CN112420580A - 一种晶圆自动下片、检测生产线 - Google Patents
一种晶圆自动下片、检测生产线 Download PDFInfo
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- CN112420580A CN112420580A CN202110085102.8A CN202110085102A CN112420580A CN 112420580 A CN112420580 A CN 112420580A CN 202110085102 A CN202110085102 A CN 202110085102A CN 112420580 A CN112420580 A CN 112420580A
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- H—ELECTRICITY
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- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
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- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
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- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
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- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
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- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
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- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110085102.8A CN112420580B (zh) | 2021-01-22 | 2021-01-22 | 一种晶圆自动下片、检测生产线 |
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| CN202110085102.8A CN112420580B (zh) | 2021-01-22 | 2021-01-22 | 一种晶圆自动下片、检测生产线 |
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| CN112420580A true CN112420580A (zh) | 2021-02-26 |
| CN112420580B CN112420580B (zh) | 2021-04-16 |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113658898A (zh) * | 2021-08-04 | 2021-11-16 | 深圳市森美协尔科技有限公司 | 一种晶圆自动上料装置及上料检测方法 |
| CN114300400A (zh) * | 2021-12-27 | 2022-04-08 | 泓浒(苏州)半导体科技有限公司 | 一种半导体晶圆传递翻转一体化处理设备 |
| CN114690589A (zh) * | 2022-03-08 | 2022-07-01 | 苏州中特微电子科技有限公司 | 一种全自动接近式曝光机 |
| CN114914183A (zh) * | 2022-07-14 | 2022-08-16 | 前海晶方云(深圳)测试设备有限公司 | 供料方法、存储装置、计算机设备和测试设备 |
| CN114990532A (zh) * | 2022-08-01 | 2022-09-02 | 江苏芯梦半导体设备有限公司 | 全自动晶圆上下料系统、上下料方法及化学镀工艺系统 |
| CN115101433A (zh) * | 2022-07-08 | 2022-09-23 | 厦门特仪科技有限公司 | 一种晶圆表面缺陷检测仪 |
| CN115241106A (zh) * | 2022-08-03 | 2022-10-25 | 魅杰光电科技(上海)有限公司 | 一种晶圆工位提升机 |
| CN115440643A (zh) * | 2022-10-11 | 2022-12-06 | 深圳技术大学 | 一种晶圆运载装置及方法 |
| CN115692281A (zh) * | 2022-10-18 | 2023-02-03 | 厦门普诚科技有限公司 | 一种晶圆存取库 |
| CN116666300A (zh) * | 2023-07-18 | 2023-08-29 | 江苏海纳电子科技有限公司 | 一种半导体芯片晶圆缺陷检测装置及缺陷检测方法 |
| CN117393482A (zh) * | 2023-12-07 | 2024-01-12 | 天津伍嘉联创科技发展股份有限公司 | 全自动晶圆音叉激光调频设备 |
| CN119208227A (zh) * | 2024-11-28 | 2024-12-27 | 广东科卓半导体设备有限公司 | 一种晶圆切割道检测装置 |
| CN119381316A (zh) * | 2024-11-08 | 2025-01-28 | 江苏纳沛斯半导体有限公司 | 一种晶圆盒的检测设备及晶圆盒的检测系统 |
| CN120432421A (zh) * | 2025-07-04 | 2025-08-05 | 涌淳半导体(无锡)有限公司 | 一种具有自动定位夹持功能的晶圆膜厚检测设备 |
| CN120809643A (zh) * | 2025-09-04 | 2025-10-17 | 天津伍嘉联创科技发展股份有限公司 | 一种晶圆自动供给设备 |
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| KR20110113508A (ko) * | 2010-04-09 | 2011-10-17 | (유)에스엔티 | 웨이퍼 이송장치 |
| CN205645851U (zh) * | 2016-06-02 | 2016-10-12 | 昆山豪恩特机器人自动化科技有限公司 | 全自动光伏太阳能电池硅片印刷上下料设备 |
| CN206532790U (zh) * | 2017-03-16 | 2017-09-29 | 东莞市启天自动化设备股份有限公司 | 一种全自动管式pecvd上下料机 |
| CN109461689A (zh) * | 2018-12-04 | 2019-03-12 | 奥特马(无锡)电子科技有限公司 | 一种高速双头自动上下料固晶机 |
| CN110223931A (zh) * | 2019-06-23 | 2019-09-10 | 广州蓝海智能装备有限公司 | 一种pl检测机及检测方法 |
| CN209487528U (zh) * | 2019-04-12 | 2019-10-11 | 通威太阳能(合肥)有限公司 | 一种太阳能电池片返工片插片装置 |
| CN210956628U (zh) * | 2019-10-29 | 2020-07-07 | 苏州弘瀚自动化科技有限公司 | 一种便于晶体硅片检测的上下料机构 |
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20110113508A (ko) * | 2010-04-09 | 2011-10-17 | (유)에스엔티 | 웨이퍼 이송장치 |
| CN205645851U (zh) * | 2016-06-02 | 2016-10-12 | 昆山豪恩特机器人自动化科技有限公司 | 全自动光伏太阳能电池硅片印刷上下料设备 |
| CN206532790U (zh) * | 2017-03-16 | 2017-09-29 | 东莞市启天自动化设备股份有限公司 | 一种全自动管式pecvd上下料机 |
| CN109461689A (zh) * | 2018-12-04 | 2019-03-12 | 奥特马(无锡)电子科技有限公司 | 一种高速双头自动上下料固晶机 |
| CN209487528U (zh) * | 2019-04-12 | 2019-10-11 | 通威太阳能(合肥)有限公司 | 一种太阳能电池片返工片插片装置 |
| CN110223931A (zh) * | 2019-06-23 | 2019-09-10 | 广州蓝海智能装备有限公司 | 一种pl检测机及检测方法 |
| CN210956628U (zh) * | 2019-10-29 | 2020-07-07 | 苏州弘瀚自动化科技有限公司 | 一种便于晶体硅片检测的上下料机构 |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113658898A (zh) * | 2021-08-04 | 2021-11-16 | 深圳市森美协尔科技有限公司 | 一种晶圆自动上料装置及上料检测方法 |
| CN114300400A (zh) * | 2021-12-27 | 2022-04-08 | 泓浒(苏州)半导体科技有限公司 | 一种半导体晶圆传递翻转一体化处理设备 |
| CN114690589A (zh) * | 2022-03-08 | 2022-07-01 | 苏州中特微电子科技有限公司 | 一种全自动接近式曝光机 |
| CN115101433A (zh) * | 2022-07-08 | 2022-09-23 | 厦门特仪科技有限公司 | 一种晶圆表面缺陷检测仪 |
| CN114914183B (zh) * | 2022-07-14 | 2022-12-13 | 前海晶方云(深圳)测试设备有限公司 | 供料方法、存储装置、计算机设备和测试设备 |
| CN114914183A (zh) * | 2022-07-14 | 2022-08-16 | 前海晶方云(深圳)测试设备有限公司 | 供料方法、存储装置、计算机设备和测试设备 |
| CN114990532A (zh) * | 2022-08-01 | 2022-09-02 | 江苏芯梦半导体设备有限公司 | 全自动晶圆上下料系统、上下料方法及化学镀工艺系统 |
| CN114990532B (zh) * | 2022-08-01 | 2022-11-25 | 江苏芯梦半导体设备有限公司 | 全自动晶圆上下料系统、上下料方法及化学镀工艺系统 |
| CN115241106B (zh) * | 2022-08-03 | 2024-07-23 | 魅杰光电科技(上海)有限公司 | 一种晶圆工位提升机 |
| CN115241106A (zh) * | 2022-08-03 | 2022-10-25 | 魅杰光电科技(上海)有限公司 | 一种晶圆工位提升机 |
| CN115440643A (zh) * | 2022-10-11 | 2022-12-06 | 深圳技术大学 | 一种晶圆运载装置及方法 |
| CN115692281A (zh) * | 2022-10-18 | 2023-02-03 | 厦门普诚科技有限公司 | 一种晶圆存取库 |
| CN116666300B (zh) * | 2023-07-18 | 2023-09-29 | 江苏海纳电子科技有限公司 | 一种半导体芯片晶圆缺陷检测装置及缺陷检测方法 |
| CN116666300A (zh) * | 2023-07-18 | 2023-08-29 | 江苏海纳电子科技有限公司 | 一种半导体芯片晶圆缺陷检测装置及缺陷检测方法 |
| CN117393482A (zh) * | 2023-12-07 | 2024-01-12 | 天津伍嘉联创科技发展股份有限公司 | 全自动晶圆音叉激光调频设备 |
| CN117393482B (zh) * | 2023-12-07 | 2024-02-09 | 天津伍嘉联创科技发展股份有限公司 | 全自动晶圆音叉激光调频设备 |
| CN119381316A (zh) * | 2024-11-08 | 2025-01-28 | 江苏纳沛斯半导体有限公司 | 一种晶圆盒的检测设备及晶圆盒的检测系统 |
| CN119381316B (zh) * | 2024-11-08 | 2025-09-05 | 江苏纳沛斯半导体有限公司 | 一种晶圆盒的检测设备及晶圆盒的检测系统 |
| CN119208227A (zh) * | 2024-11-28 | 2024-12-27 | 广东科卓半导体设备有限公司 | 一种晶圆切割道检测装置 |
| CN119208227B (zh) * | 2024-11-28 | 2025-02-28 | 广东科卓半导体设备有限公司 | 一种晶圆切割道检测装置 |
| CN120432421A (zh) * | 2025-07-04 | 2025-08-05 | 涌淳半导体(无锡)有限公司 | 一种具有自动定位夹持功能的晶圆膜厚检测设备 |
| CN120432421B (zh) * | 2025-07-04 | 2025-08-29 | 涌淳半导体(无锡)有限公司 | 一种具有自动定位夹持功能的晶圆膜厚检测设备 |
| CN120809643A (zh) * | 2025-09-04 | 2025-10-17 | 天津伍嘉联创科技发展股份有限公司 | 一种晶圆自动供给设备 |
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| CN112420580B (zh) | 2021-04-16 |
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Address after: 261000 west area of the third photoelectric Park, north of Yuqing street, west of Yinfeng Road, high tech Zone, Weifang City, Shandong Province Patentee after: Yuanxu Semiconductor Technology Co.,Ltd. Address before: 261000 west area of the third photoelectric Park, north of Yuqing street, west of Yinfeng Road, high tech Zone, Weifang City, Shandong Province Patentee before: SHANDONG NOVOSHINE OPTOELECTRONICS Co.,Ltd. |
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Denomination of invention: An automatic wafer unloading and testing production line Effective date of registration: 20220411 Granted publication date: 20210416 Pledgee: Weifang Jinma road sub branch of Bank of Weifang Co.,Ltd. Pledgor: Yuanxu Semiconductor Technology Co.,Ltd. Registration number: Y2022980004083 |
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Granted publication date: 20210416 Pledgee: Weifang Jinma road sub branch of Bank of Weifang Co.,Ltd. Pledgor: Yuanxu Semiconductor Technology Co.,Ltd. Registration number: Y2022980004083 |
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Effective date of registration: 20240617 Address after: Floors 1-3, Sapphire Factory, No. 233-4 Sufu Road, Suxi Town, Yiwu City, Jinhua City, Zhejiang Province, 322000 Patentee after: BOE Huacan Jingtu Technology (Zhejiang) Co.,Ltd. Country or region after: China Address before: 261000 west area of the third photoelectric Park, north of Yuqing street, west of Yinfeng Road, high tech Zone, Weifang City, Shandong Province Patentee before: Yuanxu Semiconductor Technology Co.,Ltd. Country or region before: China |