CN112212994A - 一种等离子体刻蚀晶圆的温度分布检测装置 - Google Patents
一种等离子体刻蚀晶圆的温度分布检测装置 Download PDFInfo
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- CN112212994A CN112212994A CN202011026682.5A CN202011026682A CN112212994A CN 112212994 A CN112212994 A CN 112212994A CN 202011026682 A CN202011026682 A CN 202011026682A CN 112212994 A CN112212994 A CN 112212994A
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- Prior art keywords
- temperature
- section
- wafer
- thermocouple
- cavity structure
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/028—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples using microstructures, e.g. made of silicon
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- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
0.0000,0.0000, | 0.0000,-97.9995, | -97.9995,0.0000, |
97.9995,0.0000, | 141.9915,38.0475, | 103.9455,-103.9440, |
38.0460,141.9915, | -147.0000,0.0000, | -73.5015,127.3050 |
-73.5000,-127.3070, | 0.0000,-49.0005, | ,0.0000,97.9995, |
0.0000,49.0005, | -37.5030,-90.5400, | -90.5400,37.5030, |
90.5400,-37.5030, | 147.0000,0.0000, | 73.5000,-127.3070, |
73.5000,127.3065 | -141.9920,38.0460, | -38.0475,141.9915, |
-103.9440,-103.9460, | -34.6485,-34.6485, | 37.5030,90.5400, |
34.6485,34.6485, | -69.2955,-69.2970, | -69.2970,69.2955, |
69.2970,-69.2955, | 141.9915,-38.0460, | 38.0475,-141.9920, |
103.9455,103.9455, | -127.3070,73.4985, | 69.2955,69.2970, |
-127.3050,-73.5000, | -49.0005,0.0000, | -37.5030,90.5400, |
49.005,0.0000, | -90.5400,-37.5030, | 0.0000,-147.0000 |
37.5030,-90.5400, | 127.3065,-73.5000, | ,90.5400,37.5030, |
127.3065,73.5000, | -103.9460,103.9440, | 0.0000,147.0000, |
-141.9920,-38.0475, | -73.5015,127.3050 | -38.0460,-141.9920 |
34.6485,-34.6485, |
Claims (2)
Priority Applications (1)
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CN202011026682.5A CN112212994A (zh) | 2020-09-25 | 2020-09-25 | 一种等离子体刻蚀晶圆的温度分布检测装置 |
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CN202011026682.5A CN112212994A (zh) | 2020-09-25 | 2020-09-25 | 一种等离子体刻蚀晶圆的温度分布检测装置 |
Publications (1)
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CN112212994A true CN112212994A (zh) | 2021-01-12 |
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CN202011026682.5A Pending CN112212994A (zh) | 2020-09-25 | 2020-09-25 | 一种等离子体刻蚀晶圆的温度分布检测装置 |
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CN (1) | CN112212994A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102664059B1 (ko) * | 2023-08-17 | 2024-05-08 | (주)쎄미콤 | 웨이퍼 온도센서 제조방법 |
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JPH03113331A (ja) * | 1989-09-28 | 1991-05-14 | Nissin Electric Co Ltd | アニール時における試料表面温度の計測方法 |
US5746513A (en) * | 1994-09-01 | 1998-05-05 | Sensarray Corporation | Temperature calibration substrate |
JPH1151776A (ja) * | 1997-07-30 | 1999-02-26 | Kawasou Denki Kogyo Kk | 半導体ウエハ熱処理炉用の測温ウエハ |
JPH11224838A (ja) * | 1998-02-04 | 1999-08-17 | Sakaguchi Dennetsu Kk | 温度検出素子を有するウェーハ |
JP2000058406A (ja) * | 1998-08-04 | 2000-02-25 | Yamari Sangyo Kk | 板状体の温度測定装置及び板状体の凹部形成方法 |
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CN1989596A (zh) * | 2004-07-23 | 2007-06-27 | 株式会社Ipb | 硅晶片基板固定台和硅晶片基板温度测量方法 |
CN101120049A (zh) * | 2005-04-28 | 2008-02-06 | 日本诺普科助剂有限公司 | 电子基板填充用树脂 |
CN102376589A (zh) * | 2010-08-13 | 2012-03-14 | 罗伯特·博世有限公司 | 用于填充晶片中的空腔的方法、相应填充的盲孔和具有相应填充的绝缘沟槽的晶片 |
CN208043262U (zh) * | 2018-04-28 | 2018-11-02 | 广东电网有限责任公司 | 测温背板 |
CN110926630A (zh) * | 2020-01-20 | 2020-03-27 | 上海集迦电子科技有限公司 | 一种带柔性电路板的晶圆温度传感装置 |
CN111189551A (zh) * | 2019-12-13 | 2020-05-22 | 靖江先锋半导体科技有限公司 | 一种晶圆加热器表面温度分布检测装置 |
CN111256857A (zh) * | 2020-02-25 | 2020-06-09 | 上海华力集成电路制造有限公司 | 通过测试bjt发射结电压来监控探针台卡盘温度的方法 |
-
2020
- 2020-09-25 CN CN202011026682.5A patent/CN112212994A/zh active Pending
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03113331A (ja) * | 1989-09-28 | 1991-05-14 | Nissin Electric Co Ltd | アニール時における試料表面温度の計測方法 |
US5746513A (en) * | 1994-09-01 | 1998-05-05 | Sensarray Corporation | Temperature calibration substrate |
JPH1151776A (ja) * | 1997-07-30 | 1999-02-26 | Kawasou Denki Kogyo Kk | 半導体ウエハ熱処理炉用の測温ウエハ |
JPH11224838A (ja) * | 1998-02-04 | 1999-08-17 | Sakaguchi Dennetsu Kk | 温度検出素子を有するウェーハ |
JP2000058406A (ja) * | 1998-08-04 | 2000-02-25 | Yamari Sangyo Kk | 板状体の温度測定装置及び板状体の凹部形成方法 |
JP2003247896A (ja) * | 2002-02-26 | 2003-09-05 | Hayashi Denko Kk | 熱電対ウエハセンサ |
CN1989596A (zh) * | 2004-07-23 | 2007-06-27 | 株式会社Ipb | 硅晶片基板固定台和硅晶片基板温度测量方法 |
CN101120049A (zh) * | 2005-04-28 | 2008-02-06 | 日本诺普科助剂有限公司 | 电子基板填充用树脂 |
CN102376589A (zh) * | 2010-08-13 | 2012-03-14 | 罗伯特·博世有限公司 | 用于填充晶片中的空腔的方法、相应填充的盲孔和具有相应填充的绝缘沟槽的晶片 |
CN208043262U (zh) * | 2018-04-28 | 2018-11-02 | 广东电网有限责任公司 | 测温背板 |
CN111189551A (zh) * | 2019-12-13 | 2020-05-22 | 靖江先锋半导体科技有限公司 | 一种晶圆加热器表面温度分布检测装置 |
CN110926630A (zh) * | 2020-01-20 | 2020-03-27 | 上海集迦电子科技有限公司 | 一种带柔性电路板的晶圆温度传感装置 |
CN111256857A (zh) * | 2020-02-25 | 2020-06-09 | 上海华力集成电路制造有限公司 | 通过测试bjt发射结电压来监控探针台卡盘温度的方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102664059B1 (ko) * | 2023-08-17 | 2024-05-08 | (주)쎄미콤 | 웨이퍼 온도센서 제조방법 |
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Inventor after: Wang Chao Inventor after: Niu Yi Inventor after: Zhang Zezhan Inventor after: Jia Jingcai Inventor after: Jiang Jing Inventor after: Yu Peifeng Inventor after: Zhong Yekui Inventor after: Qiu Anmei Inventor before: Wang Chao Inventor before: Zhong Yekui Inventor before: Jia Jingcai Inventor before: Qiu Anmei Inventor before: Zhang Zezhan Inventor before: Yu Peifeng Inventor before: Niu Yi Inventor before: Jiang Jing |
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