CN111605264A - Ic封装用高可靠性无卤覆铜板及其制备方法 - Google Patents
Ic封装用高可靠性无卤覆铜板及其制备方法 Download PDFInfo
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 26
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 86
- 239000003292 glue Substances 0.000 claims abstract description 69
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 43
- 239000011889 copper foil Substances 0.000 claims abstract description 41
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims abstract description 34
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- 229920000647 polyepoxide Polymers 0.000 claims abstract description 25
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000003063 flame retardant Substances 0.000 claims abstract description 14
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 claims abstract description 13
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- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 10
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims abstract description 10
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- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 18
- 238000002156 mixing Methods 0.000 claims description 18
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 14
- 238000003756 stirring Methods 0.000 claims description 11
- XAZPKEBWNIUCKF-UHFFFAOYSA-N 1-[4-[4-[2-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]propan-2-yl]phenoxy]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(OC=2C=CC(=CC=2)N2C(C=CC2=O)=O)C=CC=1C(C)(C)C(C=C1)=CC=C1OC(C=C1)=CC=C1N1C(=O)C=CC1=O XAZPKEBWNIUCKF-UHFFFAOYSA-N 0.000 claims description 8
- -1 bis-pentadiene phenol Chemical compound 0.000 claims description 7
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 5
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- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
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- 150000002500 ions Chemical class 0.000 description 3
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
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- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
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- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
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- 239000000047 product Substances 0.000 description 2
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- 238000011160 research Methods 0.000 description 2
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- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 2
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
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- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
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Abstract
本发明公开了一种IC封装用高可靠性无卤覆铜板及其制备方法,属于5G用覆铜板及其生产技术领域。该覆铜板包括底铜箔层、顶铜箔层和位于二者间由1~8张预浸料叠合组成的绝缘介质层,每张预浸料均由玻璃纤维布在树脂胶液中浸渍后烘干得到,其中树脂胶液包括双戊二烯苯酚环氧树脂、马来酰亚胺树脂、固化剂、磷酸酯阻燃剂和二氧化硅填料,该树脂胶液以低粘度双戊二烯苯酚环氧树脂和多种马来酰亚胺树脂复配物为主树脂体系、环氧树脂和苯乙烯马来酸酐树脂复配为固化剂、角形二氧化硅和球型二氧化硅为填充物,制备所得覆铜板具有高频率、高速率、高耐热、低热膨胀系数、尺寸稳定性好等特性。
Description
技术领域
本发明涉及一种覆铜板及其制备方法,尤其涉及一种IC封装用高可靠性无卤覆铜板及其制备方法,属于5G用覆铜板及其生产技术领域。
背景技术
IC载板主要用以承载IC(Integrated Circuit),其内部布有线路用以导通芯片与电路板之间的讯号,且IC载板除了具有承载的功能之外,其还具有保护电路、专线、设计散热途径、建立零组件模块化标准等附加功能。
随着IC封装技术的发展,I/O数量增多、布线密度增大、基板层数增多,IC封装基板呈现出“四高一低”的发展趋势,即高密度布线、高速化和高频化、高导通性、高绝缘可靠性、低成本性。对IC封装用的覆铜板基板主要有如下技术要求:
(1)高频、高速IC芯片在封装时,为了减少信号传输延长时间,保障高频信号的高速、大容量、准确的传输,满足特性阻抗匹配要求,降低L、C、R等的寄生效应,降低交调噪声和防止信号反射噪声,要求IC封装用覆铜板不断的降低介电常数和介电损耗;
(2)随着超大规模和特大规模集成电路的问世,集成电路封装将具有更多引线、更小体积和更高封装密度,要想缩小封装体积,增加引线数量,唯一的办法就是缩小封装的引线间距。但是为了缩小引线间距,必须解决引线间距缩小所引起的引线间绝缘电阻降低和分步电容增大等各个方面的问题,这就对IC封装覆铜板提出了高耐热性、良好的尺寸稳定性、低热膨胀系数的要求;
(3)目前IC封装覆铜板的主要封装方式为非气密或半气密封装,所以其抗潮湿性能差,易受离子污染;同时热稳定性也不好,对电磁波不能屏蔽等,这就要求IC封装覆铜板具有高绝缘可靠性、高耐离子迁移等。
目前现有技术中缺少一种能够应用于5G技术且能够同时满足上述要求的覆铜板基板,这成为当前覆铜板研究技术领域的研究热点。
发明内容
为解决上述技术问题,本发明提供了一种IC封装用高可靠性无卤覆铜板及其制备方法,该覆铜板属于BT载板,具有高耐热、高韧性、高耐离子迁移、良好的尺寸稳定性、低热膨胀系数、低介电常数、低介质损耗等特性,且制备方法简便易操作。
本发明的技术方案是:
一种IC封装用高可靠性无卤覆铜板,包括位于底层的底铜箔层和位于顶层的顶铜箔层,该底铜箔层和顶铜箔层之间设有绝缘介质层,该绝缘介质层由1~8张预浸料叠合组成,其中每张预浸料均由玻璃纤维布在树脂胶液中浸渍后烘干得到。
上述覆铜板中的底铜箔层和顶铜箔层的厚度分别均为3~150μm。
上述覆铜板中的树脂胶液包括下述按重量份计的各组分:100~150份双戊二烯苯酚(DCPD)环氧树脂、850~950份马来酰亚胺树脂、350~400份固化剂、150~200份磷酸酯阻燃剂和500~700份二氧化硅填料。
本发明的树脂胶液中采用了双戊二烯苯酚(DCPD)环氧树脂,该树脂是一类分子结构中除含有苯环外,还含有饱和多环状的二环戊二烯结构的环氧树脂。这种环氧树脂的特殊骨架结构赋予它的固化物具有Tg高、吸湿性低,又具介电常数低的性能。这种特异性能是许多其他环氧树脂所不具备的,因为有些环氧树脂固化物往往是由于官能团浓度高、交联密度大从而获得的高Tg性能,但其结构中因极性大而造成Dk偏高;或者是另有些环氧树脂官能团浓度及极性虽低实现了低Dk性,但同时因为此结构特点会引起耐热性、耐吸湿性偏低。本申请中采用双戊二烯苯酚(DCPD)环氧树脂,同时采用含磷、含氮的树脂(酚醛环氧树脂)及阻燃剂(磷酸酯阻燃剂),实现N-P复合\协同阻燃,从而实现无卤阻燃,达到高耐热性及UL94 V-0的阻燃等级,并达到提高材料TG效果并保持了板材良好的韧性便于加工。
本发明的树脂胶液中采用的马来酰亚胺树脂为第一马来酰亚胺树脂、第二马来酰亚胺树脂和第三马来酰亚胺树脂按质量比为(4~6):(1-2):1进行均匀混合后所得。其中第一马来酰亚胺树脂为4,4'-双马来酰亚胺二苯甲烷,第二马来酰亚胺树脂为双(3-乙基-5-甲基-4-马来酰亚胺基苯)甲烷,第三马来酰亚胺树脂为2,2-二(4-(4-马来酰亚胺苯氧基)苯基)丙烷。更优的,马来酰亚胺树脂为4,4'-双马来酰亚胺二苯甲烷、双(3-乙基-5-甲基-4-马来酰亚胺基苯)甲烷和2,2-二(4-(4-马来酰亚胺苯氧基)苯基)丙烷按质量比为4:1:1进行均匀混合后所得。上述三种树脂中,4,4'-双马来酰亚胺二苯甲烷及2,2-二(4-(4-马来酰亚胺苯氧基)苯基)丙烷溶解性不好,Df性能介于氰酸酯和环氧树脂之间,但成本低、Tg高;双(3-乙基-5-甲基-4-马来酰亚胺基苯)甲烷Df低,溶解性好。三种马来酰亚胺树脂混合使用,和以往使用单一马来酰亚胺树脂相比,在保持低Df同时,极大的降低成本。
本发明的树脂胶液中采用的固化剂为酚醛环氧树脂和苯乙烯马来酸酐树脂按照质量比为10:(7~9)进行均匀混合后所得,优选为10:9。在该固化剂体系中,在常用的酚醛环氧树脂中额外加入了由苯乙烯和马来酸酐共聚而成的SMA(苯乙烯马来酸酐)树脂,其中马来酸酐由于空间位阻效应在一般条件下很难发生均聚,但和苯乙烯在静电作用下极易形成一种电荷转移络合物,在引发剂作用下发生自由基聚合,形成典型的二元交替共聚结构,其价格低廉,具有良好的耐热性和尺寸稳定性;且在与环氧树脂固化时,能够降低板材的Df性能,并通过和混合用的马来酰亚胺树脂反应极大的改善耐CAF性能。
本发明的树脂胶液中采用的二氧化硅填料为角形二氧化硅和球型二氧化硅按照质量比为1:(2~3)进行均匀混合所得,优选为1:2,且上述角形二氧化硅和球型二氧化硅的粒径均为0.7-2.0μm。本申请中在填料方面选用粒径相对一致的角形二氧化硅和球型二氧化硅的混合物,其具有高耐热、低热膨胀系数、低介电常数、低介质损耗等优异特性,完全适用于IC封装覆铜板的性能提升。
本发明还公开了一种上述IC封装用高可靠性无卤覆铜板的制备方法,该制备方法主要包括下述步骤:
S1,制备树脂胶液:将按重量份称取的100~150份双戊二烯苯酚环氧树脂、850~950份改性马来酰亚胺树脂、350~400份固化剂、150~200份磷酸酯阻燃剂和500~700份二氧化硅填料加入反应釜中,在30~40℃条件下搅拌4~6h;
S2,将步骤S1制得的所述树脂胶液涂覆在玻璃纤维布的双面,在200~250℃的下烘干2~4min,制得的玻璃纤维布浸胶料片为预浸料;
S3,根据最终覆铜板所需厚度和形状结构,取1-8张步骤S2制得的所述预浸料叠置在一起后进行裁切,最后双面覆盖一层铜箔分别作为顶铜箔层和底铜箔层后进行热压、冷却得到所需覆铜板。
其进一步的技术方案是:
步骤S3中进行热压、冷却时为在-700~-730mmHg、200~220℃条件下热压180~200min,自然冷却至室温。
本发明的有益技术效果是:
1、本申请树脂胶液所采用的双戊二烯苯酚环氧树脂具有高Tg、低吸湿性、低介电常数,其配合采用含磷、含氮的树脂(酚醛环氧树脂)及阻燃剂(磷酸酯阻燃剂),实现N-P复合\协同阻燃,从而实现无卤阻燃,达到高耐热性及UL94V-0的阻燃等级,并达到提高材料TG效果并保持了板材良好的韧性便于加工;
2、本申请树脂胶液采用三种马来酰亚胺树脂混合使用,和以往使用单一马来酰亚胺树脂相比,在保持低Df同时,能够极大的降低成本;
3、本申请树脂胶液采用的固化剂在酚醛环氧树脂中加入SMA树脂,其与环氧树脂固化时能够降低板材Df性能,并通过和复配马来酰亚胺树脂反应能极大改善耐CAF性能;
4、本申请树脂胶液填料选用角形和球型二氧化硅进行适当比例的复配,该复配混合物具有高耐热、低热膨胀系数、低介电常数、低介质损耗等优异特性,完全适用于IC封装覆铜板的性能提升;
5、本申请在覆铜板的制备中,采用涂覆预浸-裁切-覆铜-热压-冷却的制备工艺,操作简便且可使用常规设备完成此类覆铜板的生产,便于大规模生产。
综上,本申请通过对树脂胶液成分和配比的选择,使得本本申请所述覆铜板具有耐热、高韧性、高耐离子迁移的同时拥有良好的尺寸稳定性、低热膨胀系数、低介电常数、低介质损耗等优异性能,特别是在稳定的高温态机械特性(主要包括高温下的抗弯强度特性、弹性模量、铜箔粘接强度特性、表面硬度等)方面,比其他树脂的基板材料(如:一般的环氧树脂、聚酰亚胺树脂、聚苯醚树脂等制出的基板材料)有着更突出的优势。因此,它在IC封装基板应用方面提高了在晶片安装、高密度布线上的绝缘可靠性及工艺加工性。
具体实施方式
为了能够更清楚了解本发明的技术手段,并可依照说明书的内容予以实施,下面结合具体实施例,对本发明的具体实施方式作进一步详细描述,以下实施例用于说明本发明,但不用来限制本发明的范围。
本申请在制备具体实施例所述覆铜板时,所采用的树脂胶液组成如下所示。
树脂胶液A:该树脂胶液包括下述按重量份计的各组分,100份双戊二烯苯酚环氧树脂、850份马来酰亚胺树脂、350份固化剂、150份磷酸酯阻燃剂、500份二氧化硅填料。
其中马来酰亚胺树脂由4,4'-双马来酰亚胺二苯甲烷、双(3-乙基-5-甲基-4-马来酰亚胺基苯)甲烷、2,2-二(4-(4-马来酰亚胺苯氧基)苯基)丙烷按质量比4:1:1进行均匀混合所得。
其中固化剂由酚醛环氧树脂和SMA(苯乙烯马来酸酐)树脂按质量比10:9进行均匀混合所得。
其中二氧化硅填料为角形二氧化硅和球型二氧化硅按照质量比为1:2进行均匀混合所得,且角形二氧化硅和球型二氧化硅的粒径均为0.7-2.0μm。本具体实施例中所采用的角形二氧化硅的型号为Sibelco的Megasil 525ARI,且所采用的球型二氧化硅的型号为上海雅玛的SC-2050KC。
树脂胶液B:该树脂胶液包括下述按重量份计的各组分,120份双戊二烯苯酚环氧树脂、900份马来酰亚胺树脂、380份固化剂、180份磷酸酯阻燃剂、600份二氧化硅填料。
其中马来酰亚胺树脂组成同树脂胶液A中所述,固化剂组成同树脂胶液A中所述,二氧化硅填料组成同树脂胶液A中所述。
树脂胶液C:该树脂胶液包括下述按重量份计的各组分,150份双戊二烯苯酚环氧树脂、950份马来酰亚胺树脂、400份固化剂、200份磷酸酯阻燃剂、700份二氧化硅填料。
其中马来酰亚胺树脂组成同树脂胶液A中所述,固化剂组成同树脂胶液A中所述,二氧化硅填料组成同树脂胶液A中所述。
树脂胶液D:该树脂胶液各组分含量同树脂胶液A。
其中马来酰亚胺树脂由4,4'-双马来酰亚胺二苯甲烷、双(3-乙基-5-甲基-4-马来酰亚胺基苯)甲烷、2,2-二(4-(4-马来酰亚胺苯氧基)苯基)丙烷按质量比4:2:1进行均匀混合所得。
其中固化剂由酚醛环氧树脂和SMA(苯乙烯马来酸酐)树脂按质量比10:7进行均匀混合所得。
其中二氧化硅填料为角形二氧化硅和球型二氧化硅按照质量比为1:3进行均匀混合所得,其粒径和型号均与树脂胶液中所用一致。
树脂胶液E:该树脂胶液各组分含量同树脂胶液A。
其中马来酰亚胺树脂由4,4'-双马来酰亚胺二苯甲烷、双(3-乙基-5-甲基-4-马来酰亚胺基苯)甲烷、2,2-二(4-(4-马来酰亚胺苯氧基)苯基)丙烷按质量比6:1:1进行均匀混合所得。
其中固化剂由酚醛环氧树脂和SMA(苯乙烯马来酸酐)树脂按质量比10:8进行均匀混合所得。
其中二氧化硅填料为角形二氧化硅和球型二氧化硅按照质量比为1:2进行均匀混合所得,其粒径和型号均与树脂胶液中所用一致。
树脂胶液A’:该树脂胶液各组分含量同树脂胶液A。
其中马来酰亚胺树脂为4,4'-双马来酰亚胺二苯甲烷。
其中固化剂组成同树脂胶液A中所述。
其中二氧化硅填料组成同树脂胶液A中所述。
树脂胶液B’:该树脂胶液各组分含量同树脂胶液A。
其中马来酰亚胺树脂组成同树脂胶液A中所述。
其中固化剂仅为酚醛环氧树脂。
其中二氧化硅填料组成同树脂胶液A中所述。
树脂胶液C’:该树脂胶液各组分含量同树脂胶液A。
其中马来酰亚胺树脂组成同树脂胶液A中所述。
其中固化剂组成同树脂胶液A中所述。
其中二氧化硅填料为球型二氧化硅,且所采用的球型二氧化硅粒径和型号均同树脂胶液A中所述。
采用上述树脂胶液进行覆铜板的制备,其制备方法主要包括下述步骤:
S1,按照上述树脂胶液组成称取各组分后,在30~40℃条件下搅拌4~6h;
S2,将步骤S1制得的所述树脂胶液涂覆在玻璃纤维布的双面,在200~250℃的下烘干2~4min,制得的玻璃纤维布浸胶料片为预浸料;
S3,根据最终覆铜板所需厚度和形状结构,取1-8张步骤S2制得的所述预浸料叠置在一起后进行裁切,最后双面覆盖一层铜箔分别作为顶铜箔层和底铜箔层后,在-700~-730mmHg、200~220℃条件下热压180~200min,自然冷却至室温,得到所需覆铜板。
覆铜板制备具体实施例1:
S1,按照树脂胶液A组成称取各组分后,在30℃条件下搅拌4h;
S2,将步骤S1制得的所述树脂胶液A涂覆在玻璃纤维布的双面,在200℃的下烘干2min,制得的玻璃纤维布浸胶料片为预浸料;
S3,根据最终覆铜板所需厚度和形状结构,取6张步骤S2制得的所述预浸料叠置在一起后进行裁切,最后双面覆盖一层25μm厚铜箔分别作为顶铜箔层和底铜箔层后,在-700mmHg、200℃条件下热压180min,自然冷却至室温,得到所需覆铜板。
覆铜板制备具体实施例2:
S1,按照树脂胶液B组成称取各组分后,在35℃条件下搅拌5h;
S2,将步骤S1制得的所述树脂胶液B涂覆在玻璃纤维布的双面,在210℃的下烘干3min,制得的玻璃纤维布浸胶料片为预浸料;
S3,根据最终覆铜板所需厚度和形状结构,取6张步骤S2制得的所述预浸料叠置在一起后进行裁切,最后双面覆盖一层25μm厚铜箔分别作为顶铜箔层和底铜箔层后,在-710mmHg、210℃条件下热压190min,自然冷却至室温,得到所需覆铜板。
覆铜板制备具体实施例3:
S1,按照树脂胶液C组成称取各组分后,在40℃条件下搅拌6h;
S2,将步骤S1制得的所述树脂胶液C涂覆在玻璃纤维布的双面,在220℃的下烘干4min,制得的玻璃纤维布浸胶料片为预浸料;
S3,根据最终覆铜板所需厚度和形状结构,取6张步骤S2制得的所述预浸料叠置在一起后进行裁切,最后双面覆盖一层25μm厚铜箔分别作为顶铜箔层和底铜箔层后,在-730mmHg、220℃条件下热压200min,自然冷却至室温,得到所需覆铜板。
覆铜板制备具体实施例4:
S1,按照树脂胶液D组成称取各组分后,在30℃条件下搅拌4h;
S2和S3步骤同具体实施例一。
覆铜板制备具体实施例5:
S1,按照树脂胶液E组成称取各组分后,在30℃条件下搅拌4h;
S2和S3步骤同具体实施例一。
覆铜板制备对比例1:
S1,按照树脂胶液A’组成称取各组分后,在30℃条件下搅拌4h;
S2和S3步骤同具体实施例一。
覆铜板制备对比例2:
S1,按照树脂胶液B’组成称取各组分后,在30℃条件下搅拌4h;
S2和S3步骤同具体实施例一。
覆铜板制备对比例3:
S1,按照树脂胶液C’组成称取各组分后,在30℃条件下搅拌4h;
S2和S3步骤同具体实施例一。
覆铜板对比例4:
采用市售常规普通无卤覆铜板。
对以上具体实施例和对比例制备所得及购买所得覆铜板的性能进行测试结果如表1中所示。
表1具体实施例和对比例制备所得及购买所得覆铜板的性能结果表
从上述性能测试表可以得出,本实施例的覆铜板介电常数和介质损耗、耐热性、耐CAF性能优异,比较市场同类高端产品尤为突出。
以上所述仅是本发明的优选实施方式,并不用于限制本发明,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明技术原理的前提下,还可以做出若干改进和变型,这些改进和变型也应视为本发明的保护范围。
Claims (10)
1.一种IC封装用高可靠性无卤覆铜板,其特征在于:包括位于底层的底铜箔层和位于顶层的顶铜箔层,该底铜箔层和顶铜箔层之间设有绝缘介质层,该绝缘介质层由1~8张预浸料叠合组成,其中每张预浸料均由玻璃纤维布在树脂胶液中浸渍后烘干得到;其中所述树脂胶液包括下述按重量份计的各组分:100~150份双戊二烯苯酚环氧树脂、850~950份马来酰亚胺树脂、350~400份固化剂、150~200份磷酸酯阻燃剂和500~700份二氧化硅填料。
2.根据权利要求1所述的IC封装用高可靠性无卤覆铜板,其特征在于:所述马来酰亚胺树脂为第一马来酰亚胺树脂、第二马来酰亚胺树脂和第三马来酰亚胺树脂按质量比为(4~6):(1-2):1进行均匀混合后所得。
3.根据权利要求2所述的IC封装用高可靠性无卤覆铜板,其特征在于:所述第一马来酰亚胺树脂为4,4'-双马来酰亚胺二苯甲烷;所述第二马来酰亚胺树脂为双(3-乙基-5-甲基-4-马来酰亚胺基苯)甲烷;所述第三马来酰亚胺树脂为2,2-二(4-(4-马来酰亚胺苯氧基)苯基)丙烷。
4.根据权利要求3所述的IC封装用高可靠性无卤覆铜板,其特征在于:所述马来酰亚胺树脂为4,4'-双马来酰亚胺二苯甲烷、双(3-乙基-5-甲基-4-马来酰亚胺基苯)甲烷和2,2-二(4-(4-马来酰亚胺苯氧基)苯基)丙烷按质量比为4:1:1进行均匀混合后所得。
5.根据权利要求1所述的IC封装用高可靠性无卤覆铜板,其特征在于:所述固化剂为酚醛环氧树脂和苯乙烯马来酸酐树脂按照质量比为10:(7~9)进行均匀混合后所得。
6.根据权利要求1所述的IC封装用高可靠性无卤覆铜板,其特征在于:所述二氧化硅填料为角形二氧化硅和球型二氧化硅按照质量比为1:(2~3)进行均匀混合所得。
7.根据权利要求6所述的IC封装用高可靠性无卤覆铜板,其特征在于:所述角形二氧化硅和球型二氧化硅的粒径均为0.7-2.0μm。
8.根据权利要求1所述的IC封装用高可靠性无卤覆铜板,其特征在于:所述底铜箔层和顶铜箔层的厚度分别均为3~150μm。
9.一种权利要求1至8中任一权利要求所述IC封装用高可靠性无卤覆铜板的制备方法,其特征在于:主要包括下述步骤:
S1,制备树脂胶液:将按重量份称取的100~150份双戊二烯苯酚环氧树脂、850~950份改性马来酰亚胺树脂、350~400份固化剂、150~200份磷酸酯阻燃剂和500~700份二氧化硅填料加入反应釜中,在30~40℃条件下搅拌4~6h;
S2,将步骤S1制得的所述树脂胶液涂覆在玻璃纤维布的双面,在200~250℃的下烘干2~4min,制得的玻璃纤维布浸胶料片为预浸料;
S3,根据最终覆铜板所需厚度和形状结构,取1-8张步骤S2制得的所述预浸料叠置在一起后进行裁切,最后双面覆盖一层铜箔分别作为顶铜箔层和底铜箔层后进行热压、冷却得到所需覆铜板。
10.根据权利要求9所述的制备方法,其特征在于:步骤S3中进行热压、冷却时为在-700~-730mmHg、200~220℃条件下热压180~200min,自然冷却至室温。
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