CN111726945A - 摄像模组的封装方法 - Google Patents
摄像模组的封装方法 Download PDFInfo
- Publication number
- CN111726945A CN111726945A CN202010568573.XA CN202010568573A CN111726945A CN 111726945 A CN111726945 A CN 111726945A CN 202010568573 A CN202010568573 A CN 202010568573A CN 111726945 A CN111726945 A CN 111726945A
- Authority
- CN
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- Prior art keywords
- substrate
- chip
- glue
- bonding
- camera module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 105
- 239000003292 glue Substances 0.000 claims abstract description 72
- 229920001187 thermosetting polymer Polymers 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 15
- 229920006335 epoxy glue Polymers 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 229920006332 epoxy adhesive Polymers 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000008901 benefit Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- 239000000084 colloidal system Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005267 amalgamation Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Studio Devices (AREA)
Abstract
Description
标号 | 名称 | 标号 | 名称 |
100 | 基板 | 101 | 第一焊盘组件 |
102 | 第一焊盘 | 103 | 第二焊盘 |
104 | 第二焊盘组件 | 105 | 金线 |
200 | 芯片 | 201 | 第一端 |
202 | 第二端 | 300 | 镜座 |
301 | 镜头 | 302 | 容纳腔 |
303 | 第一侧壁胶 | 304 | 第二侧壁胶 |
305 | 透气孔 |
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010568573.XA CN111726945B (zh) | 2020-06-19 | 2020-06-19 | 摄像模组的封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010568573.XA CN111726945B (zh) | 2020-06-19 | 2020-06-19 | 摄像模组的封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111726945A true CN111726945A (zh) | 2020-09-29 |
CN111726945B CN111726945B (zh) | 2021-11-02 |
Family
ID=72568405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010568573.XA Active CN111726945B (zh) | 2020-06-19 | 2020-06-19 | 摄像模组的封装方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111726945B (zh) |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1567585A (zh) * | 2003-06-20 | 2005-01-19 | 晶致半导体股份有限公司 | 具有散热片的半导体封装体 |
CN2777757Y (zh) * | 2005-04-21 | 2006-05-03 | 晶致半导体股份有限公司 | 加强散热效果的导线架及其封装件 |
KR100756245B1 (ko) * | 2006-05-26 | 2007-09-06 | 옵토팩 주식회사 | 카메라 모듈 |
CN101241921A (zh) * | 2007-02-05 | 2008-08-13 | 松下电器产业株式会社 | 光学器件及其制造方法、以及摄像模块和内窥镜模块 |
CN103246038A (zh) * | 2012-02-01 | 2013-08-14 | 信利光电(汕尾)有限公司 | 一种镜头底座及摄像头模组 |
CN203536439U (zh) * | 2013-10-25 | 2014-04-09 | 惠州市桑莱士光电有限公司 | 手机摄像模组的cob封装结构 |
CN107995392A (zh) * | 2017-11-28 | 2018-05-04 | 信利光电股份有限公司 | 一种多摄像头模组及其加工方法 |
CN108718379A (zh) * | 2018-07-16 | 2018-10-30 | 深圳市群晖智能科技股份有限公司 | 结构限位免调焦摄像头模组 |
CN109286735A (zh) * | 2017-07-21 | 2019-01-29 | 格科微电子(上海)有限公司 | 摄像头模组的装配结构、减小摄像头模组尺寸的装配方法 |
CN109999343A (zh) * | 2019-03-30 | 2019-07-12 | 深圳硅基仿生科技有限公司 | 植入式器件的电子封装体及视网膜刺激器 |
CN110248073A (zh) * | 2019-07-08 | 2019-09-17 | Oppo(重庆)智能科技有限公司 | 摄像头模组、电子装置及摄像头模组的制作方法 |
CN110602363A (zh) * | 2019-09-23 | 2019-12-20 | Oppo广东移动通信有限公司 | 一种摄像头模组以及电子设备 |
CN210724991U (zh) * | 2019-08-14 | 2020-06-09 | 南昌欧菲光电技术有限公司 | 底座、摄像模组及电子设备 |
-
2020
- 2020-06-19 CN CN202010568573.XA patent/CN111726945B/zh active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1567585A (zh) * | 2003-06-20 | 2005-01-19 | 晶致半导体股份有限公司 | 具有散热片的半导体封装体 |
CN2777757Y (zh) * | 2005-04-21 | 2006-05-03 | 晶致半导体股份有限公司 | 加强散热效果的导线架及其封装件 |
KR100756245B1 (ko) * | 2006-05-26 | 2007-09-06 | 옵토팩 주식회사 | 카메라 모듈 |
CN101241921A (zh) * | 2007-02-05 | 2008-08-13 | 松下电器产业株式会社 | 光学器件及其制造方法、以及摄像模块和内窥镜模块 |
CN103246038A (zh) * | 2012-02-01 | 2013-08-14 | 信利光电(汕尾)有限公司 | 一种镜头底座及摄像头模组 |
CN203536439U (zh) * | 2013-10-25 | 2014-04-09 | 惠州市桑莱士光电有限公司 | 手机摄像模组的cob封装结构 |
CN109286735A (zh) * | 2017-07-21 | 2019-01-29 | 格科微电子(上海)有限公司 | 摄像头模组的装配结构、减小摄像头模组尺寸的装配方法 |
CN107995392A (zh) * | 2017-11-28 | 2018-05-04 | 信利光电股份有限公司 | 一种多摄像头模组及其加工方法 |
CN108718379A (zh) * | 2018-07-16 | 2018-10-30 | 深圳市群晖智能科技股份有限公司 | 结构限位免调焦摄像头模组 |
CN109999343A (zh) * | 2019-03-30 | 2019-07-12 | 深圳硅基仿生科技有限公司 | 植入式器件的电子封装体及视网膜刺激器 |
CN110248073A (zh) * | 2019-07-08 | 2019-09-17 | Oppo(重庆)智能科技有限公司 | 摄像头模组、电子装置及摄像头模组的制作方法 |
CN210724991U (zh) * | 2019-08-14 | 2020-06-09 | 南昌欧菲光电技术有限公司 | 底座、摄像模组及电子设备 |
CN110602363A (zh) * | 2019-09-23 | 2019-12-20 | Oppo广东移动通信有限公司 | 一种摄像头模组以及电子设备 |
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CN111726945B (zh) | 2021-11-02 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Packaging method of camera module Effective date of registration: 20220128 Granted publication date: 20211102 Pledgee: Bank of Changsha Limited by Share Ltd. Changde science and Technology Branch Pledgor: HUNAN KINGCOME OPTOELECTRONICS Co.,Ltd. Registration number: Y2022980001368 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20211102 Pledgee: Bank of Changsha Limited by Share Ltd. Changde science and Technology Branch Pledgor: HUNAN KINGCOME OPTOELECTRONICS Co.,Ltd. Registration number: Y2022980001368 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Packaging method of camera module Granted publication date: 20211102 Pledgee: Changsha Bank Co.,Ltd. Changde Economic Development Zone Branch Pledgor: HUNAN KINGCOME OPTOELECTRONICS Co.,Ltd. Registration number: Y2024980014355 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |