CN111566803B - 用于控制纳米线或纳米片晶体管器件的晶体管延迟的方法 - Google Patents

用于控制纳米线或纳米片晶体管器件的晶体管延迟的方法 Download PDF

Info

Publication number
CN111566803B
CN111566803B CN201880085673.8A CN201880085673A CN111566803B CN 111566803 B CN111566803 B CN 111566803B CN 201880085673 A CN201880085673 A CN 201880085673A CN 111566803 B CN111566803 B CN 111566803B
Authority
CN
China
Prior art keywords
fin structure
stacked
channel
stacked fin
channel material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201880085673.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN111566803A (zh
Inventor
杰弗里·史密斯
苏巴迪普·卡尔
安东·J·德维莱尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN111566803A publication Critical patent/CN111566803A/zh
Application granted granted Critical
Publication of CN111566803B publication Critical patent/CN111566803B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0123Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/0193Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices the components including FinFETs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B41/00Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/30Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
    • H10B41/35Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/014Manufacture or treatment of FETs having zero-dimensional [0D] or one-dimensional [1D] channels, e.g. quantum wire FETs, single-electron transistors [SET] or Coulomb blockade transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
    • H10D30/0323Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon comprising monocrystalline silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/40FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
    • H10D30/43FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having one-dimensional [1D] charge carrier gas channels, e.g. quantum wire FETs or transistors having 1D quantum-confined channels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6735Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes having gates fully surrounding the channels, e.g. gate-all-around
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743Silicon
    • H10D30/6744Monocrystalline silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6757Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113Isolations within a component, i.e. internal isolations
    • H10D62/115Dielectric isolations, e.g. air gaps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • H10D62/118Nanostructure semiconductor bodies
    • H10D62/119Nanowire, nanosheet or nanotube semiconductor bodies
    • H10D62/121Nanowire, nanosheet or nanotube semiconductor bodies oriented parallel to substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/213Channel regions of field-effect devices
    • H10D62/221Channel regions of field-effect devices of FETs
    • H10D62/235Channel regions of field-effect devices of FETs of IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0123Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/0167Manufacturing their channels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0123Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/0172Manufacturing their gate conductors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85Complementary IGFETs, e.g. CMOS
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85Complementary IGFETs, e.g. CMOS
    • H10D84/853Complementary IGFETs, e.g. CMOS comprising FinFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D88/00Three-dimensional [3D] integrated devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D88/00Three-dimensional [3D] integrated devices
    • H10D88/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/60Wet etching
    • H10P50/64Wet etching of semiconductor materials
    • H10P50/642Chemical etching
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/69Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Thin Film Transistor (AREA)
  • Networks Using Active Elements (AREA)
  • Pulse Circuits (AREA)
CN201880085673.8A 2017-12-04 2018-12-03 用于控制纳米线或纳米片晶体管器件的晶体管延迟的方法 Active CN111566803B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762594352P 2017-12-04 2017-12-04
US62/594,352 2017-12-04
PCT/US2018/063623 WO2019112954A1 (en) 2017-12-04 2018-12-03 Method for controlling transistor delay of nanowire or nanosheet transistor devices

Publications (2)

Publication Number Publication Date
CN111566803A CN111566803A (zh) 2020-08-21
CN111566803B true CN111566803B (zh) 2024-02-23

Family

ID=66659359

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880085673.8A Active CN111566803B (zh) 2017-12-04 2018-12-03 用于控制纳米线或纳米片晶体管器件的晶体管延迟的方法

Country Status (6)

Country Link
US (2) US10714391B2 (https=)
JP (1) JP7089656B2 (https=)
KR (2) KR102449793B1 (https=)
CN (1) CN111566803B (https=)
TW (1) TWI775995B (https=)
WO (1) WO2019112954A1 (https=)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11404325B2 (en) 2013-08-20 2022-08-02 Taiwan Semiconductor Manufacturing Co., Ltd. Silicon and silicon germanium nanowire formation
KR102434993B1 (ko) * 2015-12-09 2022-08-24 삼성전자주식회사 반도체 소자
US12408431B2 (en) * 2018-04-06 2025-09-02 International Business Machines Corporation Gate stack quality for gate-all-around field-effect transistors
US10825933B2 (en) * 2018-06-11 2020-11-03 Taiwan Semiconductor Manufacturing Co., Ltd. Gate-all-around structure and manufacturing method for the same
US20200295127A1 (en) * 2019-03-13 2020-09-17 Intel Corporation Stacked transistors with different crystal orientations in different device strata
US11069679B2 (en) 2019-04-26 2021-07-20 International Business Machines Corporation Reducing gate resistance in stacked vertical transport field effect transistors
US11037905B2 (en) * 2019-04-26 2021-06-15 International Business Machines Corporation Formation of stacked vertical transport field effect transistors
WO2020232025A2 (en) * 2019-05-13 2020-11-19 Board Of Regents, The University Of Texas System Catalyst influenced chemical etching for fabricating three-dimensional sram architectures and optical waveguides
US11710667B2 (en) * 2019-08-27 2023-07-25 Taiwan Semiconductor Manufacturing Co., Ltd. Gate-all-around device with trimmed channel and dipoled dielectric layer and methods of forming the same
US11557655B2 (en) 2019-10-11 2023-01-17 Tokyo Electron Limited Device and method of forming with three-dimensional memory and three-dimensional logic
CN112951912B (zh) * 2019-12-10 2024-05-14 中芯国际集成电路制造(上海)有限公司 半导体结构及其形成方法
US11302692B2 (en) * 2020-01-16 2022-04-12 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor devices having gate dielectric layers of varying thicknesses and methods of forming the same
US20210296306A1 (en) 2020-03-18 2021-09-23 Mavagail Technology, LLC Esd protection for integrated circuit devices
US11837280B1 (en) * 2020-05-20 2023-12-05 Synopsys, Inc. CFET architecture for balancing logic library and SRAM bitcell
CN116325174A (zh) * 2020-09-29 2023-06-23 华为技术有限公司 晶体管及其制作方法、集成电路、电子设备
EP4250265A4 (en) 2020-11-20 2024-11-27 Drovid Technologies METHOD FOR TRANSMITTING AND MONITORING PARAMETERS DETECTED BY DRONES VIA (PAAS) WITH (AI)
CN116250077B (zh) * 2020-11-24 2025-08-22 中芯国际集成电路制造(上海)有限公司 半导体结构及半导体结构的形成方法
US11527535B2 (en) 2021-01-21 2022-12-13 International Business Machines Corporation Variable sheet forkFET device
US11424120B2 (en) 2021-01-22 2022-08-23 Tokyo Electron Limited Plasma etching techniques
CN115050646B (zh) * 2021-03-08 2025-05-27 北方集成电路技术创新中心(北京)有限公司 半导体结构及其形成方法
CN113130489A (zh) * 2021-03-12 2021-07-16 中国科学院微电子研究所 一种半导体器件的制造方法
CN115425076A (zh) * 2021-05-14 2022-12-02 三星电子株式会社 纳米片晶体管器件及其形成方法
US12170322B2 (en) * 2021-05-14 2024-12-17 Samsung Electronics Co., Ltd. Devices including stacked nanosheet transistors
US11843001B2 (en) 2021-05-14 2023-12-12 Samsung Electronics Co., Ltd. Devices including stacked nanosheet transistors
CN115347043A (zh) * 2021-05-14 2022-11-15 三星电子株式会社 纳米片晶体管器件及其形成方法
KR102864496B1 (ko) 2021-06-24 2025-09-24 삼성전자주식회사 반도체 장치 및 그 제조 방법
US12087770B2 (en) 2021-08-05 2024-09-10 International Business Machines Corporation Complementary field effect transistor devices
KR102877120B1 (ko) * 2021-08-13 2025-10-27 삼성전자주식회사 반도체 소자
US12166037B2 (en) * 2021-08-27 2024-12-10 Taiwan Semiconductor Manufacturing Company, Ltd. Isolation layers in stacked semiconductor devices
US12113067B2 (en) 2021-09-13 2024-10-08 International Business Machines Corporation Forming N-type and P-type horizontal gate-all-around devices
US11837604B2 (en) 2021-09-22 2023-12-05 International Business Machine Corporation Forming stacked nanosheet semiconductor devices with optimal crystalline orientations around devices
US12191208B2 (en) * 2021-09-23 2025-01-07 International Business Machines Corporation Dual strained semiconductor substrate and patterning
US12563797B2 (en) * 2021-10-15 2026-02-24 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device structure and method for forming the same
KR102947675B1 (ko) 2021-10-28 2026-04-06 삼성전자주식회사 3차원 반도체 소자 및 그의 제조 방법
US12255099B2 (en) 2021-10-28 2025-03-18 Samsung Electronics Co., Ltd. Methods of forming fin-on-nanosheet transistor stacks
US12310062B2 (en) 2021-11-11 2025-05-20 Samsung Electronics Co., Ltd. Integrated circuit devices including stacked transistors and methods of forming the same
US12439641B2 (en) * 2021-11-19 2025-10-07 Tokyo Electron Limited Compact 3D design and connections with optimum 3D transistor stacking
US12324207B2 (en) 2021-12-03 2025-06-03 International Business Machines Corporation Channel protection of gate-all-around devices for performance optimization
US20230178435A1 (en) * 2021-12-07 2023-06-08 Taiwan Semiconductor Manufacturing Co., Ltd. Complementary fet (cfet) devices and methods
US20230207468A1 (en) * 2021-12-28 2023-06-29 International Business Machines Corporation Stacked staircase cmos with buried power rail
US20230261090A1 (en) * 2022-02-14 2023-08-17 Taiwan Semiconductor Manufacturing Company, Ltd. Method of manufacturing a semiconductor device and a semiconductor device
US12262559B2 (en) * 2022-04-07 2025-03-25 Applied Materials, Inc. Monolithic complementary field-effect transistors having carbon-doped release layers
KR102893178B1 (ko) 2022-05-17 2025-11-28 삼성전자주식회사 반도체 장치
JP2025517426A (ja) * 2022-05-20 2025-06-05 東京エレクトロン株式会社 アクティブデバイスの形成前にウェーハ接合を介してバックサイド電源供給ネットワークを組み込んだシーケンシャル相補型fet
KR102809779B1 (ko) * 2022-09-14 2025-05-16 연세대학교 산학협력단 재구성 가능한 양극성 트랜지스터
US20240136229A1 (en) * 2022-10-17 2024-04-25 Applied Materials, Inc. Channel uniformity horizontal gate all around device
US20240429102A1 (en) * 2023-06-21 2024-12-26 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor structure and manufacturing method thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011029503A (ja) * 2009-07-28 2011-02-10 Toshiba Corp 半導体装置
CN105518840A (zh) * 2013-10-03 2016-04-20 英特尔公司 用于纳米线晶体管的内部间隔体及其制造方法
WO2017044107A1 (en) * 2015-09-10 2017-03-16 Intel Corporation Semiconductor nanowire device having cavity spacer and method of fabricating cavity spacer for semiconductor nanowire device
US9660028B1 (en) * 2016-10-31 2017-05-23 International Business Machines Corporation Stacked transistors with different channel widths
CN106876275A (zh) * 2015-11-30 2017-06-20 台湾积体电路制造股份有限公司 半导体器件及其制造方法
CN107017205A (zh) * 2015-11-30 2017-08-04 台湾积体电路制造股份有限公司 半导体器件及其制造方法
WO2017171845A1 (en) * 2016-04-01 2017-10-05 Intel Corporation Beaded fin transistor

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI283066B (en) * 2004-09-07 2007-06-21 Samsung Electronics Co Ltd Field effect transistor (FET) having wire channels and method of fabricating the same
US8551833B2 (en) * 2011-06-15 2013-10-08 International Businesss Machines Corporation Double gate planar field effect transistors
US9012284B2 (en) 2011-12-23 2015-04-21 Intel Corporation Nanowire transistor devices and forming techniques
WO2013095646A1 (en) 2011-12-23 2013-06-27 Intel Corporation Cmos nanowire structure
KR101958530B1 (ko) * 2012-07-27 2019-03-14 인텔 코포레이션 나노와이어 트랜지스터 디바이스 및 형성 기법
KR102002380B1 (ko) * 2012-10-10 2019-07-23 삼성전자 주식회사 반도체 장치 및 그 제조 방법
WO2015147792A1 (en) * 2014-03-24 2015-10-01 Intel Corporation Integration methods to fabricate internal spacers for nanowire devices
US9818872B2 (en) * 2015-06-30 2017-11-14 Taiwan Semiconductor Manufacturing Company, Ltd. Multi-gate device and method of fabrication thereof
EP3127862B1 (en) 2015-08-06 2018-04-18 IMEC vzw A method of manufacturing a gate-all-around nanowire device comprising two different nanowires
CN106531632B (zh) * 2015-09-10 2020-01-03 中国科学院微电子研究所 堆叠纳米线mos晶体管制作方法
US20170170268A1 (en) * 2015-12-15 2017-06-15 Qualcomm Incorporated NANOWIRE METAL-OXIDE SEMICONDUCTOR (MOS) FIELD-EFFECT TRANSISTORS (FETs) (MOSFETs) EMPLOYING A NANOWIRE CHANNEL STRUCTURE HAVING ROUNDED NANOWIRE STRUCTURES
KR102416133B1 (ko) 2016-01-11 2022-07-01 삼성전자주식회사 반도체 장치 및 그 제조 방법
CN106960870B (zh) * 2016-01-11 2021-09-10 三星电子株式会社 半导体装置及其制造方法
KR102360333B1 (ko) 2016-02-18 2022-02-08 삼성전자주식회사 반도체 장치
TWI625785B (zh) * 2016-03-02 2018-06-01 Tokyo Electron Limited 具有可調節選擇性之等向性矽與矽化鍺蝕刻

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011029503A (ja) * 2009-07-28 2011-02-10 Toshiba Corp 半導体装置
CN105518840A (zh) * 2013-10-03 2016-04-20 英特尔公司 用于纳米线晶体管的内部间隔体及其制造方法
WO2017044107A1 (en) * 2015-09-10 2017-03-16 Intel Corporation Semiconductor nanowire device having cavity spacer and method of fabricating cavity spacer for semiconductor nanowire device
CN106876275A (zh) * 2015-11-30 2017-06-20 台湾积体电路制造股份有限公司 半导体器件及其制造方法
CN107017205A (zh) * 2015-11-30 2017-08-04 台湾积体电路制造股份有限公司 半导体器件及其制造方法
WO2017171845A1 (en) * 2016-04-01 2017-10-05 Intel Corporation Beaded fin transistor
US9660028B1 (en) * 2016-10-31 2017-05-23 International Business Machines Corporation Stacked transistors with different channel widths

Also Published As

Publication number Publication date
JP2021506141A (ja) 2021-02-18
KR102449793B1 (ko) 2022-09-29
WO2019112954A1 (en) 2019-06-13
CN111566803A (zh) 2020-08-21
KR102550501B1 (ko) 2023-06-30
US20190172751A1 (en) 2019-06-06
US10714391B2 (en) 2020-07-14
US20200303256A1 (en) 2020-09-24
US10991626B2 (en) 2021-04-27
JP7089656B2 (ja) 2022-06-23
TW201937569A (zh) 2019-09-16
KR20200085920A (ko) 2020-07-15
KR20220137168A (ko) 2022-10-11
TWI775995B (zh) 2022-09-01

Similar Documents

Publication Publication Date Title
CN111566803B (zh) 用于控制纳米线或纳米片晶体管器件的晶体管延迟的方法
TWI804535B (zh) 製造半導體元件的方法、以及半導體元件
US10916637B2 (en) Method of forming gate spacer for nanowire FET device
US11024546B2 (en) Vertical field effect transistors
CN114097074A (zh) 用于通过高k金属栅极(hkmg)膜堆叠的选择性沉积来进行阈值电压调谐的方法
US20170053982A1 (en) Series resistance reduction in vertically stacked silicon nanowire transistors
US9202894B1 (en) Methods for forming semiconductor fin support structures
CN222106720U (zh) 半导体结构
US12507431B2 (en) 3D isolation of a segmentated 3D nanosheet channel region
US12328919B2 (en) 3D isolation of a segmentated 3D nanosheet channel region
US12113067B2 (en) Forming N-type and P-type horizontal gate-all-around devices

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant