CN110573300A - 使用具备吸附层的研磨垫的研磨方法 - Google Patents

使用具备吸附层的研磨垫的研磨方法 Download PDF

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CN110573300A
CN110573300A CN201880028532.2A CN201880028532A CN110573300A CN 110573300 A CN110573300 A CN 110573300A CN 201880028532 A CN201880028532 A CN 201880028532A CN 110573300 A CN110573300 A CN 110573300A
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polishing
polishing pad
adsorption layer
fixed
surface roughness
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矢岛利康
二宫大辅
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Maruishi Sangyo Co Ltd
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Maruishi Sangyo Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
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    • B24B37/00—Lapping machines or devices; Accessories
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
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Abstract

本发明是关于一种研磨方法，该研磨方法适用于具备既定的吸附层的研磨垫。该研磨垫是具备包含聚硅氧等的吸附层，该聚硅氧是包含仅在两末端具有乙烯基的直链状聚有机硅氧烷。在本发明中，将研磨垫固定于固定盘后，在对所述研磨垫一边加压被研磨物一边使其滑动而进行研磨时，将固定盘的表面粗糙度(Ra)设为0.01至0.7μm，其后，将研磨垫的吸附层吸附固定于固定盘而进行研磨作业。通过如此的方式调整固定盘的表面粗糙度，可抑制在被研磨物表面产生难以预测的伤痕或粗糙。此外，固定盘表面粗糙度的调整方法较优选是将所述表面粗糙度的膜接合于固定盘的表面。

Description

使用具备吸附层的研磨垫的研磨方法
技术领域
本发明是关于用以将半导体构件、电子构件等所使用的半导体晶片等被研磨构件使用既定构成的研磨垫进行研磨的研磨方法。详细来说，是关于在多数的对被研磨构件进行研磨的步骤中，提升作业效率，并且以高水平维持研磨质量的研磨方法。
背景技术
在如半导体装置、半导体晶片、显示器用玻璃基板、硬盘用基板的半导体元件、半导体构件、电子构件的制造工艺中，包含用以将其表面平坦化、镜面化用的研磨步骤。在研磨步骤中，一般是将被研磨构件保持在研磨装置的一侧的固定盘，将研磨垫固定在另一侧的固定盘后，一边供给研磨浆液，一边以被研磨构件与研磨垫经加压的状态下进行相对地滑动据此来进行。
在以此研磨垫进行的研磨方法中，将研磨垫固定于固定盘的方法一般是通过粘着胶带等粘着剂的粘着固定。此固定方法虽然可将研磨垫牢固地固定，但另一方面，在必须更换研磨垫时的作业耗费时间和精力。半导体晶片等的研磨步骤中，由于要研磨许多的被研磨材料，故无法避免研磨垫的消耗与更换。因此，以粘着进行固定是在研磨步骤的作业效率方面为较差的方法。
本申请申请人是针对研磨垫的固定方式，从所述粘着所得，开发出使用有既定的吸附层的研磨垫(专利文献1)。此研磨垫如图3所示，是在研磨层的背面(固定盘侧的面)设置有既定构成的吸附层。在此的吸附层如字面上的意思，是通过其吸附作用使研磨垫固定于固定盘。此固定方法是与先前所使用的粘着剂那样地利用粘性的方法不同，从固定盘剥离时不会有残留物残留。另外，由于剥离后的再贴附也容易，故可顺利地进行研磨垫的剥离/固定，可有效率地进行更换作业。
[现有技术文献]
[专利文献]
[专利文献1]日本特许第5765858号说明书。
发明内容
[发明欲解决的课题]
所述具备有吸附层的研磨垫有助于研磨作业的效率化，并且可成为研磨面的高精度化的助力。因此，也成为可应对对近年来以半导体构件的高密度化、高纤细化、大面积化为背景的研磨制品的高平坦度的要求。
然而，根据本发明者等，确认到即使在适用所述具备吸附层的研磨垫的研磨方法中，也对被研磨物表面产生难以预料的伤痕或粗糙。也有不能认为是研磨垫及使用中的研磨剂成为主要因素造成此研磨精度的降低的情形，因而要求其对策。因此，本发明提供一种适用所述具备吸附层的研磨垫的研磨方法，并可持续地进行稳定的研磨作业。
[用以解决课题的手段]
本发明人等为了所述目的，精心地研究的结果，着眼于改善研磨垫与固定盘的固定状态。具体而言，是针对固定盘的表面状态，特别是表面粗糙度进行严密的规定，据此改善研磨垫的固定状态，而可解决所述课题，进而完成本发明。
也就是，本发明是一种研磨方法，其是将研磨垫固定于固定盘后，对所述研磨垫一边加压被研磨物一边使其滑动而进行研磨，其中，
所述研磨垫是包含用以吸附并固定于所述固定盘的吸附层、及用以研磨所述被研磨物的研磨层；所述吸附层包含使选自下列的至少1种聚硅氧交联而成的组合物：包含仅在两末端具有乙烯基的直链状聚有机硅氧烷的聚硅氧(silicone)、包含在两末端及侧链具有乙烯基的直链状聚有机硅氧烷的聚硅氧、包含仅在末端具有乙烯基的分支状聚有机硅氧烷的聚硅氧、及包含在末端及侧链具有乙烯基的分支状聚有机硅氧烷的聚硅氧；将所述固定盘的表面粗糙度(Ra)设为0.01至0.7μm后，将所述研磨垫的吸附层吸附固定于所述固定盘。
以下，针对本发明详细地进行说明。如上所述，本发明在研磨作业时，改良固定盘的表面状态，在其上吸附固定研磨垫，据此可获得较优选的研磨质量。如此地，在本发明所着眼的固定盘的表面状态的表面粗糙度，是与本发明适用的研磨垫的吸附层的特性相关联。
也就是，此研磨垫的吸附层是对固定盘以物理性吸附而固定。此固定状态的特色是有剪切力(相对于固定盘表面为水平方向的固定强度)较高，另一方面，剥离力(相对于固定盘表面为垂直方向的固定强度)较低的特点。
在此，在上述的本申请申请人所制作的研磨垫中，考量吸附层与固定盘的固定强度的关系，吸附层表面的表面粗糙度设定于特定范围(参照专利文献1的权利要求1)。虽然对此研磨垫的吸附层表面的优化是有效的，但依据本发明者等来看，通过适当调整固定盘的表面粗糙度可更有效地发挥该研磨垫的改良效果。
也就是，固定盘的表面粗糙度为较粗时，即使将研磨垫侧(吸附层)的表面粗糙度处理成适当，仍有研磨力无法均匀地传递的情形。此时，在研磨垫固定状态产生不优选情况，产生研磨垫微妙的偏移，视情况，产生研磨垫从固定盘的剥离。另外，如此会对研磨精度造成影响的固定盘的表面状态，并非只限于产生自研磨作业的初期阶段。也就是，可能有从制造当初固定盘的表面粗糙度较粗的情形，也有起初为平滑且表面粗糙度较小的固定盘在使用过程发生变化的情形。在后者的情形中，推测为例如由于在研磨垫的更换作业等的接触造成表面粗糙度增大。本发明是考量此等的情况，并且不论其原由经历而以将固定盘的表面状态调整至较优选为特征。
针对本发明的研磨方法更详细地说明。在以下的说明中，针对本发明所适用的研磨垫的构成、固定盘的表面粗糙度及其调整方法进行说明。
A.研磨垫
本发明所使用的研磨垫是以固定盘侧的吸附层与被研磨物侧的研磨层作为必须构成。
有关吸附层的材质，基本上是与上述本发明人等的先前研磨垫所适用的材质相同。也就是，是使选自下列至少1种聚硅氧交联而成的组合物层叠而形成：包含仅在两末端具有乙烯基的直链状聚有机硅氧烷的聚硅氧、包含在两末端及侧链具有乙烯基的直链状聚有机硅氧烷的聚硅氧、包含仅在末端具有乙烯基的分支状聚有机硅氧烷的聚硅氧、及包含在末端及侧链具有乙烯基的分支状聚有机硅氧烷的聚硅氧。
所述聚硅氧的具体例可举出化学式1的化合物作为直链状聚有机硅氧烷的示例。另外，可举化学式2的化合物作为分枝状聚有机硅氧烷的示例。
【化学式1】
(式中R表示下述有机基团，n表示整数)
【化学式2】
(式中R表示下述有机基团，m、n表示整数)
在化学式1、化学式2中取代基(R)的具体例可列举甲基、乙基、丙基等烷基、苯基、甲苯基等芳基、或键合于此等基的碳原子的氢原子的一部分或全部经卤素原子、氰基等取代的同种或不同种的未取代或取代的脂肪族不饱和基除外的1价烃基。较优选是其至少50摩尔％为甲基。取代基可为不同种也可为同种。另外，该聚硅氧烷可单独也可为2种以上的混合物。
另外，数平均分子量为30000至100000的构成吸附层的聚硅氧具有适当的吸附作用。但是，调整表面粗糙度时，适用的聚硅氧的数平均分子量与制造阶段的烧制温度会造成影响。为了容易发挥适当的表面粗糙度，聚硅氧的数平均分子量以30000至60000为优选。
在本发明所使用的研磨垫除了吸附层以外，研磨层也成为必要的构成要素。此研磨层是适用一般研磨垫所适用的研磨布。可适用例如以尼龙、聚胺基甲酸酯、聚对苯二甲酸乙二酯等所形成的不织布、发泡成形体等。另外，其表面(研磨面)的形状不限于平坦，也可适当地形成用以保持研磨剂的沟等。
另外，该研磨垫较优选是在吸附层与研磨层之间具有用以支撑两者的基材。吸附层是由薄的有机物所构成且富有可挠性，与研磨层直接接合时操作性差。因此，通过将具有适度刚性的基材设定于两者之间，可确保研磨垫的操作性。另外，通过对研磨垫适度地赋予刚性，也可抑制研磨作业中的变形。
基材可适用片状的树脂材料。具体而言，为聚酯、聚乙烯、聚苯乙烯、聚丙烯、尼龙、胺基甲酸酯、聚偏氯乙烯、聚氯乙烯等的树脂。较优选为聚酯是树脂材料，聚对苯二甲酸乙二酯(PET)、萘二甲酸乙二酯(PEN)，特优选为PET。基材可为单层，但也可以多的树脂形成多层结构。
在所述的以吸附层及研磨层所构成的研磨垫中，吸附层的厚度较优选为20至30μm。另外，成为研磨层的研磨布的厚度可使用0.5至3mm。再者，因应所需被设定的基材厚度以50至200μm为优选。
再者，使用于本发明的研磨垫较优选是吸附层的固定盘侧表面的表面粗糙度(Sa)为0.06μm以下。超过0.06μm时，可能对研磨力的面内均匀性产生影响。有关该下限值，本来不应受到限制，但吸附层的可制造最小值为0.02μm。此外，在此的表面粗糙度为算术平均粗糙度(Ra)。
此外，所谓吸附层的表面粗糙度为吸附层面内的平均意义，为针对吸附层的中心部、端部(外周部)等多部分的表面粗糙度的测定值的平均。较优选是采用对吸附层的中心部与两端部的3点的表面粗糙度的平均值。而且，为了发挥更适当的研磨性能，较优选是在吸附层的表面粗糙度具有均匀性。具体而言，关于吸附层的中心部的表面粗糙度(Sc)及吸附层的端部的表面粗糙度(So)，较优选是Sc与Sa的差、及So与Sa的差皆为0.02μm以下。此外，关于吸附层的端部的表面粗糙度较优选是在研磨垫直径的两者的两端具备上述关系。
B.固定盘的表面状态
在本发明，将上述说明的研磨垫吸附固定于固定盘，研磨被研磨物。再者，在固定研磨垫的前，将固定盘的表面粗糙度调整至0.01至0.7μm。
固定盘的表面粗糙度超过0.7μm时，研磨垫的固定状态以微小的方式产生不稳定性，造成降低研磨精度的情形。另外，固定盘的表面太粗时，也有研磨垫剥离的疑虑。此表面粗糙度较优选是尽可能地降低，但从现实的观点而言，将0.01μm设为下限值。如此地，本发明中，就谋求从研磨垫及研磨剂等的研磨作业的中心构件以外的方向提升被研磨物的研磨精度的方法而言，规定固定盘的表面状态。此外，此表面粗糙度也为算术平均粗糙度(Ra)。另外，该固定盘的表面粗糙度也较优选为采用面内的平均值，较优选为将其中心部、端部(外周部)等的多部分的表面粗糙度的测定值的平均设为固定盘的表面粗糙度。
另外，有关此固定盘的表面粗糙度较优选是控制在0.01至0.25μm。各种材料的研磨作业中，如图1所示，较多是将固定盘及研磨垫配置于下方，其上配置被研磨物而进行研磨其单面，但也有如图2所示，研磨被研磨物的两面，从其上下面同时押压研磨垫进行研磨作业。在此等中，图1的单面研磨及图2的两面研磨的中，在下侧的研磨面(下部固定盘)，通过将固定盘的表面粗糙度控制于0.7μm以下可获得有效的效果。另一方面，图2的上侧的研磨面(上部固定盘)，由于重力的关系致使固定盘与研磨垫的吸附力降低，故较优选为考量此而更降低固定盘的表面粗糙度。因而，考量如图2般自上下面进行研磨作业时，固定盘的表面粗糙度控制较优选为在0.01至0.25μm。此外，再如图1的单面研磨中，使固定盘的表面粗糙度设为0.25μm以下也有效果。
在此，调整固定盘的表面粗糙度的具体方法，可举出在设置研磨垫前，研磨固定盘表面而成为上述范围。但是，对于大面积的固定盘，难以均匀地调整表面粗糙度。因此，作为较优选的固定盘的表面粗糙度的调整法是使表面粗糙度为0.01至0.7μm的膜材接合于固定盘的表面。通过以膜材包覆固定盘表面，可迅速地形成期望的表面粗糙度。另外，即使对于大面积的固定盘，也可赋予均匀的表面粗糙度。此外，该膜材的更优选表面粗糙度为0.01至0.25μm。
膜材较优选是材质由PET树脂、丙烯酸树脂、氯乙烯树脂、ABS树脂等有机材料或塑胶材料所构成。膜材是为了确保操作性及对研磨剂等液体的耐腐蚀性。其厚度是无特别限制，但以50μm至3.0mm为优选。另外，膜材只要为至少与研磨垫相同的形状/面积即可，不一定需要包覆固定盘整个面。不过，若在研磨作业中膜材与固定盘之间有研磨剂侵入时，有可能引起膜剥离，故以膜材包覆固定盘表面为较优选。
膜材与固定盘的接合以接合胶带或接合剂接合为优选。由于必须稳定地固定研磨垫，因而通过膜材与固定盘牢固地接合。关于此点，由于研磨垫是在研磨步骤中需更换的前提下，必须成为以吸附层产生适度的接合力，但是由于膜材原则上不需更换，故即使牢固地接合于固定盘也无问题。接合剂可使用例如橡胶系接合剂、丙烯酸系接合剂、热熔胶接合剂等。
此外，在本发明特征是控制固定盘的表面状态，关于固定盘的材质是无限定。研磨装置用的固定盘有氧化铝等的陶瓷制、不锈钢制、SiC制、钢制等的固定盘，但是本发明可用于任一者。
C.研磨垫的固定、本发明的研磨方法
以如上述的方式调整固定盘的表面粗糙度后，将研磨垫(吸附层)吸附固定于固定盘。此研磨垫的固定是只要将固定盘对位于研磨垫并载置，轻轻按押即可。
将研磨垫固定于固定盘后，一边供给研磨剂一边将被研磨物按压于研磨垫而进行研磨作业。此研磨作业的条件可与通常的研磨方法相同。只要针对被研磨物的材质、研磨剂的种类/粒度、被研磨物考量所要求的表面状态而设定即可。
另外，经过研磨许多的被研磨物，而产生研磨垫的消耗、劣化，故成为必须更换研磨垫。此时，在本发明使用的研磨垫是通过相对于固定盘表面而朝垂直方向拉伸，可比较容易地剥离。另外，新颖的研磨垫的固定作业也简易。而且，只要将既定粗糙度的膜材接合于固定盘时，则在更换研磨垫后也可稳定地持续研磨作业。
[发明的效果]
如上所述，本发明的研磨方法中，将所使用的研磨垫优化、并且将固定盘的表面状态较优选地调整而进行研磨作业。据此，可如期实现作业性的提升以及研磨面的高精度化。
附图说明
图1是用以说明一般研磨作业(单面研磨)的概略图。
图2是说明用于两面研磨的装置构成(上下固定盘)的图。
图3是说明具备吸附层的研磨垫构成的图。
具体实施方式
以下，说明本发明的适当的实施方式。在本实施方式中，使用与图2同样构成的研磨垫。该研磨垫是在PET制的圆形基材(厚度50μm、尺寸φ810mm)的一面，结合有吸附层(厚度25μm)，该吸附层是包含仅在两末端具有乙烯基的直链状聚有机硅氧烷的聚硅氧(分子量30000)。再者，在基材的另一面，接合有牛皮(suede)调的研磨布(型号7355-000F：一节长度450μm、厚度1.37mm)。此外，关于此研磨垫依据JIS B0601-1994，以表面粗糙度测定器测定吸附层表面的表面粗糙度(Ra)的结果，平均值为0.04μm。
使用此研磨垫，以图1所示的样式进行硅晶片(φ8英寸)的研磨试验。此研磨装置的固定盘是材质为陶瓷，表面粗糙度Ra为1.0μm。本实施方式的研磨试验是在研磨装置的固定盘接合平均表面粗糙度不同的多个PET制膜(厚度200μm)进行研磨试验。PET制膜的固定是在固定盘贴合橡胶系接合胶带再按压膜进行接合。其后，将研磨垫贴附于固定盘的膜面。硅晶片的研磨作业是将研磨剂浆液(将Glanzox(Fujimiinc股份有限公司制)以纯水稀释成30倍)滴落至研磨层(流量150ml/min)。其它的研磨条件如下述。
·研磨压力：0.163kgf/cm2
·研磨垫的旋转速度：45rpm
·被研磨构件的旋转速度：47rpm
·研磨头的摇动速度：250mm/min
·研磨时间：3min
·研磨片数：1片、10片
在本实施方式的研磨试验，比较例是于固定盘不接合膜并且固定研磨垫时进行研磨来进行评估。此外，关于接合有表面粗糙度0.8μm膜的研磨试验是称为参考例。
再者，研磨试验后，以纯水洗净晶片的被研磨面，以无尘状态使其干燥后，观察研磨面，计算伤痕的大小及数目，利用从100点满分的扣分法进行评估。此时，大伤痕是加大扣分。关于评估结果，95分以上100分以下设为「◎」，90分以上且未达95分设为「○」，85分以上且未达90分设为「△」，再者，未达85分设为「×」。该评估结果示于表1。
【表1】
从表1可知，在实施例1至4及比较例与参考例中，在研磨初期阶段(研磨片数：1片)中，在研磨精度方面任一者皆没有特别的问题。但是，通过增大研磨片数(10片)，可看到参考例与比较例的研磨精度降低。推测此是随着片数增加而研磨垫的消耗增加，研磨层与被研磨材料表面的摩擦条件变动、以及因此所致的研磨垫与固定盘的固定状态变化产生相互地作用，而对被研磨材料表面造成影响。从该结果可确认出，改善固定盘的表面粗糙度的必要性、及作为其基准的0.7μm以下的表面粗糙度的必要性。
此外，在通常的硅晶片的研磨步骤中，不限于以1片的研磨垫处理10片的晶片，适当地进行更换为通例，故本实施方式有加速试验的意义。不过，研磨垫的消耗并非可容易地预测。因而，本实施方式的评估结果显示即使垫产生预期外的消耗，通过调整固定盘的表面状态，也可维持研磨质量。在本实施方式使用的膜材的接合为比较简易的作业。由于通过如此的对应显示出可维持研磨质量，故本实施方式可谓有用的研究。
[产业上的利用可能性]
如所述说明，本发明的研磨方法具备通过使用具有吸附层的研磨垫所产生的便利性，并且可持续地形成高质量的研磨面。依据本发明，即使对于朝大径化、大面积化进展的晶片或显示器面板也可提供高精度的研磨面。

Claims (5)

1.一种研磨方法，是将研磨垫固定于固定盘后，对所述研磨垫一边加压被研磨物一边使其滑动而进行研磨，其中，
所述研磨垫包含用以吸附并固定于所述固定盘的吸附层、及用以研磨所述被研磨物的研磨层；
所述吸附层包含使选自下列至少1种的聚硅氧交联而成的组合物:包含仅在两末端具有乙烯基的直链状聚有机硅氧烷的聚硅氧、包含在两末端及侧链具有乙烯基的直链状聚有机硅氧烷的聚硅氧、包含仅在末端具有乙烯基的分支状聚有机硅氧烷的聚硅氧、及包含在末端及侧链具有乙烯基的分支状聚有机硅氧烷的聚硅氧；
将所述固定盘的表面粗糙度(Ra)设为0.01至0.7μm之后，将所述研磨垫的吸附层吸附固定于所述固定盘。
2.根据权利要求1所述的研磨方法，是将表面粗糙度(Ra)为0.01至0.7μm的膜接合于固定盘的表面，并且将研磨垫的吸附层吸附固定。
3.根据权利要求1或2所述的研磨方法，其中，研磨垫的吸附层其表面粗糙度的平均值(Sa)为0.02至0.06μm。
4.根据权利要求1至3中任一项所述的研磨垫，其中，吸附层的厚度为20至30μm。
5.根据权利要求1至4中任一项所述的研磨方法，其中，研磨垫在吸附层与研磨层之间具备基材，所述基材包含破断强度210至290MPa、破断伸度80至130％的树脂。
CN201880028532.2A 2017-06-06 2018-06-01 使用具备吸附层的研磨垫的研磨方法 Pending CN110573300A (zh)

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