CN111587488A - 电子模块 - Google Patents

电子模块 Download PDF

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Publication number
CN111587488A
CN111587488A CN201880086521.XA CN201880086521A CN111587488A CN 111587488 A CN111587488 A CN 111587488A CN 201880086521 A CN201880086521 A CN 201880086521A CN 111587488 A CN111587488 A CN 111587488A
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electronic
module
substrate
chip
electronic component
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CN201880086521.XA
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CN111587488B (zh
Inventor
池田康亮
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Shindengen Electric Manufacturing Co Ltd
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Shindengen Electric Manufacturing Co Ltd
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Publication of CN111587488A publication Critical patent/CN111587488A/zh
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Abstract

本发明的电子模块，包括：第一基板11；第二基板21，设置在所述第一基板11的一侧；以及芯片模块100，设置在所述第一基板11与所述第二基板21之间，其中，所述芯片模块100具有：电子元件13、23、以及与所述电子元件13、23电气连接的连接体60、70、80，所述电子元件13、23沿所述电子模块的厚度方向延伸。

Description

电子模块
技术领域
本发明涉及一种具有基板以及电子元件的电子模块。
背景技术
以往，在封装树脂内配置有多个电子元件的电子模块已被普遍认知。这种电子模块被要求实现小型化。
作为实现小型化的手段之一，可以考虑采用将电子元件进行叠层的结构。在国际公开公报2016/067383中就公开了这样的结构。然而，在该国际公开公报2016/067383中，仅仅只提出了将电子元件中包含的半导体元件设置在相向的两块基板上的方案，即：仅公开了在厚度方向上将半导体元件进行叠层的堆叠(Stack)构造。
另外，在国际公开公报2016/067383中，还公开另一种半导体模块，其包括：第一构件，具有：第一绝缘基板、设置在第一绝缘基板的配置面上的第一导体层、设置在第一导体层上的第一功率元器件、以及与第一功率元器件相连接的第一连接部；第二构件，具有：第二绝缘基板、设置在第二绝缘基板的配置面上的第二导体层、设置在第二导体层上的第二功率元器件、以及与第二功率元器件相连接的第二连接部；以及导体柱，在第一构件与第二构件之间按上下方向延伸。在该形态中，第一功率元器件与第二功率元器件不仅相向配置，同时还通过导体柱来连接。也就是说，上述这种结构同样也仅仅只公开了在半导体模块的厚度方向上将功率元器件进行叠层的堆叠构造。
本发明提供了一种将电子元件以不同于以往的方式进行安装，以提升设计自由度的电子模块。
发明内容
【概念1】
本发明涉及的电子模块，包括：
第一基板；
第二基板，设置在所述第一基板的一侧；以及
芯片模块，设置在所述第一基板与所述第二基板之间，
其中，所述芯片模块具有：电子元件、以及与所述电子元件电气连接的连接体，
所述电子元件沿作为所述电子模块的厚度方向的第一方向延伸。
【概念2】
在上述【概念1】所述的电子模块中，
所述芯片模块具有：第一电子元件、以及通过所述连接体与所述第一电子元件相连接的第二电子元件。
【概念3】
在上述【概念1】或【概念2】所述的电子模块中，
所述连接体具有第一连接体以及第二连接体，
所述芯片模块具有：第一电子元件、第二电子元件、设置在所述第一电子元件与所述第二电子元件之间的第一连接体、以及设置在所述第二电子元件的与所述第一连接体相反一侧的第二连接体。
【概念4】
在上述【概念1】至【概念3】中任意一项所述的电子模块中，
所述连接体具有：头部、以及从所述头部沿头部的厚度方向延伸的柱部，
所述头部在所述电子模块的厚度方向上延伸。
【概念5】
在上述【概念1】至【概念4】中任意一项所述的电子模块中，
所述芯片模块被设置有多个，
在所述芯片模块之间，设置有与所述芯片模块电气连接的芯片连接体。
【概念6】
在上述【概念5】中任意一项所述的电子模块中，
所述芯片模块具有与所述芯片连接体相嵌合的嵌合部。
【概念7】
在上述【概念1】至【概念6】中任意一项所述的电子模块中，进一步包括：
第一导体层，设置在所述第一基板的一侧；以及
第二导体层，设置在所述第二基板的另一侧，
其中，所述连接体具有各自连接所述电子元件与所述第一导体层以及所述第二导体层的连接端子，
与所述连接端子相连接的第一导体层以及第二导体层中的任意一方不与外部装置电气连接。
【概念8】
在上述【概念1】至【概念7】中任意一项所述的电子模块中，进一步包括：
第一导体层，设置在所述第一基板的一侧；以及
第二导体层，设置在所述第二基板的另一侧，
其中，所述连接体具有：头部、从所述头部的端部沿所述第一基板的面内方向延伸，并且与所述第一导体层相连接的第一基端部、以及从所述头部的端部沿所述第二基板的面内方向延伸，并且与所述第二导体层相连接的第二基端部，
所述第一基端部从所述头部的端部延伸的方向与所述第二基端部从所述端子头部的端部延伸的方向在包含第二方向以及第三方向的电子模块的面内方向上不重合。
【概念9】
在上述【概念8】所述的电子模块中，
所述第一基端部从所述头部的端部延伸的方向与所述第二基端部从所述端子头部的端部延伸的方向相差180度。
发明效果
在本发明中，当采用设置在连接体上的电子元件沿从第一基板向第二基板的方向延伸的形态的情况下，就能够在与往不同的方向上来配置电子元件，这相对于以往已提出的配置方案来说，能够提升设计自由度。
附图说明
图1是可在本发明第一实施方式中使用的电子模块的侧截面图。
图2是从图1中的箭头A进行观看时的第二连接体的侧面图。
图3是由不同于图2所示的形态构成的第二连接体的侧面图。
图4是可在本发明第二实施方式中使用的电子模块的侧截面图。
图5是可在本发明第二实施方式中使用的电子模块的平面图。
图6是由不同于图4所示的形态构成的，可在本发明第二实施方式中使用的电子模块的侧截面图。
图7是可在本发明第三实施方式中使用的电子模块的侧截面图，图中未对封装部等一部分构件进行展示。
图8是可在本发明第四实施方式中使用的电子模块的侧截面图，图中未对封装部等一部分构件进行展示。
图9是由不同于图8所示的形态构成的，可在本发明第四实施方式中使用的电子模块的侧截面图，图中未对封装部等一部分构件进行展示。
图10是可在本发明第五实施方式中使用的电子模块的侧截面图，图中未对封装部等一部分构件进行展示。
图11是由不同于图10所示的形态构成的，可在本发明第五实施方式中使用的电子模块的侧截面图，图中未对封装部等一部分构件进行展示。
图12是由不同于图10以及图11所示的形态构成的，可在本发明第五实施方式中使用的电子模块的侧截面图，图中未对封装部等一部分构件进行展示。
图13是可在本发明第六实施方式中使用的电子模块的侧截面图。
具体实施方式
第一实施方式
《构成》
在本实施方式中，“一侧”指的是图1中的上方侧，“另一侧”指的是图1中的下方侧。另外，将图1中的上下方向称为“第一方向”、左右方向称为“第二方向”、纸面的表里方向称为“第三方向”。将包含第二方向以及第三方向的面内方向称为“面内方向”，将从图1的上方进行观看称为“从平面看”。
如图1所示，电子模块具有：第一基板11、配置在第一基板11的一侧的第二基板21、以及配置在第一基板11与第二基板21之间的芯片模块100。芯片模块100具有：电子元件13、23、以及与电子元件13、23电气连接的连接体60、70、80。电子元件13、23可以在电子模块的厚度方向即第一方向上延伸。在电子模块的“厚度方向”(也就是“第一方向”)上延伸不仅是指沿第一基板11的法线方向(第一方向)延伸，还包含相对于第一基板11的法线方向倾斜着延伸的形态。电子元件13、23例如大致呈厚度较薄的直方体形。电子元件13、23延伸的方向与厚度方向(从电子元件13、23的正面向背面的方向以及从电子元件13、23的背面向正面的方向)相垂直。
芯片模块100可以具有：第一电子元件13、以及通过连接体60、70、80与第一电子元件13相连接的第二电子元件23。本实施方式中的芯片模块100可以在制造电子模块之前预先进行组装。当采用此形态的情况下，在组装时，由于可以适宜地来载置芯片模块100，因此能够提高制造效率。
连接体60、70、80可以具有第一连接体60以及第二连接体70。此情况下，芯片模块100可以具有：第一电子元件13、第二电子元件23、设置在第一电子元件13与第二电子元件23之间的第一连接体60、以及设置在第二电子元件23的与第一连接体60相反一侧的第二连接体70。
连接体60、70、80还可以具有：头部61、71、以及从头部61、71向头部61、71的厚度方向延伸的柱部62、72。头部61、71也可以在电子模块的厚度方向上延伸。在图1所示的形态中，头部61、71的厚度方向为第二方向。在连接体60、70、80具有第一连接体60以及第二连接体70的形态中，第一连接体60可以具有：第一头部61、以及从第一头部61向第一头部61的厚度方向延伸的第一柱部62。另外，第二连接体70也可以具有：第二头部71、以及从第二头部71向第二头部71的厚度方向延伸的第二柱部72。
第一基板11的一侧可以设置有多个第一导体层12。第二基板21的另一侧也可以设置有多个第二导体层22。第一电子元件13以及第二电子元件23可以皆为或仅其中一方为开关元件或控制元件。作为开关元件可以使用MOSFET或IGBT等。第一电子元件13以及第二电子元件23可以各自由半导体元件构成，作为半导体元件的材料可以是硅、碳化硅、或是氮化镓等。
第一电子元件13与第一连接体60之间配置有导电性接合剂95，并且第一电子元件13与第一连接体60可以通过导电性接合剂95来连接。同样的，第一连接体60与第二电子元件23之间配置有导电性接合剂95，并且第一连接体60与第二电子元件23可以通过导电性接合剂95来连接。同样的，第二电子元件23与第二连接体70之间配置有导电性接合剂95，并且第二电子元件23与第二连接体70可以通过导电性接合剂95来连接。
第一基板11的另一侧设置有由铜等金属构成的第一散热层19。同样的，第二基板21的一侧设置有由铜等金属构成的第二散热层29。
作为第一基板11以及第二基板21，可以采用陶瓷基板或绝缘树脂层等。作为导电性接合剂95，除了焊锡以外，还可以采用以Ag和Cu为主成分的材料。作为第一连接体60以及第二连接体70的材料，可以采用Cu等金属材料。作为基板11、21例如可以采用进行了电路图形化后的金属基板，此情况下，基板11、21可以兼为导体层12、22。
电子模块如前述般，可以具有由用于将第一电子元件13、第二电子元件23、第一连接体60、第二连接体70、以及第一导体层22等进行封装的封装树脂等构成的封装部90。
当第一电子元件13为MOSFET等开关元件的情况下，可以在第一连接体60一侧的面(图1中右侧的面)配置第一栅电极13g以及第一源电极13s。同样的，当第二电子元件23为MOSFET等开关元件的情况下，可以在第二连接体70一侧的面(图1中右侧的面)配置第二栅电极23g以及第二源电极23s。此情况下，第二连接体70可以通过导电性接合剂95与第二电子元件23的第二源电极23s相连接。第一连接体60则可以通过导电性接合剂95将第一电子元件13的第一源电极13s与设置在第二电子元件23的与第二连接体70相反一侧的面(图1中左侧的面)上的第二漏电极23d连接。第一电子元件13的与第一连接体60相反一侧的面(图1中左侧的面)上可以设置有第一漏电极13d。第一栅电极13g可以通过导电性接合剂95与第一连接件30相连接，该第一连接件30通过导电性接合剂95可以与导体层12、22相连接(在图1中与第二导体层22相连接)。第二栅电极23g可以通过导电性接合剂95与第而连接件40相连接，该第二连接件40通过导电性接合剂95可以与导体层12、22相连接(在图1中与第一导体层12相连接)。
端子110、120与导体层12、22之间的接合不仅可以通过利用焊锡等导电性接合95的实现，还可以通过利用激光焊接或超声波焊接来实现。
连接体60、70、80可以具有将电子元件13、23与第一导体层12以及第二导体层22各自连接的连接端子80。与连接端子80相连接的第一导体层12以及第二导体层22中的任意一方可以不与外部装置电气连接。
当设置有本实施方式中的连接端子80的情况下，可以通过该连接端子80来进行散热。在图1所示的形态中，在第一电子元件13的与设置有第一连接体60的面相反一侧的面(左侧的面)上设置有连接端子80。因此，在该形态中，来自第一电子元件13的热量能够通过连接端子80来进行散热。
连接端子80可以具有：在电子模块的厚度方向(图1中的第一方向)上延伸的端子头部81、从端子头部81的端部沿第一基板11的面内方向(图1中的第二方向)延伸，并且与第一导体层12相连接的第一基端部82、以及从端子头部81的端部沿第二基板21的面内方向延伸，并且与第二导体层22相连接的第二基端部83。通过设置这样的第一基端部82以及第二基端部83，就能够更加确实地与第一导体层12以及第二导体层22相连接，并且提升散热效果。
第一连接体60可以具有设置在第一头部61上，并且与第一导体层12或第二导体层22相连接的第一连接体基端部63。第一连接体基端部63可以具有：从第一头部61的端部沿第一基板11的面内方向(图1中的第二方向)延伸，并且与第一导体层12相连接的第一基端部63a、以及从第二头部71的端部沿第二基板21的面内方向延伸，并且与第二导体层22相连接的第二基端部63b。
第二连接体70可以具有设置在第二头部71上，并且与第一导体层12或第二导体层22相连接的第二连接体基端部73。第二连接体基端部73可以具有：从第二头部71的端部沿第一基板11的面内方向(图1中的第二方向)延伸，并且与第一导体层12相连接的第一基端部73a、以及从第二头部71的端部沿第二基板21的面内方向延伸，并且与第二导体层22相连接的第二基端部73b。
在图1所示的形态中，第一基端部82从端子头部81的端部延伸的面内上的方向与第二基端部83从端子头部81的端部延伸的面内上的方向为相同方向(图1的左方向)。不过，又不仅限于此形态，也可以是：第一基端部82从端子头部81的端部延伸的面内方向与第二基端部83从端子头部81的端部延伸的面内上的方向为不同方向(例如相差180度)。
《作用·效果》
接下来，将对由上述结构构成的本实施方式的作用以及效果进行说明。另外，可以将在《作用·效果》中说明的任何形态适用于上述结构。
在本实施方式中，当采用设置在连接体60、70、80上的电子元件13、23沿从第一基板11向第二基板21的方向延伸的形态的情况下，就能够在与往不同的方向上来配置电子元件13、23，这相对于以往已提出的配置方案来说，能够提升设计自由度。
在本实施方式中，当采用芯片模块100具有：第一电子元件13、以及通过第一连接体60与第一电子元件13相连接的第二电子元件23的形态的情况下，就能够使用通过第一连接体60将第一电子元件13与第二电子元件23连接的芯片模块100。这样一来，就能够例如通过第一连接体60将第一电子元件13的第一源电极13s与第二电子元件23的第二漏电极23d电气连接、或是通过第一连接体60将第一电子元件13的第一漏电极13d与第二电子元件23的第二源电极23s电气连接，从而将它们作为单个芯片模块100来利用。
当采用芯片模块100具有：第一电子元件13、第二电子元件23、设置在第一电子元件13与第二电子元件23之间的第一连接体60、以及设置在第二电子元件23的与第一连接体60相反一侧的第二连接体70的形态的情况下，就能够通过第一连接体60将第一电子元件13与第二电子元件23连接，并且还能够使用具有与第二电子元件23相连接的第二连接体70的芯片模块100。这样一来，就能够采用例如：通过第一连接体60将第一电子元件13的第一源电极13s与第二电子元件23的第二漏电极23d电气连接，并且通过第二连接体70来连接第二电子元件23的第二源电极23s连接的形态、或是通过第一连接体60将第一电子元件13的第一漏电极13d与第二电子元件23的第二源电极23s电气连接，并且通过第二连接体70来连接第二电子元件23的第二漏电极23d连接的形态，从而将它们作为单个芯片模块100来利用。
当采用连接体60、70、80具有：头部61、71、以及从头部61、71沿头部61、71的厚度方向延伸的柱部62、72的形态的情况下，就能够防止来自电子元件13、23的热量发生聚集。当采用第一连接体60具有第一柱部62的形态的情况下，就能够在第一电子元件13与第二电子元件23之间设置规定以上的距离，从而防止来自电子元件13以及第二电子元件23的热量发生聚集。另外，当采用第二连接体70具有第二柱部72的形态的情况下，由于来自第二电子元件23的热量会经过一段距离后再传递至第一导体层12或第二导体层22，因此就能够防止来自第二电子元件23的热量发生聚集。特别是当采用如本实施方式般第一电子元件13、23从第一基板11向沿第二基板21的方向延伸的形态的情况下，能够在第一电子元件13与第二电子元件23之间设置规定以上的距离，从散热的观点来说是非常有益的。
当第一基端部63a、73a、82延伸的面内上的方向与第二基端部63b、73b、83延伸的面内上的方向不同时，就能够在芯片模块的面内方向上使热量的流动方向有所不同，从而提升散热效果。从此观点来看，采用第一基端部63a、73a、82延伸的面内上的方向与第二基端部63b、73b、83延伸的面内上的方向相差180度的形态时十分有益的。特别是，当采用如本实施方式般电子元件13、23沿从第一基板向第二基板21的方向延伸的形态的情况下，由于热量容易聚集，因此能够像这样来提升散热效果是非常有益的。
如图2所示，从侧面观看连接体60、70时(图2中展示的是从图1中的箭头A方向观看时的样子)，其可以呈细长的矩形。但又不仅限于此形态，也可以如图3所示，从侧面观看连接体60、70时，其可以设置有突出面71a。在图2以及图3中，虽然展示有第二连接体70的结构，但第一连接体60也可以与图2以及图3中所展示的第二连接体70为相同的结构。
第二实施方式
接下来，对本发明的第二实施方式进行说明。
在实施方式中，如图4至图6所示，设置有多个芯片模块100。另外本实施方式能够采用上述第一实施方式中已进行说明的任何一种形态。与第一实施方式相同的构件在本实施方式中使用同一符号来进行说明。
当如本实施方式般设置有多个芯片模块100时，在各个芯片模块100中，第一电子元件13以及第二电子元件23可以在电子模块的厚度方向(第一方向)上延伸。
另外，能够对芯片模块100的配置方向进行适宜地调整。如果将从第一电子元件13向第二电子元件23的方向(图4的左右方向)设为芯片模块100的厚度方向的话，某一个芯片模块100的厚度方向就可以与其他的芯片模块100的厚度方向互有不同。例如图5所示般，某个芯片模块100a(例如后述的第二芯片模块100a)的厚度方向也可以与其他的芯片模块100b(例如后述的第二芯片模块100b)的厚度方向在电子模块的面内方向上(包含第二方向以及第三方向的面内方向)相互垂直。还可以如图6所示般，某个芯片模块100a中从第一电子元件13向第二电子元件23的方向(参照图6中的箭头A1)也可以与其他芯片模块100b中从第一电子元件13向第二电子元件23的方向(参照图6中的箭头A2)相差180度。
例如图5所示，当采用设置有第一芯片模块100a、第二芯片模块100b、第三芯片模块100c、以及第四芯片模块100d的形态的情况下，第一芯片模块100a的厚度方向、第二芯片模块100b的厚度方向、第三芯片模块100c的厚度方向、以及第四芯片模块100d的厚度方向中的两个或以上的方向可以互为不同方向。作为一例，可以如图5所示般，第一芯片模块100a的厚度方向与第三芯片模块100c的厚度方向相一致，并且第二芯片模块11b的厚度方向与第四芯片模块100d的厚度方向相一致。另外，也可以如图5所示般，第一芯片模块100a以及第三芯片模块100c的厚度方向与第二芯片模块100b的厚度方向以及第四芯片模块100d的厚度方向在电子模块的面内方向上相互垂直。第一芯片模块100a中从第一电子元件13向第二电子元件23的方向(参照图5中的箭头a1)也可以与第三芯片模块100c中从第一电子元件13向第二电子元件23的方向(参照图5中的箭头a3)相差180度。同样的，第二芯片模块100b中从第一电子元件13向第二电子元件23的方向(参照图5中的箭头a2)也可以与第四芯片模块100d中从第一电子元件13向第二电子元件23的方向(参照图5中的箭头a4)相差180度。
第三实施方式
接下来，对本发明的第三实施方式进行说明。
本实施方式与第二实施方式一样设置有多个芯片模块100。并且如图7所示，在电子模块的面内方向上(包含第二方向以及第三方向的面内方向)的芯片模块100之间，还设置有作为与芯片模块100电气连接的第三连接体的芯片连接体150。另外，本实施方式能够采用上述各实施方式中已进行说明的任何一种形态。与上述各实施方式相同的构件在本实施方式中使用同一符号来进行说明。
根据本实施方式，由于在电子模块的面内方向上(的芯片模块100之间，设置有与芯片模块100电气连接的芯片连接体150，因此就能够将两个或以上的芯片模块100通过芯片连接体150电气连接。这样一来，就能够将多个芯片模块100作为单块(模块)来利用。
在电子模块的面内方向上，在芯片连接体150的周围可以设置有三个或以上的芯片模块100，这些芯片模块100可以通过芯片连接体150来相互实现电气连接。此形态下，就能够将这些芯片模块100作为单块(模块)来利用。
芯片连接体150可以具有：在电子模块的面内方向上延伸的第三头部151、以及从第三头部151向另一侧延伸的第三柱部152。
第四实施方式
接下来，对本发明的第四实施方式进行说明。
如图8所示，本实施方式与第三实施方式一样设置有芯片连接体150。本实施方式中的芯片模块100还具有与芯片连接体150相嵌合的嵌合部79。另外，本实施方式能够采用上述各实施方式中已进行说明的任何一种形态。与上述各实施方式相同的构件在本实施方式中使用同一符号来进行说明。
当设置有如本实施方式般的嵌合部79的情况下，不但能够在芯片模块100与芯片连接体150之间切实地进行定位，还能够在多个芯片模块100之间切实地进行定位。
另外，在本实施方式中，芯片模块100还可以具有凹部79a来作为嵌合部79。当设置有凹部79a的情况下，芯片连接体150的边缘部就能够嵌入该凹部79a内。在图8所示的示例中，作为一例，第二连接体70的第二头部71具有凹部79a。
另外，也不仅限于此形态，也可以如图9所示般，芯片模块100还可以具有凸部101来作为嵌合部。当设置有凸部101的情况下，可以设置用于将该凸部101嵌入芯片连接体150的凹部158。
第五实施方式
接下来，对本发明的第五实施方式进行说明。
如图10所示，在本实施方式中，设置有芯片连接体150a。本实施方式中的芯片连接体150a上还设置有第一电子部件160。该第一电子部件160可以通过导电性接合剂95载置在芯片连接体150a的载置面上。另外，本实施方式能够采用上述各实施方式中已进行说明的任何一种形态。与上述各实施方式相同的构件在本实施方式中使用同一符号来进行说明。
根据本实施方式，能够将芯片模块100中包含的第一电子元件13以及第二电子元件23与设置在芯片连接体150a上的第一电子部件160电气连接。作为第一电子部件160，可以使用继电器电路等部件，但又不仅限于此，也可以使用半导体元件等电子元件。
如图10所示，在第一电子部件160的一侧可以设置有用于将第一电子部件160与第二导体层22相连接的第四连接体260。第四连接体260与第一电子部件160之间设置有导电性接合剂95，第四连接体260与第二导体层22之间也设置有导电性接合剂95。
当采用图10所示的形态时，能够将具有芯片模块100与第一电子部件160的副电子模块作为单块模块的利用。
如图10所示，虽然在本实施方式中使用了板形的芯片连接体150a，但又不仅限于此，也可以使用如图7至图9所示具有第三柱部152的芯片连接体150。
另外，如图11所示，除了第一电子部件160以外还可以设置有第二电子部件170。作为该第二电子部件170，可以使用继电器电路等部件，但又不仅限于此，也可以使用半导体元件等电子元件。
第二电子部件170可以位于芯片连接体150的第三柱部152的另一侧，并且第二电子部件170也可以位于第三头部151的一侧。在图11所示的形态中，芯片连接体150与第二电子部件170之间设置有导电性接合剂95，第二电子部件170与第二导体层22之间也设置有导电性接合剂95。
当采用如图11所示的形态时，能够将具有芯片模块100与第一电子部件160以及第二电子部件170的副电子模块作为单块模块的利用。
另外，如图12所示，可以设置有两个及以上的芯片连接体150、150a。并且，可以在芯片连接体150、150a中的一个上设置第一电子部件160，而另一个与第二电子部件170电气连接。在图12所示的形态中，芯片连接体150a上设置有第一电子部件160，并且芯片连接体150与第二电子部件170电气连接。
另外，虽然在图10至图12的形态中展示有嵌合部79，但是也可以不设置这样的嵌合部79。在本实施方式中，除了第一电子元件13以及第二电子元件23之外，同样可以考虑事先准备包含第一电子部件160、第二电子部件170或同时包含第一电子部件160以及第二电子部件170的模块来作为副电子模块。
第六实施方式
接下来，对本发明的第六实施方式进行说明。
在上述各实施方式中，虽然对使用第二连接体70的形态进行了说明，但并不仅限于此。如图13所示，也可以不设置第二连接体70。在本实施方式中，设置有连接件45来取代第二连接体70。本实施方式同样能够采用上述各实施方式中已做说明的任何一种形态。与上述各实施方式相同的构件在本实施方式中使用同一符号来进行说明。本实施方式在不设置第二连接体70以外的部分上，具有上述各实施方式所具有的效果。
上述各实施方式、变形例中的记载以及附图中公开的图示仅为用于说明权利要求项中记载的发明的一例，因此权利要求项中记载的发明不受上述实施方式或附图中公开的内容所限定。本申请最初的权利要求项中的记载仅仅是一个示例，可以根据说明书、附图等的记载对权利要求项中的记载进行适宜的变更。
符号说明
11 第一基板
13 第一电子元件(电子元件)
21 第二基板
23 第二电子元件(电子元件)
60 第一连接体(连接体)
61 第一头部(头部)
62 第一柱部(柱部)
70 第二连接体(连接体)
71 第二头部(头部)
72 第二柱部(柱部)
79 嵌合部
80 连接端子
100 芯片模块
150 芯片连接体

Claims (9)

1.一种电子模块，其特征在于，包括：
第一基板；
第二基板，设置在所述第一基板的一侧；以及
芯片模块，设置在所述第一基板与所述第二基板之间，
其中，所述芯片模块具有：电子元件、以及与所述电子元件电气连接的连接体，
所述电子元件沿作为所述电子模块的厚度方向的第一方向延伸。
2.根据权利要求1所述的电子模块，其特征在于：
其中，所述芯片模块具有：第一电子元件、以及通过所述连接体与所述第一电子元件相连接的第二电子元件。
3.根据权利要求1所述的电子模块，其特征在于：
其中，所述连接体具有：第一连接体及第二连接体，
所述芯片模块具有：第一电子元件、第二电子元件、设置在所述第一电子元件与所述第二电子元件之间的第一连接体、以及设置在所述第二电子元件的所述第一连接体相反一侧的第二连接体。
4.根据权利要求1所述的电子模块，其特征在于：
其中，所述连接体具有：头部、以及从所述头部沿头部的厚度方向延伸的柱部，
所述头部在所述电子模块的厚度方向上延伸。
5.根据权利要求1所述的电子模块，其特征在于：
其中，所述芯片模块被设置有多个，
在所述芯片模块之间，设置有与所述芯片模块电气连接的芯片连接体。
6.根据权利要求5所述的电子模块，其特征在于：
其中，所述芯片模块具有与所述芯片连接体相嵌合的嵌合部。
7.根据权利要求1所述的电子模块，其特征在于，进一步包括：
第一导体层，设置在所述第一基板的一侧；以及
第二导体层，设置在所述第二基板的另一侧，
其中，所述连接体具有各自连接所述电子元件与所述第一导体层以及所述第二导体层的连接端子，
与所述连接端子相连接的第一导体层以及第二导体层中的任意一方不与外部装置电气连接。
8.根据权利要求1所述的电子模块，其特征在于，进一步包括：
第一导体层，设置在所述第一基板的一侧；以及
第二导体层，设置在所述第二基板的另一侧，
其中，所述连接体具有：头部、从所述头部的端部沿所述第一基板的面内方向延伸，并且与所述第一导体层相连接的第一基端部、以及从所述头部的端部沿所述第二基板的面内方向延伸，并且与所述第二导体层相连接的第二基端部，
所述第一基端部从所述头部的端部延伸的方向与所述第二基端部从所述端子头部的端部延伸的方向在包含第二方向以及第三方向的电子模块的面内方向上不重合。
9.根据权利要求8所述的电子模块，其特征在于：
其中，所述第一基端部从所述头部的端部延伸的方向与所述第二基端部从所述端子头部的端部延伸的方向相差180度。
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