CN112236305A - 层叠体的制造方法 - Google Patents

层叠体的制造方法 Download PDF

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Publication number
CN112236305A
CN112236305A CN202080002895.6A CN202080002895A CN112236305A CN 112236305 A CN112236305 A CN 112236305A CN 202080002895 A CN202080002895 A CN 202080002895A CN 112236305 A CN112236305 A CN 112236305A
Authority
CN
China
Prior art keywords
adhesive layer
adherend
meth
film
acrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080002895.6A
Other languages
English (en)
Chinese (zh)
Inventor
仲野武史
片冈贤一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN112236305A publication Critical patent/CN112236305A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/14—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a face layer formed of separate pieces of material which are juxtaposed side-by-side
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN202080002895.6A 2019-05-14 2020-04-17 层叠体的制造方法 Pending CN112236305A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-091692 2019-05-14
JP2019091692A JP6916836B2 (ja) 2019-05-14 2019-05-14 積層体の製造方法
PCT/JP2020/016950 WO2020230526A1 (ja) 2019-05-14 2020-04-17 積層体の製造方法

Publications (1)

Publication Number Publication Date
CN112236305A true CN112236305A (zh) 2021-01-15

Family

ID=73222623

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080002895.6A Pending CN112236305A (zh) 2019-05-14 2020-04-17 层叠体的制造方法

Country Status (5)

Country Link
JP (1) JP6916836B2 (ja)
KR (1) KR102379379B1 (ja)
CN (1) CN112236305A (ja)
TW (1) TWI789583B (ja)
WO (1) WO2020230526A1 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102408845A (zh) * 2010-09-21 2012-04-11 日东电工株式会社 切割/芯片接合薄膜、切割/芯片接合薄膜的制造方法以及半导体装置的制造方法
CN106183323A (zh) * 2016-07-01 2016-12-07 信利光电股份有限公司 一种贴合的方法及装置
CN106459692A (zh) * 2014-06-11 2017-02-22 日东电工株式会社 粘合片
CN106910428A (zh) * 2017-03-02 2017-06-30 京东方科技集团股份有限公司 弯折型柔性基板的制作方法及柔性显示装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01221225A (ja) * 1988-03-01 1989-09-04 Max Co Ltd 粘着シートの貼着方法
JP4405323B2 (ja) * 2004-06-21 2010-01-27 リンテック株式会社 積層シートおよびその製造方法
JP4614126B2 (ja) * 2005-02-21 2011-01-19 リンテック株式会社 積層シート、積層シートの巻取体およびそれらの製造方法
JP4869748B2 (ja) * 2006-03-14 2012-02-08 日東電工株式会社 ガラス保護用粘着シートおよび自動車ガラス用保護フィルム
JP2011006648A (ja) * 2009-06-29 2011-01-13 Nitto Denko Corp 光学シート部材の巻回体および液晶表示装置の連続製造方法
JP2012084688A (ja) * 2010-10-12 2012-04-26 Nitto Denko Corp 両面粘着テープ貼付け方法および両面粘着テープ貼付け装置
JP5844201B2 (ja) * 2012-03-30 2016-01-13 リンテック株式会社 粘着性組成物、粘着剤および粘着シート
JP6431256B2 (ja) * 2013-10-11 2018-11-28 デクセリアルズ株式会社 接着フィルム、フィルム巻装体、接続構造体の製造方法、接続方法、接続構造体
CN113980535A (zh) * 2014-10-29 2022-01-28 琳得科株式会社 保护膜形成膜、保护膜形成用复合片、以及带保护膜的半导体芯片的制造方法
SG11201800572XA (en) 2016-01-27 2018-02-27 Nitto Denko Corp Stress distributing film, optical member, and electronic member
JP6951902B2 (ja) * 2017-08-07 2021-10-20 日東電工株式会社 粘着剤付き光学フィルムの製造方法
JP2019062108A (ja) * 2017-09-27 2019-04-18 リンテック株式会社 樹脂膜形成用複合シート

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102408845A (zh) * 2010-09-21 2012-04-11 日东电工株式会社 切割/芯片接合薄膜、切割/芯片接合薄膜的制造方法以及半导体装置的制造方法
CN106459692A (zh) * 2014-06-11 2017-02-22 日东电工株式会社 粘合片
CN106183323A (zh) * 2016-07-01 2016-12-07 信利光电股份有限公司 一种贴合的方法及装置
CN106910428A (zh) * 2017-03-02 2017-06-30 京东方科技集团股份有限公司 弯折型柔性基板的制作方法及柔性显示装置

Also Published As

Publication number Publication date
WO2020230526A1 (ja) 2020-11-19
KR102379379B1 (ko) 2022-03-28
KR20200144134A (ko) 2020-12-28
JP2020185720A (ja) 2020-11-19
JP6916836B2 (ja) 2021-08-11
TWI789583B (zh) 2023-01-11
TW202108394A (zh) 2021-03-01

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