CN111505905B - 干膜、固化物和电子部件 - Google Patents
干膜、固化物和电子部件 Download PDFInfo
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- CN111505905B CN111505905B CN201911004611.2A CN201911004611A CN111505905B CN 111505905 B CN111505905 B CN 111505905B CN 201911004611 A CN201911004611 A CN 201911004611A CN 111505905 B CN111505905 B CN 111505905B
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- 239000002562 thickening agent Substances 0.000 description 1
- 150000003553 thiiranes Chemical class 0.000 description 1
- 150000003568 thioethers Chemical group 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- NNENFOSYDBTCBO-UHFFFAOYSA-M tributyl(hexadecyl)phosphanium;chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[P+](CCCC)(CCCC)CCCC NNENFOSYDBTCBO-UHFFFAOYSA-M 0.000 description 1
- QEXITCCVENILJI-UHFFFAOYSA-M tributyl(phenyl)azanium;chloride Chemical compound [Cl-].CCCC[N+](CCCC)(CCCC)C1=CC=CC=C1 QEXITCCVENILJI-UHFFFAOYSA-M 0.000 description 1
- GLSQMJPVEVGXMZ-UHFFFAOYSA-N tributyl-(2,5-dihydroxyphenyl)phosphanium;bromide Chemical compound [Br-].CCCC[P+](CCCC)(CCCC)C1=CC(O)=CC=C1O GLSQMJPVEVGXMZ-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- JSPLKZUTYZBBKA-UHFFFAOYSA-N trioxidane Chemical group OOO JSPLKZUTYZBBKA-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/094—Multilayer resist systems, e.g. planarising layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/03—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers with respect to the orientation of features
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
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JP2019014697A JP7221064B2 (ja) | 2019-01-30 | 2019-01-30 | ドライフィルム、硬化物および電子部品 |
JP2019-014697 | 2019-01-30 |
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CN111505905A CN111505905A (zh) | 2020-08-07 |
CN111505905B true CN111505905B (zh) | 2024-03-12 |
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CN201911004611.2A Active CN111505905B (zh) | 2019-01-30 | 2019-10-22 | 干膜、固化物和电子部件 |
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JP (2) | JP7221064B2 (ja) |
KR (1) | KR102313172B1 (ja) |
CN (1) | CN111505905B (ja) |
TW (1) | TWI747040B (ja) |
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CN112099312A (zh) * | 2020-10-19 | 2020-12-18 | 河源诚展科技有限公司 | 一种光致抗蚀干膜及其制备方法 |
CN112782936A (zh) * | 2021-02-04 | 2021-05-11 | 杭州福斯特应用材料股份有限公司 | 一种感光膜及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003140333A (ja) * | 2001-11-01 | 2003-05-14 | Kanegafuchi Chem Ind Co Ltd | 剥離作業性に優れた感光性カバーレイフィルム |
CN102549499A (zh) * | 2009-09-30 | 2012-07-04 | 可隆工业株式会社 | 干膜光致抗蚀剂 |
JP2016188924A (ja) * | 2015-03-30 | 2016-11-04 | 日立化成株式会社 | ドライフィルム、硬化物、半導体装置及びレジストパターンの形成方法 |
JP2017052952A (ja) * | 2016-09-20 | 2017-03-16 | 味の素株式会社 | 保護フィルム付き接着シート、積層体の製造方法、及びプリント配線板の製造方法 |
Family Cites Families (7)
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JPS60136546A (ja) | 1983-12-26 | 1985-07-20 | Yashima Chem Ind Co Ltd | 置換フエニル酢酸アニリド誘導体、その製法及び用途 |
JP2002372781A (ja) | 2002-05-30 | 2002-12-26 | Hitachi Chem Co Ltd | 感光性エレメント |
JP2004066803A (ja) * | 2002-06-12 | 2004-03-04 | Daicel Chem Ind Ltd | 接着性樹脂用表面保護フィルム及びその製法 |
JP5624184B1 (ja) | 2013-06-28 | 2014-11-12 | 太陽インキ製造株式会社 | ドライフィルムおよびプリント配線板 |
JP5882510B2 (ja) * | 2014-06-30 | 2016-03-09 | 太陽インキ製造株式会社 | 感光性ドライフィルムおよびそれを用いたプリント配線板の製造方法 |
CN108476589B (zh) * | 2016-01-13 | 2021-10-26 | 太阳油墨制造株式会社 | 干膜和印刷电路板 |
JP2018125378A (ja) | 2017-01-31 | 2018-08-09 | 太陽インキ製造株式会社 | ドライフィルム、硬化物、プリント配線板、および、硬化物の製造方法 |
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2019
- 2019-01-30 JP JP2019014697A patent/JP7221064B2/ja active Active
- 2019-09-04 TW TW108131815A patent/TWI747040B/zh active
- 2019-10-22 CN CN201911004611.2A patent/CN111505905B/zh active Active
- 2019-10-23 KR KR1020190132015A patent/KR102313172B1/ko active IP Right Grant
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- 2023-01-31 JP JP2023013010A patent/JP2023057084A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003140333A (ja) * | 2001-11-01 | 2003-05-14 | Kanegafuchi Chem Ind Co Ltd | 剥離作業性に優れた感光性カバーレイフィルム |
CN102549499A (zh) * | 2009-09-30 | 2012-07-04 | 可隆工业株式会社 | 干膜光致抗蚀剂 |
JP2016188924A (ja) * | 2015-03-30 | 2016-11-04 | 日立化成株式会社 | ドライフィルム、硬化物、半導体装置及びレジストパターンの形成方法 |
JP2017052952A (ja) * | 2016-09-20 | 2017-03-16 | 味の素株式会社 | 保護フィルム付き接着シート、積層体の製造方法、及びプリント配線板の製造方法 |
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TWI747040B (zh) | 2021-11-21 |
JP7221064B2 (ja) | 2023-02-13 |
KR102313172B1 (ko) | 2021-10-15 |
JP2020121481A (ja) | 2020-08-13 |
CN111505905A (zh) | 2020-08-07 |
TW202030238A (zh) | 2020-08-16 |
JP2023057084A (ja) | 2023-04-20 |
KR20200094616A (ko) | 2020-08-07 |
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