CN113073301A - Adjustable unbalanced rectangular plane magnetron sputtering cathode - Google Patents
Adjustable unbalanced rectangular plane magnetron sputtering cathode Download PDFInfo
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- CN113073301A CN113073301A CN202110319424.4A CN202110319424A CN113073301A CN 113073301 A CN113073301 A CN 113073301A CN 202110319424 A CN202110319424 A CN 202110319424A CN 113073301 A CN113073301 A CN 113073301A
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- fixed mounting
- magnetron sputtering
- power
- sputtering cathode
- connecting rod
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- 238000001755 magnetron sputter deposition Methods 0.000 title claims abstract description 21
- 238000003860 storage Methods 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 6
- 239000013077 target material Substances 0.000 claims description 5
- 238000005530 etching Methods 0.000 abstract description 4
- 239000002699 waste material Substances 0.000 abstract description 2
- 239000000306 component Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a rectangular plane magnetron sputtering cathode which comprises a frame body, wherein a telescopic device is fixedly arranged at the bottom in the frame body, a power device is fixedly arranged at the upper end of the telescopic device, a material storage device is fixedly arranged on each of two sides of the power device, a telescopic rod is fixedly arranged at one end of the material storage device, which is far away from the power device, a T-shaped rod is fixedly arranged at one end of the telescopic rod, which is far away from the material storage device, a sliding groove is formed in the side wall of the frame body, and the T-shaped rod is positioned in the sliding groove and is in sliding connection. According to the invention, by arranging the power loading and storing device, the horizontal position of the target can be changed at any time, the condition of uneven etching of the target is reduced, the utilization rate of the target is improved, and the waste of the target is reduced.
Description
Technical Field
The invention relates to the technical field of sputtering cathodes, in particular to a rectangular plane magnetron sputtering cathode.
Background
The coating film is formed by coating a very thin film on the surface of the substrate, so that the substrate has the functions of wear resistance, lubrication, electric conduction, optics, decoration and the like. With the increasing pursuit of people for products, more and more surfaces of articles are coated, the most common method for coating is coating by a coating machine, and the most commonly used method is sputtering coating, which can be simply understood as bombarding a target material by ions or high-energy laser, enabling surface components to be sputtered out in the form of atomic groups or ions, and finally depositing on the surface of a substrate to finally form a film.
According to the patent number CN209974874U, the rectangular magnetron sputtering cathode with high target utilization rate is named, the core component of the rectangular magnetron sputtering cathode is a magnetic circuit module consisting of a magnetic steel group and a magnetic yoke, and the magnetic circuit structure enables a magnetic field to provide more magnetic field components parallel to the target, can etch the target surface in a larger area, improves the target utilization rate, avoids frequently replacing the target, reduces the times of opening a vacuum chamber, can ensure the continuity of production, improves the working efficiency and can also improve the cleanliness of a product; in addition, the target can be effectively prevented from being melted by cooling through the water path.
However, the equipment cannot freely move the target, and when the target surface is unevenly etched, the position cannot be adjusted, so that the utilization rate of the target is very low, which is about 20%, and thus, a large amount of materials are wasted, the etching degree of the target cannot be controlled, and the operation space is very limited.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a rectangular plane magnetron sputtering cathode.
In order to achieve the purpose, the invention adopts the following technical scheme: the utility model provides a rectangle plane magnetron sputtering negative pole, includes the framework, bottom fixed mounting has the telescoping device in the framework, telescoping device upper end fixed mounting has power device, the equal fixed mounting in power device both sides has a storage device, the one end fixed mounting that power device was kept away from to storage device has the telescopic link, storage device's one end fixed mounting is kept away from to the telescopic link has T shape pole, the spout has been seted up to the framework lateral wall, T shape pole be located the spout inside and with spout lateral wall sliding connection.
As a further description of the above technical solution:
the power device comprises a power box, a fixing plate is fixedly mounted at the bottom in the power box, a plurality of second clamping teeth are fixedly mounted on the upper surface of the fixing plate, the second clamping teeth are meshed with gears, and power components are movably connected to the side walls of the gears.
As a further description of the above technical solution:
the power component comprises a movable rod, a connecting rod is fixedly mounted on the side wall of the movable rod, a cylinder is fixedly connected to the end portion of the connecting rod, one end of the cylinder, away from the connecting rod, is fixedly connected with the inner side wall of the power box, and a moving component is movably connected to the side wall of the power box.
As a further description of the above technical solution:
the movable assembly comprises a movable column, the movable column penetrates through the side wall of the power box, a plurality of first clamping teeth are fixedly mounted at the lower end of the movable column and are connected with the gear in a meshed mode, a rubber ring is movably sleeved on the outer surface of the movable column and is located inside the power box, and the rubber ring is fixedly connected with the inner side wall of the power box.
As a further description of the above technical solution:
the storage device comprises a connecting plate, a target material is fixedly mounted at the upper end of the connecting plate, a plurality of wheel rods are fixedly mounted at the bottom of the connecting plate, and wheels are movably sleeved on the outer surfaces of the wheel rods.
As a further description of the above technical solution:
the telescoping device includes the atress board, atress board lateral wall fixed mounting has two baffles, baffle lower extreme fixed mounting has No. two connecting rods, No. two one end fixed mounting that the atress board was kept away from to the connecting rod has No. two cylinders, No. two fixed cover of cylinder surface are equipped with the waterproof box, No. two cylinders keep away from the one end of No. two connecting rods and the inside wall fixed connection of framework, the bottom fixed mounting of atress board has two springs, the one end and the framework inside wall fixed connection of atress board are kept away from to the spring.
The invention has the following beneficial effects:
1. compared with the prior art, the rectangular plane magnetron sputtering cathode is provided with the power assembly and storage device, so that the horizontal position of the target can be changed at any time, the condition of uneven etching of the target is reduced, the utilization rate of the target is improved, and the waste of the target is reduced.
2. Compared with the prior art, the rectangular plane magnetron sputtering cathode can change the distance between the target and the anode by arranging the telescopic device, control the etching degree of the target, and bring great convenience to daily use.
Drawings
FIG. 1 is a schematic view of the overall structure of a rectangular planar magnetron sputtering cathode according to the present invention;
FIG. 2 is a schematic diagram of a power plant of a rectangular planar magnetron sputtering cathode according to the present invention;
FIG. 3 is a schematic view of a storage device for a rectangular planar magnetron sputtering cathode according to the present invention;
FIG. 4 is a schematic view of a telescopic device of a rectangular planar magnetron sputtering cathode according to the present invention.
Illustration of the drawings:
1. a frame body; 2. a power plant; 3. a material storage device; 4. a telescoping device; 5. a T-shaped rod; 6. a chute; 7. a telescopic rod; 21. a power box; 22. a first latch; 23. a rubber ring; 24. a gear; 25. a second latch; 26. a movable rod; 27. a fixing plate; 28. a first connecting rod; 29. a first cylinder; 210. a movable post; 31. a connecting plate; 32. a target material; 33. a wheel; 34. a wheel lever; 41. a stress plate; 42. a baffle plate; 43. a second connecting rod; 44. a spring; 45. a second cylinder; 46. a waterproof box.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 to 4, the present invention provides a rectangular planar magnetron sputtering cathode: including framework 1, bottom fixed mounting has telescoping device 4 in framework 1, and 4 upper ends fixed mounting of telescoping device have power device 2, and the equal fixed mounting in power device 2 both sides has a storage device 3, and the one end fixed mounting that power device 2 was kept away from to storage device 3 has telescopic link 7, and the one end fixed mounting that storage device 3 was kept away from to telescopic link 7 has T shape pole 5, and spout 6 has been seted up to framework 1 lateral wall, and T shape pole 5 is located inside 6 and 6 lateral walls sliding connection of spout.
The power component comprises a movable rod 26, a connecting rod 28 is fixedly mounted on the side wall of the movable rod 26, a cylinder 29 is fixedly connected to the end part of the connecting rod 28, one end, away from the connecting rod 28, of the cylinder 29 is fixedly connected with the inner side wall of the power box 21, a movable component is movably connected to the side wall of the power box 21, and the movable rod 26 plays a role in fixing the gear 24.
The movable assembly comprises a movable column 210, the movable column 210 penetrates through the side wall of the power box 21, a plurality of latches 22 are fixedly mounted at the lower end of the movable column 210, the plurality of latches 22 are meshed with the gear 24, a rubber ring 23 is movably sleeved on the outer surface of the movable column 210 and located inside the power box 21, the rubber ring 23 is fixedly connected with the inner side wall of the power box 21, and the rubber ring 23 plays a waterproof role.
The storing device 3 comprises a connecting plate 31, a target material 32 is fixedly mounted at the upper end of the connecting plate 31, a plurality of wheel rods 34 are fixedly mounted at the bottom of the connecting plate 31, wheels 33 are movably sleeved on the outer surfaces of the wheel rods 34, and the wheels 33 play a role in reducing friction force between the storing device 3 and a stress plate 41.
The working principle is as follows: drive power device 2 and storage device 3 through setting up telescoping device 4 and reciprocate, storage device 3 slides in the spout 6 of framework 1 lateral wall through T shape pole 5, make storage device 3 can reciprocate, make storage device 3 can the level come and go to slide through power device 2, start cylinder 29 No. one, make the horizontal come and go motion of connecting rod 28 No. one, drive gear 24 and rotate, because a latch 22 is connected with the meshing of gear 24, make activity post 210 along with the horizontal reciprocating motion of gear 24, drive two storage device 3 at last and be the reciprocating motion on horizontal position, make storage device 3's slip frictional force reduce through setting up wheel 33 and wheel pole 34, the moving process is more smooth.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (6)
1. The utility model provides a rectangle plane magnetron sputtering cathode, includes framework (1), its characterized in that: bottom fixed mounting has telescoping device (4) in framework (1), telescoping device (4) upper end fixed mounting has power device (2), the equal fixed mounting in power device (2) both sides has one storage device (3), the one end fixed mounting that power device (2) were kept away from in storage device (3) has telescopic link (7), the one end fixed mounting that storage device (3) were kept away from in telescopic link (7) has T shape pole (5), spout (6) have been seted up to framework (1) lateral wall, T shape pole (5) are located spout (6) inside and with spout (6) lateral wall sliding connection.
2. The rectangular planar magnetron sputtering cathode according to claim 1, wherein: power device (2) include headstock (21), bottom fixed mounting has fixed plate (27) in headstock (21), fixed surface installs a plurality of latches (25) on fixed plate (27), latch (25) meshing is connected with gear (24), gear (24) lateral wall swing joint has power component.
3. The rectangular planar magnetron sputtering cathode according to claim 2, wherein: the power component comprises a movable rod (26), a connecting rod (28) is fixedly mounted on the side wall of the movable rod (26), a cylinder (29) is fixedly connected to the end of the connecting rod (28), one end of the cylinder (29) away from the connecting rod (28) is fixedly connected to the inner side wall of the power box (21), and the side wall of the power box (21) is movably connected with a moving component.
4. A rectangular planar magnetron sputtering cathode according to claim 3, characterized in that: the movable assembly comprises a movable column (210), the movable column (210) penetrates through the side wall of the power box (21), a plurality of latches (22) are fixedly mounted at the lower end of the movable column (210) and are connected with gears (24) in a meshed mode, a rubber ring (23) is movably sleeved on the outer surface of the movable column (210), the rubber ring (23) is located inside the power box (21), and the rubber ring (23) is fixedly connected with the inner side wall of the power box (21).
5. The rectangular planar magnetron sputtering cathode according to claim 1, wherein: the material storage device (3) comprises a connecting plate (31), a target material (32) is fixedly mounted at the upper end of the connecting plate (31), a plurality of wheel rods (34) are fixedly mounted at the bottom of the connecting plate (31), and wheels (33) are movably sleeved on the outer surfaces of the wheel rods (34).
6. The rectangular planar magnetron sputtering cathode according to claim 1, wherein: telescoping device (4) are including atress board (41), atress board (41) lateral wall fixed mounting has two baffles (42), baffle (42) lower extreme fixed mounting has connecting rod (43) No. two, No. two one end fixed mounting that atress board (41) were kept away from in connecting rod (43) has cylinder (45) No. two, No. two cylinder (45) outer fixed cover is equipped with waterproof box (46), No. two cylinder (45) keep away from the one end of No. two connecting rod (43) and the inside wall fixed connection of framework (1), the bottom fixed mounting of atress board (41) has two springs (44), the one end and framework (1) inside wall fixed connection of atress board (41) are kept away from in spring (44).
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CN202110319424.4A CN113073301A (en) | 2021-03-25 | 2021-03-25 | Adjustable unbalanced rectangular plane magnetron sputtering cathode |
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CN202110319424.4A CN113073301A (en) | 2021-03-25 | 2021-03-25 | Adjustable unbalanced rectangular plane magnetron sputtering cathode |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116445874A (en) * | 2023-05-09 | 2023-07-18 | 宁波招宝磁业有限公司 | Magnetron sputtering target device for neodymium-iron-boron magnet |
CN116837332A (en) * | 2023-05-09 | 2023-10-03 | 宁波招宝磁业有限公司 | Magnetron sputtering method for surface of neodymium-iron-boron magnet |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116445874A (en) * | 2023-05-09 | 2023-07-18 | 宁波招宝磁业有限公司 | Magnetron sputtering target device for neodymium-iron-boron magnet |
CN116445874B (en) * | 2023-05-09 | 2023-09-05 | 宁波招宝磁业有限公司 | Magnetron sputtering target device for neodymium-iron-boron magnet |
CN116837332A (en) * | 2023-05-09 | 2023-10-03 | 宁波招宝磁业有限公司 | Magnetron sputtering method for surface of neodymium-iron-boron magnet |
CN116837332B (en) * | 2023-05-09 | 2023-11-17 | 宁波招宝磁业有限公司 | Magnetron sputtering method for surface of neodymium-iron-boron magnet |
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