CN111783922B - 一种射频标签、其制备方法及光伏组件 - Google Patents
一种射频标签、其制备方法及光伏组件 Download PDFInfo
- Publication number
- CN111783922B CN111783922B CN202010517096.4A CN202010517096A CN111783922B CN 111783922 B CN111783922 B CN 111783922B CN 202010517096 A CN202010517096 A CN 202010517096A CN 111783922 B CN111783922 B CN 111783922B
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- China
- Prior art keywords
- radio frequency
- frequency tag
- acid
- adhesive
- film layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000002360 preparation method Methods 0.000 title description 6
- 239000010410 layer Substances 0.000 claims abstract description 32
- 239000002253 acid Substances 0.000 claims abstract description 20
- 239000000853 adhesive Substances 0.000 claims abstract description 20
- 230000001070 adhesive effect Effects 0.000 claims abstract description 20
- 239000012790 adhesive layer Substances 0.000 claims abstract description 19
- 239000002994 raw material Substances 0.000 claims abstract description 16
- 229920005906 polyester polyol Polymers 0.000 claims abstract description 15
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 150000001718 carbodiimides Chemical class 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- 229920006267 polyester film Polymers 0.000 claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims abstract description 7
- 239000012948 isocyanate Substances 0.000 claims abstract description 7
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 7
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 15
- 239000004645 polyester resin Substances 0.000 claims description 15
- 229920001225 polyester resin Polymers 0.000 claims description 15
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 10
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 claims description 10
- 239000011888 foil Substances 0.000 claims description 10
- -1 o-hydroxybenzophenone compound Chemical class 0.000 claims description 10
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 10
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 9
- 150000007513 acids Chemical class 0.000 claims description 8
- 150000001298 alcohols Chemical class 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 claims description 5
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 claims description 5
- 229940035437 1,3-propanediol Drugs 0.000 claims description 5
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 claims description 5
- 229940043375 1,5-pentanediol Drugs 0.000 claims description 5
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 claims description 5
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 claims description 5
- 150000002009 diols Chemical class 0.000 claims description 5
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 claims description 5
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 claims description 5
- 229920000909 polytetrahydrofuran Polymers 0.000 claims description 5
- 229920000166 polytrimethylene carbonate Polymers 0.000 claims description 5
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical group O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 4
- 238000011161 development Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 4
- FPQQSJJWHUJYPU-UHFFFAOYSA-N 3-(dimethylamino)propyliminomethylidene-ethylazanium;chloride Chemical compound Cl.CCN=C=NCCCN(C)C FPQQSJJWHUJYPU-UHFFFAOYSA-N 0.000 claims description 2
- QOSSAOTZNIDXMA-UHFFFAOYSA-N Dicylcohexylcarbodiimide Chemical compound C1CCCCC1N=C=NC1CCCCC1 QOSSAOTZNIDXMA-UHFFFAOYSA-N 0.000 claims description 2
- 230000002745 absorbent Effects 0.000 claims description 2
- 239000002250 absorbent Substances 0.000 claims description 2
- 239000012964 benzotriazole Substances 0.000 claims description 2
- 238000004132 cross linking Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 229960001860 salicylate Drugs 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 238000003851 corona treatment Methods 0.000 claims 1
- 230000007774 longterm Effects 0.000 abstract description 9
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 abstract description 3
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 abstract description 3
- 125000004432 carbon atom Chemical group C* 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 12
- 239000002985 plastic film Substances 0.000 description 9
- 229920006255 plastic film Polymers 0.000 description 9
- 229920006395 saturated elastomer Polymers 0.000 description 9
- 238000004383 yellowing Methods 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 230000032798 delamination Effects 0.000 description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000006750 UV protection Effects 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 229940030980 inova Drugs 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
- B32B2038/168—Removing solvent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/712—Weather resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C08K2003/3045—Sulfates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Plasma & Fusion (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Theoretical Computer Science (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
本发明涉及一种射频标签,包括薄膜层、设置在所述的薄膜层上的粘合剂层、设置在所述的粘合剂层上的射频线路、设置在所述的射频线路上的芯片,所述的薄膜层的材质为耐候性聚酯薄膜,按质量百分比计,形成所述的粘合剂层的粘合剂的原料包括80%及以上的聚酯多元醇、2%及以上的异氰酸酯固化剂以及助剂;所述的聚酯多元醇由酸和醇聚合而成,其中,所述的酸包括20mol%及以上的芳香族羧酸以及80mol%及以下的脂肪族羧酸;所述的醇的碳原子数为3个及以上;所述的助剂包括环氧树脂和/或碳化二亚胺。本发明的射频标签,长期户外使用也不会出现脱层的现象。
Description
技术领域
本发明具体涉及一种射频标签、其制备方法及光伏组件。
背景技术
射频标签又称电子标签、应答器、数据载体,射频标签是产品电子代码(EPC)的物理载体,附着于可跟踪的物品上,可全球流通并可使用阅读器对其进行识别和读写。阅读器又称为读出装置、扫描器、读头、通信器、读写器(取决于电子标签是否可以无线改写数据)。射频标签与阅读器之间通过耦合元件实现射频信号的空间(无接触)耦合;在耦合通道内,根据时序关系,实现能量的传递和数据交换。RFID射频识别是一种非接触式的自动识别技术,它通过射频信号自动识别目标对象并获取相关数据,识别工作无须人工干预。RFID技术可识别高速运动物体并可同时识别多个标签,操作快捷方便。RFID技术已被广泛应用于诸如工业自动化、商业自动化等众多领域,如产品防伪、生产流水线管理、仓储管理、销售渠道管理、贵重物品管理、图书管理、物流、汽车防盗、航空包裹管理等。
近年来,RFID产品在光伏组件上的应用也越来越多,为光伏组件的产品防伪、长期产品质量追踪提供了解决方案。目前光伏组件上使用的RFID产品,通常都是普通的射频标签,通过在一层普通的聚酯(PET)薄膜上涂布一层普通的聚氨酯粘合剂,在粘合剂层上加一层铝箔形成一种3层的复合物,然后通过曝光、显影、蚀刻的方式得到射频线路,最后在线路上固定芯片。但是普通射频标签耐候性性和耐UV性较差,若长期应用于户外,在可靠性方面存在诸多风险,比如易出现脱层、发黄、接触不良等问题,因此急需开发一款长期户外使用也不会出现脱层现象的射频标签。
发明内容
本发明的目的是提供一种长期户外使用也不会出现脱层现象的新射频标签。
为达到上述目的,本发明采用的技术方案是:
本发明第一方面提供一种射频标签,包括薄膜层、设置在所述的薄膜层上的粘合剂层、设置在所述的粘合剂层上的射频线路、设置在所述的射频线路上的芯片,所述的薄膜层的材质为耐候性聚酯薄膜,
按质量百分比计,形成所述的粘合剂层的粘合剂的原料包括80%及以上的聚酯多元醇、 2%及以上的异氰酸酯固化剂以及助剂;
所述的聚酯多元醇由酸和醇聚合而成,其中,所述的酸包括20mol%及以上的芳香族羧酸以及80mol%及以下的脂肪族羧酸;所述的醇的碳原子数为3个及以上;
所述的助剂包括环氧树脂和/或碳化二亚胺。
本发明的射频标签使用的粘合剂具有优异的耐候性,使得本发明的射频标签即使长期应用于户外,也不会出现薄膜层与粘合剂层脱层的现象,保证了使用效果和使用寿命。
优选地,按质量百分比计,所述的粘合剂的原料包括80%~90%的聚酯多元醇、2%~10%的异氰酸酯固化剂以及1%~10%的助剂。
优选地,所述的助剂包括质量比为1:0.2~0.4的环氧树脂和碳化二亚胺。
优选地,所述的芳香族羧酸为对苯二甲酸、间苯二甲酸、邻苯二甲酸、偏苯三酸酐中的一种或多种。
优选地,所述的脂肪族羧酸为1,4-环己烷-二甲酸、己二酸、葵二酸中的一种或多种。
优选地,所述的醇为1,3-丙二醇、1,4-丁二醇、1,5-戊二醇、1,6-己二醇、新戊二醇、1,4- 环己烷二甲醇、聚四氢呋喃二醇中的一种或多种。
优选地,所述的酸包括摩尔比为1:0.2~5的间苯二甲酸与其他酸,所述的其他酸为对苯二甲酸、邻苯二甲酸、1,4-环己烷-二甲酸、葵二酸、偏苯三酸酐中的一种或多种。
优选地,所述的醇包括摩尔比为1:0.2~5的1,6-己二醇与其他醇,所述的其他醇为1,3-丙二醇、1,4-丁二醇、1,5-戊二醇、新戊二醇、1,4-环己烷二甲醇、聚四氢呋喃二醇中的一种或多种。
优选地,所述的聚酯多元醇的极限粘度为0.2~0.8dl/g,所述粘合剂的交联度为50%及以上。
优选地,所述的碳化二亚胺为二环己基碳二亚胺及其聚合物、N,N'-二异丙基碳二亚胺及其聚合物、1-(3-二甲氨基丙基)-3-乙基碳二亚胺盐酸盐及其聚合物中的一种或多种。
优选地,按质量百分比计,所述的耐候性聚酯薄膜的原料包括60%~90%的聚酯树脂、 8%~39.9%的填料、0.1%~5%的紫外吸收剂。由于使用了上述原料,本发明的耐候性聚酯薄膜具有优异的耐水解性和耐UV性,长时间处于高湿环境中也不会影响其性能,并且有效减轻了长期紫外照射下的黄变问题。
进一步优选地,所述的聚酯树脂的特性粘度大于0.6dl/g。
进一步优选地,所述填料为二氧化钛和/或硫酸钡。
进一步优选地,所述紫外吸收剂为邻羟基二苯甲酮类化合物、苯并三唑类化合物、水杨酸酯类化合物、三嗪类化合物或取代丙烯腈类化合物中的一种或多种的组合。
本发明中,耐候性聚酯薄膜可以市购获得,例如购自韩国SKC公司,从而使得射频标签具有优异的耐候性和耐UV黄变性能,长期户外使用也不会出现脱层的现象,并且长期紫外照射下也不会出现明显黄变影响使用的问题,因此使用寿命较长,可满足户外光伏组件10年以上的使用寿命的需求。
根据一种具体且优选实施方式,一种射频标签,包括薄膜层、设置在所述的薄膜层上的粘合剂层、设置在所述的粘合剂层上的射频线路、设置在所述的射频线路上的芯片,按质量百分比计,所述的薄膜层的薄膜的原料包括60%~90%的聚酯树脂、8%~39.9%的填料、 0.1%~5%的紫外吸收剂;按质量百分比计,形成所述的粘合剂层的粘合剂的原料包括80%及以上的聚酯多元醇、2%及以上的异氰酸酯固化剂以及助剂;所述的聚酯多元醇由酸和醇聚合而成,其中,所述的酸包括摩尔比为1:0.2~5的间苯二甲酸与其他酸,所述的其他酸为对苯二甲酸、邻苯二甲酸、1,4-环己烷-二甲酸、葵二酸、偏苯三酸酐中的一种或多种;所述的醇包括摩尔比为1:0.2~5的1,6-己二醇与其他醇,所述的其他醇为1,3-丙二醇、1,4-丁二醇、1,5- 戊二醇、新戊二醇、1,4-环己烷二甲醇、聚四氢呋喃二醇中的一种或多种;所述的助剂包括环氧树脂和/或碳化二亚胺。本实施方式的射频标签具有优异的耐候性和耐UV黄变性能,长期户外使用也不会出现脱层的现象,并且长期紫外照射下也不会出现明显黄变影响使用的问题,因此使用寿命较长,可满足户外光伏组件10年以上的使用寿命的需求。
本发明第二方面还提供一种射频标签的制备方法,对所述的薄膜层进行电晕处理,将粘合剂涂布于所述的薄膜层的电晕面,烘干溶剂,将铝箔复合在所述的粘合剂上并进行热处理,然后在所述的铝箔上复合感光型干膜层,经过曝光、显影、蚀刻得到所述的射频线路,在所述的射频线路中固定所述的芯片制得所述的射频标签。
本发明第三方面还提供一种光伏组件,包括上述射频标签。
由于上述技术方案运用,本发明与现有技术相比具有下列优点:
本发明提供了一种新射频标签,长期户外使用也不会出现脱层的现象。
附图说明
附图1为本发明的具体实施方式的耐候铝塑膜的结构的截面示意图。
附图2为本发明的具体实施方式射频标签的结构的截面示意图。
附图3为本发明的具体实施方式射频标签的局部示意图。
以上附图中:1、铝箔层;2、粘合剂层;3、薄膜层;4、射频线路;5.芯片
具体实施方式
下面结合具体实施例对本发明作进一步描述,但本发明并不限于以下实施例。实施例中采用的实施条件可以根据具体使用的不同要求做进一步调整,未注明的实施条件为本行业中的常规条件。
一、制备聚酯多元醇
1.1饱和聚酯树脂的合成:
按照表1中实施例1、实施例2、实施例3、实施例4、实施例5、对比例1、对比例2、的原料成分及摩尔量,分别加入带有搅拌机、冷却管、温度计的不锈钢反应釜中,开启搅拌,在通氮气的情况下,反应釜升温至180±10℃,反应1~2h后,再阶梯升温至265±10℃,酯化反应共计4~6小时,再添加相当于酸成分0.02mol%的催化剂钛酸四丁酯Ti(OBt)4,搅拌均匀,然后抽真空至40Pa以下,在265±2℃、40Pa以下的环境下保温2~3小时,完成聚合反应,得到实施例1、实施例2、实施例3、实施例4、实施例5、对比例1、对比例2的饱和聚酯树脂。
制备饱和聚酯树脂的原料及最终制备出的饱和聚酯树脂的性能如表1所示,表1中原料的加入量均以摩尔量计。
1.2饱和聚酯树脂的组成的确定:
取0.1g实施例1、实施例2、实施例3、实施例4、实施例5、对比例1、对比例2的饱和聚酯树脂分别溶解在5ml的氘代氯仿中,用400MHZ高分解能的核磁共振装置(INOVA 400) 在25℃下进行测试分析,依据得到的核磁谱图NMR-H确认饱和聚酯树脂的组成,并获得Tg 值,Tg值见表1。
1.3饱和聚酯树脂的极限粘度的测定:
将苯酚、1,1,2,2-四氯乙烷按质量比为60:40配置成混合溶剂,将0.1g实施例1、实施例2、实施例3、实施例4、实施例5、对比例1、对比例2的饱和聚酯树脂分别溶解于25ml 的混合溶剂中,在30℃下,用乌氏粘度计测试还原粘度,然后通过稀释浓度的方法测得还原粘度和浓度的关系曲线图,推算出浓度为0时的极限粘度,极限黏度见表1。
表1
二、制备耐候铝塑膜
(1)PET:聚酯薄膜,50um;SW00L,韩国SKC公司制;
(2)按表2中实施例1、实施例2、实施例3、实施例4、实施例5、对比例1、对比例 2、对比例3的原料和质量百分比分别配制粘合剂溶液,粘合剂的配置方法:将树脂在50℃下溶解于乙酸乙酯溶剂,固含量为50%,然后降至室温下,将固化剂、助剂添加入树脂溶液中,搅拌30mins以上,投入使用。
其中,固化剂:TPA100,日本旭化成;
助剂1:828/环氧树脂,日本三菱化学;
助剂2:P200/碳化二亚胺,德国朗盛化学;
(3)将厚度为50μm薄膜层3预先电晕处理,将实施例1、实施例2、实施例3、实施例4、实施例5、对比例1、对比例2、对比例3的粘合剂溶液分别涂布于薄膜层3的电晕面, 80℃/5mins烘干溶剂,形成粘合剂层2,80℃下复合8μm铝箔,收卷并放置于烘箱中进行熟化处理50℃/72H,制成耐候铝塑膜。耐候铝塑膜的结构如附图1所示,耐候铝塑膜的评价结果见表2。
表2
评价方法:
1.粘接强度:铝塑膜裁切成1cm×20cm,拨开长度方向端部的铝箔,180°剥离,50mm/min 的速度。
2.粘结力(双85/1000H):样品放置于双85的高温高湿箱中,1000H后取出测试,方法同 1。
3.耐候性:铝塑膜样品1cm×20cm,分别单独浸泡于2mol/L NaOH水溶液,2mol/LHcl 水溶液,异丙醇(IPA)溶剂中,浸泡15mins,取出后室温静置15mins后,再测试剥离强度,测试方法与粘结强度的测试方法相同,如果三种溶剂中浸泡后的强度衰减均小于等于20%,则判定为OK,否则判定NG。
4.耐UV性,△b黄变指数:选用金属卤素UV灯,其中光强UVA/UVB=90/10,UV灯对着铝塑膜的PET膜的一面进行照射,累计附着量300KWH,使用日本美能达CR-10的色差仪测量老化前后的b值,△b=b(老化后)-b(老化前)。
综合评价:
“○”代表性能合格、“◎”代表性能优异、“△”代表性能一般、“×”代表性能较差。
三.制备射频标签
将上述耐候铝塑膜的铝箔层1上复合一层感光型干膜层,经过经过曝光、显影、蚀刻的方式得到射频线路4,在射频线路4中使用导电胶粘接一个射频芯片5,得到附图2和附图3 所示的射频标签。
上述实施例只为说明本发明的技术构思及特点,其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施,并不能以此限制本发明的保护范围。凡根据本发明精神实质所作的等效变化或修饰,都应涵盖在本发明的保护范围之内。
Claims (10)
1.一种射频标签,包括薄膜层(3)、设置在所述的薄膜层(3)上的粘合剂层(2)、设置在所述的粘合剂层(2)上的射频线路(4)、设置在所述的射频线路(4)上的芯片(5),其特征在于:所述的薄膜层(3)的材质为耐候性聚酯薄膜,
按质量百分比计,形成所述的粘合剂层(2)的粘合剂的原料包括80%及以上的聚酯多元醇、2%及以上的异氰酸酯固化剂以及助剂;
所述的聚酯多元醇由酸和醇聚合而成,其中,所述的酸包括摩尔比为1:0.2~5的间苯二甲酸与其他酸,所述的其他酸为对苯二甲酸、1,4-环己烷-二甲酸、葵二酸、偏苯三酸酐中的一种或多种;所述的醇包括摩尔比为1:0.2~5的1,6-己二醇与其他醇,所述的其他醇为1,3-丙二醇、1,4-丁二醇、1,5-戊二醇、新戊二醇、1,4-环己烷二甲醇、聚四氢呋喃二醇中的一种或多种;所述的助剂包括环氧树脂和/或碳化二亚胺。
2.根据权利要求1所述的射频标签,其特征在于:按质量百分比计,所述的粘合剂的原料包括80%~90%的聚酯多元醇、2%~10%的异氰酸酯固化剂以及1%~10%的助剂。
3.根据权利要求1或2所述的射频标签,其特征在于:所述的助剂包括质量比为1:0.2~0.4的环氧树脂和碳化二亚胺。
4.根据权利要求1或2所述的射频标签,其特征在于:所述的聚酯多元醇的极限粘度为0.2~0.8dl/g,所述粘合剂的交联度为50%及以上。
5.根据权利要求1或2所述的射频标签,其特征在于:所述的碳化二亚胺为二环己基碳二亚胺及其聚合物、N,N'-二异丙基碳二亚胺及其聚合物、1-(3-二甲氨基丙基)-3-乙基碳二亚胺盐酸盐及其聚合物中的一种或多种。
6.根据权利要求1或2所述的射频标签,其特征在于:按质量百分比计,所述的耐候性聚酯薄膜的原料包括60%~90%的聚酯树脂、8%~39.9%的填料、0.1%~5%的紫外吸收剂。
7.根据权利要求6所述的射频标签,其特征在于:所述的聚酯树脂的特性粘度大于0.6dl/g;所述填料为二氧化钛和/或硫酸钡;所述紫外吸收剂为邻羟基二苯甲酮类化合物、苯并三唑类化合物、水杨酸酯类化合物、三嗪类化合物或取代丙烯腈类化合物中的一种或多种的组合。
8.一种射频标签,包括薄膜层(3)、设置在所述的薄膜层(3)上的粘合剂层(2)、设置在所述的粘合剂层(2)上的射频线路(4)、设置在所述的射频线路(4)上的芯片(5),其特征在于:
按质量百分比计,所述的薄膜层(3)的薄膜的原料包括60%~90%的聚酯树脂、8%~39.9%的填料、0.1%~5%的紫外吸收剂;
按质量百分比计,形成所述的粘合剂层(2)的粘合剂的原料包括80%及以上的聚酯多元醇、2%及以上的异氰酸酯固化剂以及助剂;
所述的聚酯多元醇由酸和醇聚合而成,其中,所述的酸包括摩尔比为1:0.2~5的间苯二甲酸与其他酸,所述的其他酸为对苯二甲酸、1,4-环己烷-二甲酸、葵二酸、偏苯三酸酐中的一种或多种;所述的醇包括摩尔比为1:0.2~5的1,6-己二醇与其他醇,所述的其他醇为1,3-丙二醇、1,4-丁二醇、1,5-戊二醇、新戊二醇、1,4-环己烷二甲醇、聚四氢呋喃二醇中的一种或多种;所述的助剂包括环氧树脂和/或碳化二亚胺。
9.一种如权利要求1至8中任一项所述的射频标签的制备方法,其特征在于:对所述的薄膜层(3)进行电晕处理,将粘合剂涂布于所述的薄膜层(3)的电晕面,烘干溶剂,将铝箔复合在所述的粘合剂上并进行热处理,然后在所述的铝箔上复合感光型干膜层,经过曝光、显影、蚀刻得到所述的射频线路(4),在所述的射频线路(4)中固定所述的芯片(5)制得所述的射频标签。
10.一种光伏组件,其特征在于:其包括如权利要求1至8中任一项所述的射频标签。
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