CN111253855A - 树脂组合物 - Google Patents
树脂组合物 Download PDFInfo
- Publication number
- CN111253855A CN111253855A CN201911181016.6A CN201911181016A CN111253855A CN 111253855 A CN111253855 A CN 111253855A CN 201911181016 A CN201911181016 A CN 201911181016A CN 111253855 A CN111253855 A CN 111253855A
- Authority
- CN
- China
- Prior art keywords
- resin composition
- resin
- mass
- epoxy resin
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-226770 | 2018-12-03 | ||
JP2018226770A JP2020090570A (ja) | 2018-12-03 | 2018-12-03 | 樹脂組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111253855A true CN111253855A (zh) | 2020-06-09 |
Family
ID=70945002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911181016.6A Pending CN111253855A (zh) | 2018-12-03 | 2019-11-27 | 树脂组合物 |
Country Status (2)
Country | Link |
---|---|
JP (2) | JP2020090570A (ja) |
CN (1) | CN111253855A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114058236A (zh) * | 2020-07-29 | 2022-02-18 | 味之素株式会社 | 树脂组合物 |
CN114262499A (zh) * | 2021-11-24 | 2022-04-01 | 久耀电子科技(江苏)有限公司 | 一种树脂组合物、半固化片及其应用 |
CN114369401A (zh) * | 2020-10-15 | 2022-04-19 | 味之素株式会社 | 树脂组合物、固化物、片状叠层材料、树脂片材、印刷布线板及半导体装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011010672A1 (ja) * | 2009-07-24 | 2011-01-27 | 住友ベークライト株式会社 | 樹脂組成物、樹脂シート、プリプレグ、金属張積層板、プリント配線板及び半導体装置 |
CN105936745A (zh) * | 2015-12-09 | 2016-09-14 | 中山台光电子材料有限公司 | 一种树脂组合物 |
CN107674378A (zh) * | 2016-08-02 | 2018-02-09 | 味之素株式会社 | 树脂组合物 |
CN108570213A (zh) * | 2017-03-10 | 2018-09-25 | 味之素株式会社 | 树脂组合物层 |
CN108727942A (zh) * | 2017-04-24 | 2018-11-02 | 味之素株式会社 | 树脂组合物 |
CN108779330A (zh) * | 2017-02-07 | 2018-11-09 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、覆金属箔层叠板、树脂片和印刷电路板 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0339311A (ja) * | 1989-06-29 | 1991-02-20 | Shell Internatl Res Maatschappij Bv | マレイミド組成物 |
JP2962784B2 (ja) * | 1990-08-01 | 1999-10-12 | 東邦レーヨン株式会社 | ポリイミド硬化樹脂複合体及びその製法 |
JPH05339344A (ja) * | 1992-06-15 | 1993-12-21 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物、接着剤シート、接着剤付きポリイミドフィルム及び金属はく張りポリイミドフィルム |
JP3486934B2 (ja) * | 1993-01-06 | 2004-01-13 | 日立化成工業株式会社 | 熱硬化性樹脂組成物 |
JPH06345964A (ja) * | 1993-06-11 | 1994-12-20 | Hitachi Chem Co Ltd | 耐熱性熱硬化性樹脂組成物、接着剤シート、接着剤付きポリイミドフィルム及び金属はく張りポリイミドフィルム |
US20120059119A1 (en) * | 2009-05-08 | 2012-03-08 | Mitsubishi Gas Chemical Company, Inc. | Thermosetting polyimide resin composition, cured product, and adhesive |
TWI519602B (zh) * | 2014-06-06 | 2016-02-01 | Elite Material Co Ltd | Low dielectric resin composition and the application of its resin film, semi-cured film and circuit board |
JP6635403B2 (ja) * | 2014-12-26 | 2020-01-22 | 荒川化学工業株式会社 | 樹脂付銅箔、銅張積層板、プリント配線板及び多層配線板 |
US11286346B2 (en) * | 2015-01-13 | 2022-03-29 | Showa Denko Materials Co., Ltd. | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar |
JP2016196557A (ja) * | 2015-04-03 | 2016-11-24 | 住友ベークライト株式会社 | プリント配線基板用樹脂組成物、プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置 |
JP7114214B2 (ja) * | 2016-05-24 | 2022-08-08 | 味の素株式会社 | 接着フィルム |
JP7102093B2 (ja) * | 2016-09-28 | 2022-07-19 | 味の素株式会社 | 樹脂組成物、樹脂シート、回路基板及び半導体チップパッケージ |
WO2018062405A1 (ja) * | 2016-09-29 | 2018-04-05 | 積水化学工業株式会社 | 硬化体及び多層基板 |
JP7212626B2 (ja) * | 2017-10-10 | 2023-01-25 | 三井金属鉱業株式会社 | プリント配線板用樹脂組成物、樹脂付銅箔、銅張積層板、及びプリント配線板 |
WO2019188087A1 (ja) * | 2018-03-30 | 2019-10-03 | 三井金属鉱業株式会社 | 銅張積層板 |
CN112601778A (zh) * | 2018-08-27 | 2021-04-02 | 积水化学工业株式会社 | 树脂材料、叠层结构体及多层印刷布线板 |
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2018
- 2018-12-03 JP JP2018226770A patent/JP2020090570A/ja active Pending
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2019
- 2019-11-27 CN CN201911181016.6A patent/CN111253855A/zh active Pending
-
2022
- 2022-10-28 JP JP2022173670A patent/JP2023010737A/ja active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011010672A1 (ja) * | 2009-07-24 | 2011-01-27 | 住友ベークライト株式会社 | 樹脂組成物、樹脂シート、プリプレグ、金属張積層板、プリント配線板及び半導体装置 |
CN105936745A (zh) * | 2015-12-09 | 2016-09-14 | 中山台光电子材料有限公司 | 一种树脂组合物 |
CN107674378A (zh) * | 2016-08-02 | 2018-02-09 | 味之素株式会社 | 树脂组合物 |
CN108779330A (zh) * | 2017-02-07 | 2018-11-09 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、覆金属箔层叠板、树脂片和印刷电路板 |
CN108570213A (zh) * | 2017-03-10 | 2018-09-25 | 味之素株式会社 | 树脂组合物层 |
CN108727942A (zh) * | 2017-04-24 | 2018-11-02 | 味之素株式会社 | 树脂组合物 |
Non-Patent Citations (1)
Title |
---|
杨成德主编: "《涂料开发与试验》", 28 February 2015, 科学技术文献出版社 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114058236A (zh) * | 2020-07-29 | 2022-02-18 | 味之素株式会社 | 树脂组合物 |
CN114369401A (zh) * | 2020-10-15 | 2022-04-19 | 味之素株式会社 | 树脂组合物、固化物、片状叠层材料、树脂片材、印刷布线板及半导体装置 |
CN114262499A (zh) * | 2021-11-24 | 2022-04-01 | 久耀电子科技(江苏)有限公司 | 一种树脂组合物、半固化片及其应用 |
CN114262499B (zh) * | 2021-11-24 | 2023-12-01 | 久耀电子科技(江苏)有限公司 | 一种树脂组合物、半固化片及其应用 |
Also Published As
Publication number | Publication date |
---|---|
JP2023010737A (ja) | 2023-01-20 |
JP2020090570A (ja) | 2020-06-11 |
TW202033655A (zh) | 2020-09-16 |
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