CN111647867A - Magnetron sputtering control mechanism of vacuum coating machine - Google Patents

Magnetron sputtering control mechanism of vacuum coating machine Download PDF

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Publication number
CN111647867A
CN111647867A CN202010634665.3A CN202010634665A CN111647867A CN 111647867 A CN111647867 A CN 111647867A CN 202010634665 A CN202010634665 A CN 202010634665A CN 111647867 A CN111647867 A CN 111647867A
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CN
China
Prior art keywords
gear
fixedly connected
control mechanism
coating machine
vacuum coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010634665.3A
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Chinese (zh)
Inventor
赵淑鑫
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Hangzhou Qishi Technology Co ltd
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Hangzhou Qishi Technology Co ltd
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Publication date
Application filed by Hangzhou Qishi Technology Co ltd filed Critical Hangzhou Qishi Technology Co ltd
Priority to CN202010634665.3A priority Critical patent/CN111647867A/en
Publication of CN111647867A publication Critical patent/CN111647867A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/542Controlling the film thickness or evaporation rate
    • C23C14/545Controlling the film thickness or evaporation rate using measurement on deposited material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering

Abstract

The invention relates to the technical field of metal plating, and discloses a magnetron sputtering control mechanism of a vacuum coating machine. This vacuum coating machine magnetron sputtering control mechanism, when thick detector detects that metal plating spare cladding material thickness is inhomogeneous, can start motor one make gear rotate, the movable plate can remove about, and baffle fixed connection is on the right side of movable plate for the baffle can remove about, thereby has reached the even effect of coating film thickness. The handle rotates to enable the gear to rotate, and the gear can move up and down inside the fixing plate due to the fact that the gear is meshed with the fixing plate, so that the sputtering target can move up and down, the supporting rod enters different grooves by means of pulling of the pull rod, the angle of the head of the sputtering target can be changed by means of pulling of the pull rod, and the effect of adjusting the position of the sputtering target according to needs is achieved.

Description

Magnetron sputtering control mechanism of vacuum coating machine
Technical Field
The invention relates to the technical field of metal plating, in particular to a magnetron sputtering control mechanism of a vacuum coating machine.
Background
The vacuum coating machine mainly refers to a type of coating which needs to be carried out under higher vacuum degree, belongs to a common metal coating device, and specifically comprises various types including vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, PLD laser sputtering deposition and the like. Two main categories are evaporation and sputtering. The evaporation means that surface components are evaporated in the form of atomic groups or ionic groups by heating a target and are precipitated on the surface of a substrate to form a thin film through a film forming process. Sputtering mainly uses electrons or high-energy laser to bombard a target material, and enables surface components to be sputtered out in the form of atomic groups or ion groups and finally deposited on the surface of a substrate, and finally a thin film is formed.
The existing solution mainly comprises adjusting magnetic field uniformity and adjusting an anode cover, but the adjusting mode can be processed only by breaking vacuum, the production efficiency and equipment stability can be affected by breaking vacuum every time, the adjusting effect cannot be immediately confirmed, and multiple times of modification can be needed, so that how to enable the vacuum coating machine to coat the film uniformly in the coating process, and the sputtering target position can be adjusted as required becomes an important problem, and therefore a magnetron sputtering control mechanism of the vacuum coating machine is provided.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a magnetron sputtering control mechanism of a vacuum coating machine, which has the advantages of uniform coating thickness in the coating process and capability of adjusting the sputtering target position according to requirements, and solves the problems that the longitudinal uniformity of the coating mode is poor, and the vacuum breaking treatment can influence the production efficiency and the equipment stability.
(II) technical scheme
In order to realize the purposes that the thickness of the coating film is uniform in the coating process and the sputtering target position can be adjusted according to the requirement, the invention provides the following technical scheme: a magnetron sputtering control mechanism of a vacuum coating machine comprises a box body, wherein a fixed plate is fixedly connected to the bottom inside the box body, a sputtering target is movably connected to the top of the fixed plate, a first rotating shaft is movably connected to the inside of the bottom of the box body, a handle is fixedly connected to one side, far away from the box body, of the first rotating shaft, a moving plate is movably connected to the inside of the box body, a first gear is meshed with the moving plate, a baffle is fixedly connected to the right side of the moving plate, a fixed disc is movably connected to the inside of the box body, a film thickness detector is fixedly connected to the right side inside the box body, a second rotating shaft is fixedly connected to the bottom of the first gear, a second gear is fixedly connected to the bottom of the second rotating shaft, a third gear is meshed with the second gear, a first motor, the one end fixedly connected with gear four that the fixed disk was kept away from to axis of rotation three, gear four meshing is connected with gear five, gear five's left side fixedly connected with motor two, one side fixedly connected with gear six that the handle was kept away from to axis of rotation one, the right side swing joint of splash target has the pulling rod, the right side fixedly connected with pull rod of pulling rod, the positive fixedly connected with bracing piece of pull rod, the right side of box is seted up flutedly.
Preferably, the moving plate is internally provided with gear teeth meshed with the first gear, and the moving plate is arranged inside the box body in two and is centrosymmetric.
Preferably, the baffle is between the fixed disk and the sputtering target.
Preferably, the film thickness detector is horizontally flush with the fixed disk.
Preferably, both ends of the first rotating shaft are fixedly connected with a sputtering target and a handle respectively.
Preferably, the fixed plate is internally provided with gear teeth meshed with the gear six.
(III) advantageous effects
Compared with the prior art, the invention provides a magnetron sputtering control mechanism of a vacuum coating machine, which has the following beneficial effects:
1. this vacuum coating machine magnetron sputtering control mechanism uses through the cooperation of thick detector of membrane and motor one, movable plate, gear one, baffle, when thick detector detects that metal plating spare cladding material thickness is inhomogeneous when thick detector of membrane, can start motor one makes gear one rotate, because gear one is connected with the inside engagement of movable plate for the movable plate can be controlled about, and baffle fixed connection is on the right side of movable plate, makes the baffle can control about, thereby has reached the even effect of coating thickness.
2. This vacuum coating machine magnetron sputtering control mechanism, through handle and gear six, the fixed plate, the splash target, the pull rod, the bracing piece, the pulling rod, the cooperation of recess is used, it makes gear six rotate to rotate the handle, because gear six is connected with the fixed plate meshing, make gear six can be at the inside up-and-down motion of fixed plate, thereby make the splash target can the up-and-down motion, the pulling pull rod makes inside the bracing piece gets into different recesses, can make the pulling rod pulling splash target head's angle change, thereby reached and adjusted the effect that the target position was splashed as required.
Drawings
FIG. 1 is a schematic cross-sectional view of a top view of the present invention;
FIG. 2 is a schematic cross-sectional view of the front structure of the present invention;
FIG. 3 is a schematic view of a rotating shaft according to the present invention;
FIG. 4 is an enlarged view of the structure A of the present invention.
In the figure: 1. a box body; 2. a fixing plate; 3. sputtering a target; 4. rotating a first shaft; 5. a handle; 6. moving the plate; 7. a first gear; 8. a baffle plate; 9. fixing the disc; 10. a film thickness detector; 11. a second rotating shaft; 12. a second gear; 13. a third gear; 14. a first motor; 15. a third rotating shaft; 16. a fourth gear; 17. a fifth gear; 18. a second motor; 19. a sixth gear; 20. pulling a rod; 21. a pull rod; 22. a support bar; 23. and (4) a groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, those skilled in the art can obtain other embodiments without creative efforts, which belong to the protection scope of the present invention.
Referring to fig. 1-4, a magnetron sputtering control mechanism of a vacuum coating machine comprises a box body 1, a fixed plate 2 is fixedly connected to the bottom inside the box body 1, a sputtering target 3 is movably connected to the top of the fixed plate 2, a rotating shaft 4 is movably connected to the inside of the bottom of the box body 1, a handle 5 is fixedly connected to one side of the rotating shaft 4 away from the box body 1, the sputtering target 3 and the handle 5 are respectively fixedly connected to two ends of the rotating shaft 4, a moving plate 6 is movably connected to the inside of the box body 1, a gear 7 is engaged and connected to the inside of the moving plate 6, gear teeth engaged with the gear 7 are arranged inside the moving plate 6, two moving plates 6 are arranged inside the box body 1 and are centrosymmetric, a baffle plate 8 is fixedly connected to the right side of the moving plate 6, a fixed plate 9 is movably connected to the inside of the box body 1, the baffle plate 8 is arranged between the, the film thickness detector 10 is horizontally flush with the fixed disc 9, the bottom of the first gear 7 is fixedly connected with a second rotating shaft 11, the bottom of the second rotating shaft 11 is fixedly connected with a second gear 12, the second gear 12 is meshed with a third gear 13, the left side of the third gear 13 is fixedly connected with a first motor 14, the bottom of the fixed disc 9 is fixedly connected with a third rotating shaft 15, one end, far away from the fixed disc 9, of the third rotating shaft 15 is fixedly connected with a fourth gear 16, the fourth gear 16 is meshed with a fifth gear 17, the left side of the fifth gear 17 is fixedly connected with a second motor 18, one side, far away from the handle 5, of the first rotating shaft 4 is fixedly connected with a sixth gear 19, gear teeth meshed with the sixth gear 19 are arranged inside the fixed plate 2, the right side of the sputtering target 3 is movably connected with a pulling rod 20, the right side of the pulling rod 20, the side of the support rod 22 far away from the pull rod 21 is arranged in the groove 23, and the number of the grooves 23 is not less than five.
The working principle is that after the equipment is operated, when the film thickness detector 10 detects that the thickness of a metal plated part on the fixed disc 9 is not uniform, the first motor 14 is automatically started, the third gear 13 is fixedly connected to the right side of the first motor 14, the third gear 13 rotates, the third gear 13 is meshed with the second gear 12, the second gear 12 rotates, the second gear 12 is fixedly connected with the second rotating shaft 11, the second rotating shaft 11 rotates, the top of the second rotating shaft 11 is fixedly connected with the first gear 7, the first gear 7 can rotate, the outer part of the first gear 7 is meshed with the inner part of the movable plate 6, the movable plate 6 can move, the baffle 8 is fixedly connected to the right side of the movable plate 6, the baffle 8 can move, and the baffle 8 is arranged between the sputtering target 3 and the fixed disc 9, therefore, the baffle plate 8 can shield the metal sputtered to the plated part, and the effect of uniform plating thickness in the plating process is achieved. Because the metal to be plated is generally hung on the fixed disc 9, the height of the metal to be plated is different when the metal is more in quantity, the position of all the parts to be plated is difficult to consider, because the handle 5 is fixedly connected with the first rotating shaft 4, the first rotating shaft 4 is fixedly connected with the sixth gear 19, the sixth gear 19 of the rotating handle 5 can rotate, because the sixth gear 19 is meshed with the fixed plate 2, the sixth gear 19 can move up and down in the fixed plate 2, because the sixth gear 19 is fixedly connected with the sputtering target 3, when the handle 5 is rotated, the sputtering target 3 can move up and down, because the right side of the sputtering target 3 is fixedly connected with the pulling rod 20, and the right side of the pulling rod 20 is fixedly connected with the pulling rod 21, at the moment, the pulling rod 21 can drive the sputtering target 3 to move, because the supporting rod 22 is fixedly connected with the pulling rod 21, and the side of the supporting rod 22 far away from the pulling rod 21 is in the groove 23, the number of the grooves 23 is not less than five, so that the position of the pulling rod 20 can be changed by changing the position of the supporting rod 22 in the groove 23, the spraying angle of the sputtering target 3 is slightly changed, and the effect of adjusting the position of the sputtering target 3 according to requirements is achieved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a vacuum coating machine magnetron sputtering control mechanism, includes box (1), its characterized in that: the bottom fixedly connected with fixed plate (2) inside box (1), the top swing joint of fixed plate (2) has splash target (3), the inside swing joint of box (1) bottom has axis of rotation one (4), one side fixedly connected with handle (5) of box (1) is kept away from to axis of rotation one (4), the inside swing joint of box (1) has movable plate (6), the inside meshing of movable plate (6) is connected with gear one (7), the right side fixedly connected with baffle (8) of movable plate (6), the inside swing joint of box (1) has fixed disk (9), the thick detector (10) of right side fixedly connected with membrane inside box (1), the bottom fixedly connected with axis of rotation two (11) of gear one (7), the bottom fixedly connected with gear two (12) of axis of rotation two (11), the second gear (12) is engaged with a third gear (13), the left side of the third gear (13) is fixedly connected with a first motor (14), the bottom of the fixed disk (9) is fixedly connected with a third rotating shaft (15), one end of the third rotating shaft (15) far away from the fixed disk (9) is fixedly connected with a fourth gear (16), a gear five (17) is meshed and connected with the gear four (16), a motor two (18) is fixedly connected to the left side of the gear five (17), a gear six (19) is fixedly connected to one side of the rotating shaft I (4) far away from the handle (5), the right side of the sputtering target (3) is movably connected with a pulling rod (20), the right side of the pulling rod (20) is fixedly connected with a pull rod (21), the front of the pull rod (21) is fixedly connected with a support rod (22), and the right side of the box body (1) is provided with a groove (23).
2. The magnetron sputtering control mechanism of the vacuum coating machine as claimed in claim 1, characterized in that: the gear teeth meshed with the first gear (7) are arranged in the moving plate (6), and the moving plate (6) is arranged in the box body (1) in total and is centrosymmetric.
3. The magnetron sputtering control mechanism of the vacuum coating machine as claimed in claim 1, characterized in that: the baffle plate (8) is arranged between the fixed disc (9) and the sputtering target (3).
4. The magnetron sputtering control mechanism of the vacuum coating machine as claimed in claim 1, characterized in that: the film thickness detector (10) is horizontally flush with the fixed disk (9).
5. The magnetron sputtering control mechanism of the vacuum coating machine as claimed in claim 1, characterized in that: two ends of the first rotating shaft (4) are fixedly connected with a sputtering target (3) and a handle (5) respectively.
6. The magnetron sputtering control mechanism of the vacuum coating machine as claimed in claim 1, characterized in that: and gear teeth meshed with the gear six (19) are arranged in the fixed plate (2).
CN202010634665.3A 2020-07-02 2020-07-02 Magnetron sputtering control mechanism of vacuum coating machine Pending CN111647867A (en)

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CN202010634665.3A CN111647867A (en) 2020-07-02 2020-07-02 Magnetron sputtering control mechanism of vacuum coating machine

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Application Number Priority Date Filing Date Title
CN202010634665.3A CN111647867A (en) 2020-07-02 2020-07-02 Magnetron sputtering control mechanism of vacuum coating machine

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112251728A (en) * 2020-10-22 2021-01-22 凯盛信息显示材料(黄山)有限公司 Continuous vacuum magnetron sputtering coating device and coating production line
CN112663015A (en) * 2020-12-14 2021-04-16 上海超导科技股份有限公司 Target pit testing device and feedback control target walking method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050252767A1 (en) * 2004-05-11 2005-11-17 Nobuyuki Takahashi Sputtering device
CN105543792A (en) * 2015-12-11 2016-05-04 中国电子科技集团公司第四十八研究所 Magnetron sputtering device and magnetron sputtering method
CN107313020A (en) * 2017-08-18 2017-11-03 深圳市华星光电半导体显示技术有限公司 A kind of magnetic control sputtering film plating device
CN209352974U (en) * 2018-11-21 2019-09-06 信义光伏产业(安徽)控股有限公司 Coating machine target position regulating device and coating machine

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050252767A1 (en) * 2004-05-11 2005-11-17 Nobuyuki Takahashi Sputtering device
CN105543792A (en) * 2015-12-11 2016-05-04 中国电子科技集团公司第四十八研究所 Magnetron sputtering device and magnetron sputtering method
CN107313020A (en) * 2017-08-18 2017-11-03 深圳市华星光电半导体显示技术有限公司 A kind of magnetic control sputtering film plating device
CN209352974U (en) * 2018-11-21 2019-09-06 信义光伏产业(安徽)控股有限公司 Coating machine target position regulating device and coating machine

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112251728A (en) * 2020-10-22 2021-01-22 凯盛信息显示材料(黄山)有限公司 Continuous vacuum magnetron sputtering coating device and coating production line
CN112663015A (en) * 2020-12-14 2021-04-16 上海超导科技股份有限公司 Target pit testing device and feedback control target walking method thereof
CN115572955A (en) * 2020-12-14 2023-01-06 上海超导科技股份有限公司 Target pit testing device and feedback control target walking method thereof
CN115572955B (en) * 2020-12-14 2024-04-26 上海超导科技股份有限公司 Target pit testing device and feedback control target moving method thereof

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Application publication date: 20200911

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