CN110546708A - 快闪存储器的编程电路、编程方法及快闪存储器 - Google Patents
快闪存储器的编程电路、编程方法及快闪存储器 Download PDFInfo
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- CN110546708A CN110546708A CN201780032233.1A CN201780032233A CN110546708A CN 110546708 A CN110546708 A CN 110546708A CN 201780032233 A CN201780032233 A CN 201780032233A CN 110546708 A CN110546708 A CN 110546708A
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- 238000003860 storage Methods 0.000 claims description 12
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- 238000004904 shortening Methods 0.000 abstract description 5
- 239000002784 hot electron Substances 0.000 description 11
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 230000005684 electric field Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
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- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- DSHPMFUQGYAMRR-UHFFFAOYSA-N [Si].[Si].O=[Si] Chemical compound [Si].[Si].O=[Si] DSHPMFUQGYAMRR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- 238000001259 photo etching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0433—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and one or more separate select transistors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/08—Address circuits; Decoders; Word-line control circuits
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/40—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2216/00—Indexing scheme relating to G11C16/00 and subgroups, for features not directly covered by these groups
- G11C2216/12—Reading and writing aspects of erasable programmable read-only memories
- G11C2216/16—Flash programming of all the cells in an array, sector or block simultaneously
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7881—Programmable transistors with only two possible levels of programmation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Read Only Memory (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Abstract
本发明涉及一种快闪存储器的编程电路及编程方法,该编程电路包括串联的编程晶体管和存储单元,所述编程晶体管的栅极接字线,存储单元的栅极连接控制栅,所述编程晶体管的一端与位线相连,另一端与所述存储单元的一端相连,存储单元的另一端与源线相连。通过本发明编程电路和方法对快闪存储器进行编程,可以在不增加沟道电流的情况下,提高后段编程的效率,从而提高整个编程过程的效率,缩短总的编程时间,提高闪存性能。
Description
PCT国内申请,说明书已公开。
Claims (13)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/CN2017/116346 WO2019113921A1 (zh) | 2017-12-15 | 2017-12-15 | 快闪存储器的编程电路、编程方法及快闪存储器 |
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CN110546708A true CN110546708A (zh) | 2019-12-06 |
CN110546708B CN110546708B (zh) | 2023-04-21 |
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CN201780032233.1A Active CN110546708B (zh) | 2017-12-15 | 2017-12-15 | 快闪存储器的编程电路、编程方法及快闪存储器 |
Country Status (5)
Country | Link |
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US (1) | US10964391B2 (zh) |
KR (1) | KR102252531B1 (zh) |
CN (1) | CN110546708B (zh) |
TW (1) | TWI697777B (zh) |
WO (1) | WO2019113921A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112201295A (zh) * | 2020-09-11 | 2021-01-08 | 中天弘宇集成电路有限责任公司 | Nand闪存编程方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US10403361B2 (en) | 2007-11-29 | 2019-09-03 | Zeno Semiconductor, Inc. | Memory cells, memory cell arrays, methods of using and methods of making |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5780341A (en) * | 1996-12-06 | 1998-07-14 | Halo Lsi Design & Device Technology, Inc. | Low voltage EEPROM/NVRAM transistors and making method |
CN1218294A (zh) * | 1997-10-09 | 1999-06-02 | 美商常忆科技股份有限公司 | 非易失p沟道金属氧化物半导体二晶体管存储单元和阵列 |
US6757196B1 (en) * | 2001-03-22 | 2004-06-29 | Aplus Flash Technology, Inc. | Two transistor flash memory cell for use in EEPROM arrays with a programmable logic device |
CN1848439A (zh) * | 2006-04-10 | 2006-10-18 | 清华大学 | 一种陷阱电荷俘获型的快闪存储器阵列结构及其操作方法 |
CN1849670A (zh) * | 2003-09-16 | 2006-10-18 | 微米技术股份有限公司 | 用于闪存的升压衬底/槽编程 |
US20110235427A1 (en) * | 2010-03-24 | 2011-09-29 | Ying-Je Chen | Channel Hot Electron Injection Programming Method and Related Device |
CN102623049A (zh) * | 2011-01-27 | 2012-08-01 | 北京兆易创新科技有限公司 | 一种非易失性存储单元及其数据编程、读取、擦除方法 |
CN104733045A (zh) * | 2015-03-23 | 2015-06-24 | 上海华力微电子有限公司 | 一种双位闪存存储器及其编程、擦除和读取方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1083689A (ja) * | 1996-09-10 | 1998-03-31 | Mitsubishi Electric Corp | 不揮発性半導体記憶装置 |
JPH1186579A (ja) * | 1997-09-09 | 1999-03-30 | Rohm Co Ltd | Eeprom装置 |
JP3378879B2 (ja) * | 1997-12-10 | 2003-02-17 | 松下電器産業株式会社 | 不揮発性半導体記憶装置及びその駆動方法 |
US7064978B2 (en) * | 2002-07-05 | 2006-06-20 | Aplus Flash Technology, Inc. | Monolithic, combo nonvolatile memory allowing byte, page and block write with no disturb and divided-well in the cell array using a unified cell structure and technology with a new scheme of decoder and layout |
US6850438B2 (en) * | 2002-07-05 | 2005-02-01 | Aplus Flash Technology, Inc. | Combination nonvolatile memory using unified technology with byte, page and block write and simultaneous read and write operations |
EP1671367A1 (en) * | 2003-09-30 | 2006-06-21 | Koninklijke Philips Electronics N.V. | 2-transistor memory cell and method for manufacturing |
US8320191B2 (en) * | 2007-08-30 | 2012-11-27 | Infineon Technologies Ag | Memory cell arrangement, method for controlling a memory cell, memory array and electronic device |
US8339862B2 (en) * | 2007-12-25 | 2012-12-25 | Genusion, Inc. | Nonvolatile semiconductor memory device |
KR20110135753A (ko) * | 2010-06-11 | 2011-12-19 | 삼성전자주식회사 | 비휘발성 메모리 장치 |
CN101986389B (zh) * | 2010-10-12 | 2015-06-24 | 上海华虹宏力半导体制造有限公司 | 闪存单元、闪存装置及其编程方法 |
KR101849176B1 (ko) * | 2012-01-06 | 2018-04-17 | 삼성전자주식회사 | 2-트랜지스터 플래시 메모리 및 2-트랜지스터 플래시 메모리의 프로그램 방법 |
JP5853853B2 (ja) | 2012-05-09 | 2016-02-09 | 富士通セミコンダクター株式会社 | 半導体記憶装置及びその駆動方法 |
US8947938B2 (en) * | 2012-09-21 | 2015-02-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Two-transistor non-volatile memory cell and related program and read methods |
US8958248B2 (en) * | 2013-03-14 | 2015-02-17 | Nxp B.V. | 2T and flash memory array |
CN107316657B (zh) * | 2016-04-26 | 2020-08-28 | 中芯国际集成电路制造(上海)有限公司 | 存储单元 |
-
2017
- 2017-12-15 WO PCT/CN2017/116346 patent/WO2019113921A1/zh active Application Filing
- 2017-12-15 CN CN201780032233.1A patent/CN110546708B/zh active Active
- 2017-12-15 KR KR1020187032243A patent/KR102252531B1/ko active IP Right Grant
-
2018
- 2018-10-22 TW TW107137265A patent/TWI697777B/zh active
-
2019
- 2019-01-21 US US16/252,991 patent/US10964391B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5780341A (en) * | 1996-12-06 | 1998-07-14 | Halo Lsi Design & Device Technology, Inc. | Low voltage EEPROM/NVRAM transistors and making method |
CN1218294A (zh) * | 1997-10-09 | 1999-06-02 | 美商常忆科技股份有限公司 | 非易失p沟道金属氧化物半导体二晶体管存储单元和阵列 |
US6757196B1 (en) * | 2001-03-22 | 2004-06-29 | Aplus Flash Technology, Inc. | Two transistor flash memory cell for use in EEPROM arrays with a programmable logic device |
CN1849670A (zh) * | 2003-09-16 | 2006-10-18 | 微米技术股份有限公司 | 用于闪存的升压衬底/槽编程 |
CN1848439A (zh) * | 2006-04-10 | 2006-10-18 | 清华大学 | 一种陷阱电荷俘获型的快闪存储器阵列结构及其操作方法 |
US20110235427A1 (en) * | 2010-03-24 | 2011-09-29 | Ying-Je Chen | Channel Hot Electron Injection Programming Method and Related Device |
CN102623049A (zh) * | 2011-01-27 | 2012-08-01 | 北京兆易创新科技有限公司 | 一种非易失性存储单元及其数据编程、读取、擦除方法 |
CN104733045A (zh) * | 2015-03-23 | 2015-06-24 | 上海华力微电子有限公司 | 一种双位闪存存储器及其编程、擦除和读取方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112201295A (zh) * | 2020-09-11 | 2021-01-08 | 中天弘宇集成电路有限责任公司 | Nand闪存编程方法 |
Also Published As
Publication number | Publication date |
---|---|
US20190189219A1 (en) | 2019-06-20 |
KR20190073310A (ko) | 2019-06-26 |
KR102252531B1 (ko) | 2021-05-14 |
WO2019113921A1 (zh) | 2019-06-20 |
TWI697777B (zh) | 2020-07-01 |
US10964391B2 (en) | 2021-03-30 |
CN110546708B (zh) | 2023-04-21 |
TW201933109A (zh) | 2019-08-16 |
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