CN111739828A - 一种晶圆自动刷片机 - Google Patents
一种晶圆自动刷片机 Download PDFInfo
- Publication number
- CN111739828A CN111739828A CN202010804440.8A CN202010804440A CN111739828A CN 111739828 A CN111739828 A CN 111739828A CN 202010804440 A CN202010804440 A CN 202010804440A CN 111739828 A CN111739828 A CN 111739828A
- Authority
- CN
- China
- Prior art keywords
- wafer
- plate
- brushing
- workbench
- mounting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001680 brushing effect Effects 0.000 title claims abstract description 76
- 239000000463 material Substances 0.000 claims abstract description 46
- 230000007246 mechanism Effects 0.000 claims abstract description 20
- 238000004140 cleaning Methods 0.000 claims description 56
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 51
- 230000001681 protective effect Effects 0.000 claims description 19
- 238000009434 installation Methods 0.000 claims description 17
- 239000003595 mist Substances 0.000 claims description 15
- 238000011010 flushing procedure Methods 0.000 claims description 10
- 239000012530 fluid Substances 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 6
- 241000252254 Catostomidae Species 0.000 claims description 4
- 239000000872 buffer Substances 0.000 claims description 4
- 230000003044 adaptive effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 5
- 238000012797 qualification Methods 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 251
- 238000000034 method Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 12
- 230000000694 effects Effects 0.000 description 7
- 238000005201 scrubbing Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 239000000779 smoke Substances 0.000 description 6
- 230000006978 adaptation Effects 0.000 description 5
- 239000007921 spray Substances 0.000 description 4
- 244000185238 Lophostemon confertus Species 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B08B1/143—
-
- B08B1/20—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010804440.8A CN111739828B (zh) | 2020-08-12 | 2020-08-12 | 一种晶圆自动刷片机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010804440.8A CN111739828B (zh) | 2020-08-12 | 2020-08-12 | 一种晶圆自动刷片机 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111739828A true CN111739828A (zh) | 2020-10-02 |
CN111739828B CN111739828B (zh) | 2020-12-01 |
Family
ID=72658321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010804440.8A Active CN111739828B (zh) | 2020-08-12 | 2020-08-12 | 一种晶圆自动刷片机 |
Country Status (1)
Country | Link |
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CN (1) | CN111739828B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112234971A (zh) * | 2020-10-16 | 2021-01-15 | 温州新印像电气有限公司 | 一种开关的自动化组装系统 |
CN112420579A (zh) * | 2021-01-22 | 2021-02-26 | 山东元旭光电股份有限公司 | 一种晶圆自动下片生产线 |
CN116913825A (zh) * | 2023-09-11 | 2023-10-20 | 深圳市星国华先进装备科技有限公司 | 一种晶圆加工用多向故障报警设备 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003100684A (ja) * | 2001-09-25 | 2003-04-04 | Okamoto Machine Tool Works Ltd | 基板の研磨装置および基板の研磨・洗浄・乾燥方法 |
JP2004111815A (ja) * | 2002-09-20 | 2004-04-08 | Nec Yamagata Ltd | 保護テープの剥離方法及びその装置 |
CN101580945A (zh) * | 2008-05-12 | 2009-11-18 | 盛美半导体设备(上海)有限公司 | 电沉积系统 |
CN109346424A (zh) * | 2018-10-29 | 2019-02-15 | 浙江金瑞泓科技股份有限公司 | 一种硅片刷片机 |
CN208767274U (zh) * | 2018-11-07 | 2019-04-19 | 沈阳芯源微电子设备有限公司 | 基板双面处理高效传递系统 |
CN111331504A (zh) * | 2020-04-13 | 2020-06-26 | 争丰半导体科技(苏州)有限公司 | 晶圆片全自动研磨清洗一体机 |
-
2020
- 2020-08-12 CN CN202010804440.8A patent/CN111739828B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003100684A (ja) * | 2001-09-25 | 2003-04-04 | Okamoto Machine Tool Works Ltd | 基板の研磨装置および基板の研磨・洗浄・乾燥方法 |
JP2004111815A (ja) * | 2002-09-20 | 2004-04-08 | Nec Yamagata Ltd | 保護テープの剥離方法及びその装置 |
CN101580945A (zh) * | 2008-05-12 | 2009-11-18 | 盛美半导体设备(上海)有限公司 | 电沉积系统 |
CN109346424A (zh) * | 2018-10-29 | 2019-02-15 | 浙江金瑞泓科技股份有限公司 | 一种硅片刷片机 |
CN208767274U (zh) * | 2018-11-07 | 2019-04-19 | 沈阳芯源微电子设备有限公司 | 基板双面处理高效传递系统 |
CN111331504A (zh) * | 2020-04-13 | 2020-06-26 | 争丰半导体科技(苏州)有限公司 | 晶圆片全自动研磨清洗一体机 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112234971A (zh) * | 2020-10-16 | 2021-01-15 | 温州新印像电气有限公司 | 一种开关的自动化组装系统 |
CN112420579A (zh) * | 2021-01-22 | 2021-02-26 | 山东元旭光电股份有限公司 | 一种晶圆自动下片生产线 |
CN112420579B (zh) * | 2021-01-22 | 2021-04-20 | 山东元旭光电股份有限公司 | 一种晶圆自动下片生产线 |
CN116913825A (zh) * | 2023-09-11 | 2023-10-20 | 深圳市星国华先进装备科技有限公司 | 一种晶圆加工用多向故障报警设备 |
CN116913825B (zh) * | 2023-09-11 | 2023-12-22 | 深圳市星国华先进装备科技有限公司 | 一种晶圆加工用多向故障报警设备 |
Also Published As
Publication number | Publication date |
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CN111739828B (zh) | 2020-12-01 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 261000 west area of the third photoelectric Park, north of Yuqing street, west of Yinfeng Road, high tech Zone, Weifang City, Shandong Province Patentee after: Yuanxu Semiconductor Technology Co.,Ltd. Address before: 261000 west area of the third photoelectric Park, north of Yuqing street, west of Yinfeng Road, high tech Zone, Weifang City, Shandong Province Patentee before: SHANDONG NOVOSHINE OPTOELECTRONICS Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An automatic wafer brushing machine Effective date of registration: 20220411 Granted publication date: 20201201 Pledgee: Weifang Jinma road sub branch of Bank of Weifang Co.,Ltd. Pledgor: Yuanxu Semiconductor Technology Co.,Ltd. Registration number: Y2022980004083 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20201201 Pledgee: Weifang Jinma road sub branch of Bank of Weifang Co.,Ltd. Pledgor: Yuanxu Semiconductor Technology Co.,Ltd. Registration number: Y2022980004083 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |