CN112420580B - 一种晶圆自动下片、检测生产线 - Google Patents
一种晶圆自动下片、检测生产线 Download PDFInfo
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- CN112420580B CN112420580B CN202110085102.8A CN202110085102A CN112420580B CN 112420580 B CN112420580 B CN 112420580B CN 202110085102 A CN202110085102 A CN 202110085102A CN 112420580 B CN112420580 B CN 112420580B
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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CN202110085102.8A CN112420580B (zh) | 2021-01-22 | 2021-01-22 | 一种晶圆自动下片、检测生产线 |
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CN202110085102.8A CN112420580B (zh) | 2021-01-22 | 2021-01-22 | 一种晶圆自动下片、检测生产线 |
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CN112420580B true CN112420580B (zh) | 2021-04-16 |
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CN114914183B (zh) * | 2022-07-14 | 2022-12-13 | 前海晶方云(深圳)测试设备有限公司 | 供料方法、存储装置、计算机设备和测试设备 |
CN114990532B (zh) * | 2022-08-01 | 2022-11-25 | 江苏芯梦半导体设备有限公司 | 全自动晶圆上下料系统、上下料方法及化学镀工艺系统 |
CN115241106B (zh) * | 2022-08-03 | 2024-07-23 | 魅杰光电科技(上海)有限公司 | 一种晶圆工位提升机 |
CN115440643B (zh) * | 2022-10-11 | 2023-04-07 | 深圳技术大学 | 一种晶圆运载装置及方法 |
CN116666300B (zh) * | 2023-07-18 | 2023-09-29 | 江苏海纳电子科技有限公司 | 一种半导体芯片晶圆缺陷检测装置及缺陷检测方法 |
CN117393482B (zh) * | 2023-12-07 | 2024-02-09 | 天津伍嘉联创科技发展股份有限公司 | 全自动晶圆音叉激光调频设备 |
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KR101163636B1 (ko) * | 2010-04-09 | 2012-07-09 | (유)에스엔티 | 웨이퍼 이송장치 |
CN205645851U (zh) * | 2016-06-02 | 2016-10-12 | 昆山豪恩特机器人自动化科技有限公司 | 全自动光伏太阳能电池硅片印刷上下料设备 |
CN206532790U (zh) * | 2017-03-16 | 2017-09-29 | 东莞市启天自动化设备股份有限公司 | 一种全自动管式pecvd上下料机 |
CN109461689A (zh) * | 2018-12-04 | 2019-03-12 | 奥特马(无锡)电子科技有限公司 | 一种高速双头自动上下料固晶机 |
CN209487528U (zh) * | 2019-04-12 | 2019-10-11 | 通威太阳能(合肥)有限公司 | 一种太阳能电池片返工片插片装置 |
CN110223931B (zh) * | 2019-06-23 | 2024-07-09 | 广州蓝海机器人系统有限公司 | 一种pl检测机及检测方法 |
CN210956628U (zh) * | 2019-10-29 | 2020-07-07 | 苏州弘瀚自动化科技有限公司 | 一种便于晶体硅片检测的上下料机构 |
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Address after: 261000 west area of the third photoelectric Park, north of Yuqing street, west of Yinfeng Road, high tech Zone, Weifang City, Shandong Province Patentee after: Yuanxu Semiconductor Technology Co.,Ltd. Address before: 261000 west area of the third photoelectric Park, north of Yuqing street, west of Yinfeng Road, high tech Zone, Weifang City, Shandong Province Patentee before: SHANDONG NOVOSHINE OPTOELECTRONICS Co.,Ltd. |
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Denomination of invention: An automatic wafer unloading and testing production line Effective date of registration: 20220411 Granted publication date: 20210416 Pledgee: Weifang Jinma road sub branch of Bank of Weifang Co.,Ltd. Pledgor: Yuanxu Semiconductor Technology Co.,Ltd. Registration number: Y2022980004083 |
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Granted publication date: 20210416 Pledgee: Weifang Jinma road sub branch of Bank of Weifang Co.,Ltd. Pledgor: Yuanxu Semiconductor Technology Co.,Ltd. Registration number: Y2022980004083 |
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Effective date of registration: 20240617 Address after: Floors 1-3, Sapphire Factory, No. 233-4 Sufu Road, Suxi Town, Yiwu City, Jinhua City, Zhejiang Province, 322000 Patentee after: BOE Huacan Jingtu Technology (Zhejiang) Co.,Ltd. Country or region after: China Address before: 261000 west area of the third photoelectric Park, north of Yuqing street, west of Yinfeng Road, high tech Zone, Weifang City, Shandong Province Patentee before: Yuanxu Semiconductor Technology Co.,Ltd. Country or region before: China |
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