CN111096085A - 一种用于控制线路板钻孔深度的钻孔盖板、加工方法及钻孔装置 - Google Patents

一种用于控制线路板钻孔深度的钻孔盖板、加工方法及钻孔装置 Download PDF

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Publication number
CN111096085A
CN111096085A CN201880041327.XA CN201880041327A CN111096085A CN 111096085 A CN111096085 A CN 111096085A CN 201880041327 A CN201880041327 A CN 201880041327A CN 111096085 A CN111096085 A CN 111096085A
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China
Prior art keywords
drilling
insulating layer
layer
conductive layer
circuit board
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Pending
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CN201880041327.XA
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English (en)
Inventor
彭立军
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Suzhou Sinuolin Electronics Co ltd
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Suzhou Sinuolin Electronics Co ltd
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Publication of CN111096085A publication Critical patent/CN111096085A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Drilling And Boring (AREA)

Abstract

本发明涉及一种用于控制线路板钻孔深度的钻孔盖板、加工方法及钻孔装置，钻孔盖板包括加工面绝缘层和导电层；加工面绝缘层和导电层通过电镀、真空蒸发沉积(真空镀)或者涂层的方式结合；导电层为0.001‑10.000微米的导电层。本发明的钻孔盖板在进行钻孔深度控制时，金属钻头接触导电层瞬间，精确判断下钻起始点，减少了钻孔深度的深度公差和提高钻孔深度的精度；且仅当钻头钻穿绝缘层并接触到导电层时，才传递电信号；由于采用本发明的工艺形成导电层，可将导电层厚度减小至5微米以下，减小了导电层厚度公差带给钻孔控制的误差，提高了线路板钻孔深度控制的精确度，减少了线路板在控制深度钻孔工艺中的报废，提高了线路板的质量。

Description

PCT国内申请，说明书已公开。

Claims (13)

  1. PCT国内申请，权利要求书已公开。
CN201880041327.XA 2017-06-30 2018-06-13 一种用于控制线路板钻孔深度的钻孔盖板、加工方法及钻孔装置 Pending CN111096085A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201720787182.0U CN208623982U (zh) 2017-06-30 2017-06-30 一种用于线路板钻孔深度控制的高精度钻孔盖板
CN2017207871820 2017-06-30
PCT/CN2018/090967 WO2019001273A1 (zh) 2017-06-30 2018-06-13 一种用于控制线路板钻孔深度的钻孔盖板、加工方法及钻孔装置

Publications (1)

Publication Number Publication Date
CN111096085A true CN111096085A (zh) 2020-05-01

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CN201880041327.XA Pending CN111096085A (zh) 2017-06-30 2018-06-13 一种用于控制线路板钻孔深度的钻孔盖板、加工方法及钻孔装置

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CN (2) CN208623982U (zh)
TW (1) TWM569541U (zh)
WO (1) WO2019001273A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN208623982U (zh) * 2017-06-30 2019-03-19 苏州思诺林电子有限公司 一种用于线路板钻孔深度控制的高精度钻孔盖板
CN110202902A (zh) * 2019-05-24 2019-09-06 烟台柳鑫新材料科技有限公司 一种pcb背钻盖板及其制备方法
CN112272447A (zh) * 2020-10-09 2021-01-26 苏州思诺林电子有限公司 一种用于控制线路板钻孔深度的背钻复合盖板及加工方法
CN115474338A (zh) * 2021-06-11 2022-12-13 深南电路股份有限公司 一种电路板及背钻加工方法

Citations (8)

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CN1552174A (zh) * 2001-09-05 2004-12-01 �ձ�������ʽ���� 多层电路基板、树脂基材及其制造方法
CN1726259A (zh) * 2002-12-13 2006-01-25 株式会社钟化 热塑性聚酰亚胺树脂薄膜、叠层体及由其构成的印刷电路布线板的制法
CN102415222A (zh) * 2009-04-24 2012-04-11 住友电气工业株式会社 用于印刷布线板的基板、印刷布线板及其制造方法
CN103079781A (zh) * 2010-06-18 2013-05-01 三菱瓦斯化学株式会社 钻孔用盖板
CN104768320A (zh) * 2014-01-02 2015-07-08 三星电机株式会社 印刷电路基板及其制造方法
CN205764024U (zh) * 2016-07-18 2016-12-07 苏州工业园区杰智汇电子材料有限公司 一种用于深度钻孔控制的线路板钻孔盖板
WO2017038867A1 (ja) * 2015-09-02 2017-03-09 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート、及びそれを用いたドリル孔あけ加工方法
CN208623982U (zh) * 2017-06-30 2019-03-19 苏州思诺林电子有限公司 一种用于线路板钻孔深度控制的高精度钻孔盖板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3157310A1 (en) * 2015-10-12 2017-04-19 Agfa Graphics Nv An entry sheet for perforating electric boards such as printed circuit boards

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1552174A (zh) * 2001-09-05 2004-12-01 �ձ�������ʽ���� 多层电路基板、树脂基材及其制造方法
CN1726259A (zh) * 2002-12-13 2006-01-25 株式会社钟化 热塑性聚酰亚胺树脂薄膜、叠层体及由其构成的印刷电路布线板的制法
CN102415222A (zh) * 2009-04-24 2012-04-11 住友电气工业株式会社 用于印刷布线板的基板、印刷布线板及其制造方法
CN103079781A (zh) * 2010-06-18 2013-05-01 三菱瓦斯化学株式会社 钻孔用盖板
CN104768320A (zh) * 2014-01-02 2015-07-08 三星电机株式会社 印刷电路基板及其制造方法
WO2017038867A1 (ja) * 2015-09-02 2017-03-09 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート、及びそれを用いたドリル孔あけ加工方法
CN205764024U (zh) * 2016-07-18 2016-12-07 苏州工业园区杰智汇电子材料有限公司 一种用于深度钻孔控制的线路板钻孔盖板
CN208623982U (zh) * 2017-06-30 2019-03-19 苏州思诺林电子有限公司 一种用于线路板钻孔深度控制的高精度钻孔盖板

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CN208623982U (zh) 2019-03-19
TWM569541U (zh) 2018-11-01
WO2019001273A1 (zh) 2019-01-03

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