CN115572955A - Target pit testing device and feedback control target walking method thereof - Google Patents

Target pit testing device and feedback control target walking method thereof Download PDF

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Publication number
CN115572955A
CN115572955A CN202211329077.4A CN202211329077A CN115572955A CN 115572955 A CN115572955 A CN 115572955A CN 202211329077 A CN202211329077 A CN 202211329077A CN 115572955 A CN115572955 A CN 115572955A
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target
pit
laser
adjusting
testing device
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CN202211329077.4A
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CN115572955B (en
Inventor
朱佳敏
陈思侃
高中赫
赵跃
吴蔚
甄水亮
丁逸珺
刘杰
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Shanghai Super Conductor Technology Co ltd
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Shanghai Super Conductor Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3485—Sputtering using pulsed power to the target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/52—Means for observation of the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The invention provides a target pit testing device and a feedback control target walking method thereof, wherein the target pit testing device comprises the following steps: the range finder, the driving mechanism and the target holder; the range finder is in driving connection with the driving mechanism; the target holder is arranged in the detection range of the distance meter; the range finder detects the radian of the step surface of the target material on the target support, the gap width of the concave pit and the gap depth; and the feedback control system adjusts the angle of the laser or the target according to the detection result and judges whether the target needs to be replaced. The method can judge whether the target needs to be replaced according to the detected gap depth, and improve the film coating quality of the superconducting tape. The detected gap width and the step surface radian can also adjust laser, so that the strip coating control is more accurate and effective.

Description

Target pit testing device and feedback control target walking method thereof
The present application is a divisional application of the following original applications:
application date of the original application: 12 and 14 days in 2020
Application No. of the original application: 202011462433.0
The invention of the original application is named: target pit testing device and feedback control target walking method thereof
Technical Field
The invention relates to the field of superconducting material coating, in particular to a target pit testing device and a feedback control target walking method thereof.
Background
Patent document No. cn201711451135.X discloses a pulsed laser coating apparatus, and one of the most important control points for obtaining high-quality thin film performance is: the components of the target and the surface of the target are flat.
The direct and final characterization method for the strip coating is to test the critical current Ic of the strip, including the magnitude and uniformity of Ic. The greater the Ic of the strip per unit length, the less uniform and the better the film properties. Conversely, the smaller the Ic of the strip, the greater the uniformity and the poorer the quality of the film properties.
Very strict requirements are imposed on the macroscopic dimensions of the target. Because the pulsed laser beam strikes the surface of the target to form a light spot and a plume is struck on the surface of the target, the material of the target is plated on the strip material in a sputtering mode. If the target surface is flat, the plume will be emitted perfectly perpendicular to the target surface and the strip. Because sputtering is not done completely uniformly, the target material, after a period of use, exhibits dimples in the form of waves on the surface of the target. The plume struck again at this point cannot be made perfectly perpendicular to the target surface and the strip, and therefore non-uniformities can occur.
In the actual production process, the target surface is uneven due to various reasons, such as the change of the target density, the overall fragmentation or the local fragmentation, the intensive beating of a region by the pulse laser, and the like. If the target surface is uneven, the pulsed laser will strike, which will cause the plume to dump, resulting in a large reduction in the performance of the superconducting tape.
As shown in fig. 1, the target is about to be pierced, but it is difficult to judge whether the target is pierced in the next process of preparing the furnace length band by naked eyes in the target surface pit. Once the ribbon is made in half, the target is punched through and the remaining entire ribbon is discarded. The loss value of a long belt is ten times that of a new target material, so that the target material is generally conserved, and the target material is abandoned when the pits are not large, so that the utilization rate of the target material is insufficient, and a large amount of waste is caused.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a target pit testing device and a feedback control target moving method thereof.
The invention provides a target pit testing device, which comprises: the range finder 1, the driving mechanism 2 and the target holder 4;
the distance measuring instrument 1 is connected to the driving mechanism 2 in a driving way;
the target holder 4 is arranged in the detection range of the distance measuring instrument 1;
the range finder 1 detects the radian of the step surface of the target 3 on the target holder 4, the gap width of the pit and the gap depth;
and the feedback control system adjusts the angle of the laser or the target 3 according to the detection result and judges whether the target needs to be replaced.
Preferably, the method for determining whether the target needs to be replaced according to the detection result includes:
and replacing the target 3 under the condition that the gap depth of the pit is greater than a preset value.
Preferably, the method of adjusting the angle of the laser or the target 3 according to the detection result includes:
and adjusting the incidence position of the laser, or adjusting the incidence angle of the laser and the rotation angle of the target 3 according to the width of the pit so as to avoid the pit.
Preferably, the method of adjusting the angle of the laser or the target 3 according to the detection result includes:
and adjusting the target track of the next furnace strip during coating, thereby avoiding the pit.
Preferably, the target section is integrated according to the detection result to obtain the consumed target quantity, and the engineering current density and the coating efficiency are calculated; if the film coating efficiency is low, an alarm can be given in time, and maintenance measures are taken for the laser light path.
Preferably, the target holder 4 is connected to a target rotating mechanism 8, and the target rotating mechanism 8 can drive the target holder 4 to rotate;
the target rotating mechanism 8 is arranged on the target rotating base 9.
Preferably, the driving mechanism 2 is mounted on a guide rail base 6;
the driving mechanism 2 and the target holder 4 are arranged on a base 5.
The feedback control target walking method of the target pit testing device provided by the invention comprises the following steps:
detecting the radian of the step surface of the target 3 on the target holder 4, the gap width of the concave pit and the gap depth;
and the feedback control system adjusts the angle of the laser or the target 3 according to the detection result and judges whether the target needs to be replaced.
Preferably, the method for determining whether the target needs to be replaced by adjusting the angle of the laser or the target 3 according to the detection result includes:
adjusting the incidence position of the laser, or adjusting the incidence angle of the laser and the rotation angle of the target 3 according to the width of the pit, so as to avoid the pit;
and adjusting the target track of the next furnace strip during coating according to the width of the pit so as to avoid the pit.
Preferably, integrating the target section according to the detection result to obtain the target amount consumed at this time, and calculating the engineering current density and the coating efficiency; if the film coating efficiency is low, an alarm can be given in time, and maintenance measures are taken for a laser light path.
Compared with the prior art, the invention has the following beneficial effects:
the quality of the target, for example the density non-uniformity of the target, can be monitored.
The method can judge whether the target needs to be replaced according to the detected gap depth, and improve the film coating quality of the superconducting tape.
The area with violent surface change of the target can be found, and the laser is prevented from hitting the area in the next furnace production.
The target can be dynamically used, the consumption of the target can be uniformized, and the utilization rate of the target can be maximized.
The rough area on the surface of the target can be avoided, and the film coating quality of the superconducting tape is improved.
And integrating the target section according to the detection result to obtain the consumed target quantity, and calculating the engineering current density and the coating efficiency. If the film coating efficiency is low, an alarm can be given in time, and maintenance measures are taken for a laser light path. The production stability is improved.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic diagram of the output of a rangefinder;
fig. 2 is a schematic structural diagram of the present invention.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
As shown in fig. 2, the present invention provides a target pit testing apparatus, including: range finder 1, drive mechanism 2 and target holder 4.
The distance measuring device 1 is connected to the drive mechanism 2 in a driving manner and is movable in the movement direction of the drive mechanism 2. The target holder 4 is disposed within the detection range of the distance meter 1. The range finder 1 detects the radian of the step surface of the target 3 on the target holder 4, the gap width and the gap depth of the pit, and the feedback control system adjusts the angle of the laser or the target 3 according to the detection result to judge whether the target needs to be replaced.
As shown in fig. 1, the method for controlling the temperature of the coating film and determining whether the target needs to be replaced according to the detection result includes:
1. and the target 3 is replaced under the condition that the depth of the gap of the pit is greater than the preset value, so that the target is prevented from being punched through.
2. And adjusting the incidence position of the laser, or adjusting the incidence angle of the laser and the rotation angle of the target 3 according to the width of the pit so as to avoid the pit.
3. And adjusting the target track of the next furnace strip during coating according to the width of the pit so as to avoid the pit.
4. Integrating the target section according to the detection result to obtain the consumed target quantity, and calculating the engineering current density and the coating efficiency; if the film coating efficiency is low, an alarm can be given in time, and maintenance measures are taken for the laser light path.
In the present embodiment, the rangefinder 1 comprises a laser rangefinder. The driving mechanism 2 comprises a guide rail with a driving motor, and the distance measuring instrument 1 is arranged on the driving mechanism 2 through a distance measuring instrument support 7. The target holder 4 is connected on the target rotating mechanism 8, and the target rotating mechanism 8 can drive the target holder 4 to rotate to adjust the coating angle. The target rotating mechanism 8 is arranged on the target rotating base 9, the driving mechanism 2 is arranged on the guide rail base 6, and meanwhile, the target rotating base 9 and the guide rail base 6 are arranged on the same base 5.
The invention also provides a feedback control target walking method of the target pit testing device, which comprises the following steps:
and detecting the radian of the step surface of the target 3 on the target holder 4, the gap width of the concave pit and the gap depth.
And the feedback control system adjusts the angle of the laser or the target 3 according to the detection result and judges whether the target needs to be replaced.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.

Claims (10)

1. A target pit testing device is characterized by comprising: the range finder comprises a range finder (1), a driving mechanism (2) and a target holder (4);
the distance measuring instrument (1) is in driving connection with the driving mechanism (2);
the target holder (4) is arranged in the detection range of the distance measuring instrument (1);
the range finder (1) detects the radian of the step surface of the target material (3) on the target holder (4), the gap width of the pit and the gap depth;
and integrating the target section according to the detection result to obtain the consumed target quantity, and calculating the engineering current density and the coating efficiency.
2. The target pit testing apparatus according to claim 1, wherein the method for determining whether the target needs to be replaced according to the detection result comprises:
and replacing the target (3) under the condition that the gap depth of the pit is greater than a preset value.
3. The target pit testing apparatus according to claim 1, wherein the method of adjusting the angle of the laser or the target (3) according to the detection result comprises:
and adjusting the incidence position of the laser, or adjusting the incidence angle of the laser and the rotation angle of the target (3) according to the width of the pit so as to avoid the pit.
4. The target pit testing apparatus according to claim 1, wherein the method of adjusting the angle of the laser or the target (3) according to the detection result comprises:
and adjusting the target track of the next furnace strip during coating, thereby avoiding the pit.
5. The target pit testing apparatus according to claim 1, wherein if the coating efficiency is low, an alarm is given in time to take maintenance measures for the laser path.
6. The target pit testing device according to claim 1, characterized in that the target holder (4) is connected to a target rotating mechanism (8), and the target rotating mechanism (8) can drive the target holder (4) to rotate;
the target rotating mechanism (8) is arranged on the target rotating base (9).
7. The target pit testing apparatus according to claim 1, wherein the driving mechanism (2) is mounted on a rail base (6);
the driving mechanism (2) and the target holder (4) are arranged on the base (5).
8. A feedback control target walking method of a target pit testing device is characterized by comprising the following steps:
detecting the radian of the step surface of the target material (3) on the target holder (4), the gap width of the pit and the gap depth;
and integrating the target section according to the detection result to obtain the consumed target quantity, and calculating the engineering current density and the coating efficiency.
9. The feedback control target moving method of the target pit testing device according to claim 8, wherein the method for determining whether the target needs to be replaced by adjusting the angle of the laser or the target (3) according to the detection result comprises:
according to the width of the pit, adjusting the incidence position of the laser, or adjusting the incidence angle of the laser and the rotation angle of the target (3) so as to avoid the pit;
and adjusting the target track of the next furnace strip during film coating according to the width of the pit so as to avoid the pit.
10. The feedback control target walking method of the target pit testing device according to claim 9, wherein if the coating efficiency is low, an alarm can be given in time to take maintenance measures for the laser path.
CN202211329077.4A 2020-12-14 2020-12-14 Target pit testing device and feedback control target moving method thereof Active CN115572955B (en)

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CN115356493A (en) * 2022-07-14 2022-11-18 深圳模德宝科技有限公司 Target detection method, device, equipment and storage medium

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4545882A (en) * 1983-09-02 1985-10-08 Shatterproof Glass Corporation Method and apparatus for detecting sputtering target depletion
EP0615273A1 (en) * 1993-03-12 1994-09-14 Applied Materials, Inc. Method and apparatus for detection of sputtering target erosion
JPH10130833A (en) * 1996-11-01 1998-05-19 Anelva Corp Sputtering system
US20040144638A1 (en) * 2003-01-27 2004-07-29 Jaso Mark A. Device for measuring the profile of a metal film sputter deposition target, and system and method employing same
US20060021870A1 (en) * 2004-07-27 2006-02-02 Applied Materials, Inc. Profile detection and refurbishment of deposition targets
CN101268332A (en) * 2005-07-22 2008-09-17 普莱克斯技术有限公司 Real-time monitoring and controlling sputter target erosion
CN102230158A (en) * 2004-11-17 2011-11-02 Jx日矿日石金属株式会社 Sputtering target, sputtering target backing plate assembly and film deposition system
US20130156967A1 (en) * 2011-12-16 2013-06-20 Christopher Michaluk Spray rejuvenation of sputtering targets
CN108179386A (en) * 2017-12-27 2018-06-19 上海超导科技股份有限公司 Pulse laser coating apparatus
CN108180814A (en) * 2018-01-03 2018-06-19 京东方科技集团股份有限公司 A kind of target etches measuring device
CN108277457A (en) * 2017-12-27 2018-07-13 上海超导科技股份有限公司 Light path device and its pulse laser coating apparatus suitable for pulse laser plated film
JP2019007076A (en) * 2017-06-26 2019-01-17 国立大学法人茨城大学 Target wear detection mechanism, sputtering device with the same, and target wear detection method
CN109570931A (en) * 2018-12-08 2019-04-05 东曹(上海)电子材料有限公司 A kind of production method of large scale flat-panel monitor sputtering target material
CN210321557U (en) * 2019-07-09 2020-04-14 宁波江丰电子材料股份有限公司 Target material sputtering depth testing device
CN111647867A (en) * 2020-07-02 2020-09-11 杭州企势科技有限公司 Magnetron sputtering control mechanism of vacuum coating machine

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0046154B1 (en) * 1980-08-08 1984-11-28 Battelle Development Corporation Apparatus for coating substrates by high-rate cathodic sputtering, as well as sputtering cathode for such apparatus
JPS6070173A (en) * 1983-09-28 1985-04-20 Fujitsu Ltd Sputter treatment
CH669609A5 (en) * 1986-12-23 1989-03-31 Balzers Hochvakuum
JP4464650B2 (en) * 2003-10-01 2010-05-19 富士通株式会社 Laser deposition equipment
JP5059430B2 (en) * 2007-01-26 2012-10-24 株式会社大阪真空機器製作所 Sputtering method and sputtering apparatus
JP4723668B2 (en) * 2009-12-25 2011-07-13 Ｊｘ日鉱日石金属株式会社 Target backing plate assembly
US20140183036A1 (en) * 2012-12-27 2014-07-03 Intermolecular, Inc. In Situ Sputtering Target Measurement
CN203846096U (en) * 2014-05-08 2014-09-24 上海天马有机发光显示技术有限公司 Sputtering equipment and target thickness measuring system
US11479849B2 (en) * 2019-06-03 2022-10-25 Taiwan Semiconductor Manufacturing Company, Ltd. Physical vapor deposition chamber with target surface morphology monitor

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4545882A (en) * 1983-09-02 1985-10-08 Shatterproof Glass Corporation Method and apparatus for detecting sputtering target depletion
EP0615273A1 (en) * 1993-03-12 1994-09-14 Applied Materials, Inc. Method and apparatus for detection of sputtering target erosion
JPH10130833A (en) * 1996-11-01 1998-05-19 Anelva Corp Sputtering system
US20040144638A1 (en) * 2003-01-27 2004-07-29 Jaso Mark A. Device for measuring the profile of a metal film sputter deposition target, and system and method employing same
US20060021870A1 (en) * 2004-07-27 2006-02-02 Applied Materials, Inc. Profile detection and refurbishment of deposition targets
CN102230158A (en) * 2004-11-17 2011-11-02 Jx日矿日石金属株式会社 Sputtering target, sputtering target backing plate assembly and film deposition system
CN101268332A (en) * 2005-07-22 2008-09-17 普莱克斯技术有限公司 Real-time monitoring and controlling sputter target erosion
US20130156967A1 (en) * 2011-12-16 2013-06-20 Christopher Michaluk Spray rejuvenation of sputtering targets
JP2019007076A (en) * 2017-06-26 2019-01-17 国立大学法人茨城大学 Target wear detection mechanism, sputtering device with the same, and target wear detection method
CN108179386A (en) * 2017-12-27 2018-06-19 上海超导科技股份有限公司 Pulse laser coating apparatus
CN108277457A (en) * 2017-12-27 2018-07-13 上海超导科技股份有限公司 Light path device and its pulse laser coating apparatus suitable for pulse laser plated film
CN108180814A (en) * 2018-01-03 2018-06-19 京东方科技集团股份有限公司 A kind of target etches measuring device
CN109570931A (en) * 2018-12-08 2019-04-05 东曹(上海)电子材料有限公司 A kind of production method of large scale flat-panel monitor sputtering target material
CN210321557U (en) * 2019-07-09 2020-04-14 宁波江丰电子材料股份有限公司 Target material sputtering depth testing device
CN111647867A (en) * 2020-07-02 2020-09-11 杭州企势科技有限公司 Magnetron sputtering control mechanism of vacuum coating machine

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