) 樹脂組成物、樹脂片、多層印刷電路板及半導體裝置
KR20180109722A (ko) 감광성 수지 조성물
KR20180109731A (ko) 감광성 수지 조성물
TW201842407A (zh) 感光性樹脂組成物
TW202128418A (zh) 積層結構
KR20180109755A (ko) 감광성 수지 조성물
KR102626371B1 (ko) 프린트 배선판의 제조 방법
KR20230110674A (ko) 감광성 수지 조성물, 감광성 수지 필름, 다층 프린트 배선판 및 반도체 패키지, 및 다층 프린트 배선판의 제조 방법
CN116057090A (zh) 感光性树脂组合物、感光性树脂膜、多层印刷配线板和半导体封装、以及多层印刷配线板的制造方法
JP2018119108A (ja) 樹脂組成物、樹脂シート、多層プリント配線板及び半導体装置
KR20160117237A (ko) 적층 필름
TWI697404B (zh) 層合薄膜
JP2021044387A (ja) 積層硬化体、硬化性樹脂組成物、ドライフィルム、および、積層硬化体の製造方法
JP2020124909A (ja) 硬化物の製造方法
JP2022159248A (ja) 積層構造体、硬化物およびプリント配線板
TW202348640A (zh) 感光性樹脂薄膜、印刷線路板、半導體封裝體及印刷線路板的製造方法
TW202248252A (zh) 感光性樹脂組成物