CN112536700B - 切割方法以及切割装置 - Google Patents
切割方法以及切割装置 Download PDFInfo
- Publication number
- CN112536700B CN112536700B CN202011396997.9A CN202011396997A CN112536700B CN 112536700 B CN112536700 B CN 112536700B CN 202011396997 A CN202011396997 A CN 202011396997A CN 112536700 B CN112536700 B CN 112536700B
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- China
- Prior art keywords
- cutting
- blade
- mark
- cut
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005520 cutting process Methods 0.000 title claims abstract description 389
- 238000000034 method Methods 0.000 title claims description 53
- 238000001514 detection method Methods 0.000 claims abstract description 54
- 238000012545 processing Methods 0.000 claims description 63
- 230000015572 biosynthetic process Effects 0.000 claims description 56
- 238000003384 imaging method Methods 0.000 claims description 34
- 238000005259 measurement Methods 0.000 claims description 5
- 238000012937 correction Methods 0.000 description 39
- 238000003754 machining Methods 0.000 description 38
- 238000010586 diagram Methods 0.000 description 17
- 239000000463 material Substances 0.000 description 12
- 239000012790 adhesive layer Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000006061 abrasive grain Substances 0.000 description 3
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- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
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- 230000008569 process Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- ZLHLYESIHSHXGM-UHFFFAOYSA-N 4,6-dimethyl-1h-imidazo[1,2-a]purin-9-one Chemical compound N=1C(C)=CN(C2=O)C=1N(C)C1=C2NC=N1 ZLHLYESIHSHXGM-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-021222 | 2018-02-08 | ||
JP2018021222 | 2018-02-08 | ||
JP2018-163613 | 2018-08-31 | ||
JP2018163614 | 2018-08-31 | ||
JP2018163615 | 2018-08-31 | ||
JP2018163613 | 2018-08-31 | ||
JP2018-163615 | 2018-08-31 | ||
JP2018-163614 | 2018-08-31 | ||
PCT/JP2018/041727 WO2019155707A1 (ja) | 2018-02-08 | 2018-11-09 | ダイシング装置及びダイシング方法並びにダイシングテープ |
CN201880088934.1A CN111699545B (zh) | 2018-02-08 | 2018-11-09 | 切割装置以及切割方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201880088934.1A Division CN111699545B (zh) | 2018-02-08 | 2018-11-09 | 切割装置以及切割方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112536700A CN112536700A (zh) | 2021-03-23 |
CN112536700B true CN112536700B (zh) | 2022-04-29 |
Family
ID=67549577
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110555098.7A Active CN113290484B (zh) | 2018-02-08 | 2018-11-09 | 切割装置、切割方法以及切割带 |
CN202011396997.9A Active CN112536700B (zh) | 2018-02-08 | 2018-11-09 | 切割方法以及切割装置 |
CN201880088934.1A Active CN111699545B (zh) | 2018-02-08 | 2018-11-09 | 切割装置以及切割方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110555098.7A Active CN113290484B (zh) | 2018-02-08 | 2018-11-09 | 切割装置、切割方法以及切割带 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201880088934.1A Active CN111699545B (zh) | 2018-02-08 | 2018-11-09 | 切割装置以及切割方法 |
Country Status (3)
Country | Link |
---|---|
JP (3) | JP6748891B2 (ja) |
CN (3) | CN113290484B (ja) |
WO (1) | WO2019155707A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7266398B2 (ja) * | 2018-12-11 | 2023-04-28 | 株式会社ディスコ | 切削装置及び切削装置を用いたウエーハの加工方法 |
CN114057384B (zh) * | 2021-12-10 | 2024-06-11 | 青岛天仁微纳科技有限责任公司 | 一种扫描电镜辅助定位裂片装置及使用方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013041972A (ja) * | 2011-08-15 | 2013-02-28 | Disco Abrasive Syst Ltd | 切削方法 |
CN106024709A (zh) * | 2015-03-31 | 2016-10-12 | 株式会社迪思科 | 晶片的分割方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03227557A (ja) * | 1990-02-01 | 1991-10-08 | Mitsubishi Electric Corp | ダイシング装置 |
JP2003124155A (ja) * | 2001-10-12 | 2003-04-25 | Disco Abrasive Syst Ltd | 切削装置 |
JP2005203540A (ja) * | 2004-01-15 | 2005-07-28 | Disco Abrasive Syst Ltd | ウエーハの切削方法 |
JP4554265B2 (ja) * | 2004-04-21 | 2010-09-29 | 株式会社ディスコ | 切削ブレードの位置ずれ検出方法 |
JP4748643B2 (ja) * | 2005-01-28 | 2011-08-17 | 株式会社ディスコ | 切削ブレードの基準位置検出方法 |
JP4943688B2 (ja) * | 2005-10-21 | 2012-05-30 | 株式会社ディスコ | 切削装置 |
JP5340808B2 (ja) * | 2009-05-21 | 2013-11-13 | 株式会社ディスコ | 半導体ウエーハのレーザ加工方法 |
JP5647510B2 (ja) * | 2010-12-27 | 2014-12-24 | 株式会社小金井精機製作所 | 切削加工装置及び切削加工方法 |
JP6219628B2 (ja) * | 2013-07-17 | 2017-10-25 | 株式会社ディスコ | 切削ブレード先端形状検出方法 |
JP6228044B2 (ja) * | 2014-03-10 | 2017-11-08 | 株式会社ディスコ | 板状物の加工方法 |
JP2016019249A (ja) * | 2014-07-11 | 2016-02-01 | キヤノン株式会社 | 表示制御装置 |
JP2016063060A (ja) * | 2014-09-18 | 2016-04-25 | 株式会社ディスコ | ウエーハの加工方法 |
CN106334989A (zh) * | 2016-11-02 | 2017-01-18 | 佛山市百思科铁芯制造有限公司 | 一种变压器铁芯专用切割机 |
-
2018
- 2018-11-09 CN CN202110555098.7A patent/CN113290484B/zh active Active
- 2018-11-09 CN CN202011396997.9A patent/CN112536700B/zh active Active
- 2018-11-09 CN CN201880088934.1A patent/CN111699545B/zh active Active
- 2018-11-09 JP JP2018211634A patent/JP6748891B2/ja active Active
- 2018-11-09 JP JP2018211635A patent/JP6768185B2/ja active Active
- 2018-11-09 JP JP2018211636A patent/JP6748892B2/ja active Active
- 2018-11-09 WO PCT/JP2018/041727 patent/WO2019155707A1/ja active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013041972A (ja) * | 2011-08-15 | 2013-02-28 | Disco Abrasive Syst Ltd | 切削方法 |
CN106024709A (zh) * | 2015-03-31 | 2016-10-12 | 株式会社迪思科 | 晶片的分割方法 |
Also Published As
Publication number | Publication date |
---|---|
CN113290484A (zh) | 2021-08-24 |
CN113290484B (zh) | 2023-04-25 |
CN111699545A (zh) | 2020-09-22 |
JP2020037171A (ja) | 2020-03-12 |
JP2020037169A (ja) | 2020-03-12 |
JP6768185B2 (ja) | 2020-10-14 |
CN111699545B (zh) | 2021-09-14 |
JP2020037170A (ja) | 2020-03-12 |
CN112536700A (zh) | 2021-03-23 |
WO2019155707A1 (ja) | 2019-08-15 |
JP6748891B2 (ja) | 2020-09-02 |
JP6748892B2 (ja) | 2020-09-02 |
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