CN110501086B - Flexible temperature sensor and preparation method thereof - Google Patents
Flexible temperature sensor and preparation method thereof Download PDFInfo
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- CN110501086B CN110501086B CN201910706709.6A CN201910706709A CN110501086B CN 110501086 B CN110501086 B CN 110501086B CN 201910706709 A CN201910706709 A CN 201910706709A CN 110501086 B CN110501086 B CN 110501086B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
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- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
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Abstract
The invention provides a flexible temperature sensor and a preparation method thereof, belonging to the field of temperature sensing electronic devices. The sensor comprises a first flexible substrate, a first packaging layer, a second flexible substrate and a second packaging layer, wherein the first flexible substrate is comb-shaped, n cavities containing liquid metal and uniformly distributed are arranged on the second flexible substrate, and the temperature measuring points can be not influenced mutually structurally through the combination of the flexible cavities and the liquid metal, so that the temperature measuring sensitivity is high, and the effect of ensuring that the temperature measuring points are not changed in position under different conditions of stretching and shrinking, particularly under different conditions of large deformation of a measured object and the like is achieved.
Description
Technical Field
The invention belongs to the field of temperature sensing electronic devices, and particularly relates to a flexible temperature sensor capable of ensuring that a temperature measuring point does not deviate and a preparation method thereof.
Background
The flexible temperature sensor is a sensing device manufactured by combining the temperature sensor with different flexible substrate materials according to different use environments (such as different fields of medical health monitoring, sports, communication, aerospace, fire fighting and the like). However, the current flexible temperature sensor still has some problems to be solved in application: (1) because most of the sensitive units of the flexible temperature sensor are based on rigid inorganic materials, and the modulus of the sensitive units is far greater than that of the flexible substrate material, good strain coupling between the flexible substrate and the rigid sensitive units is difficult to realize in the use process. Even if the flexible substrate material is adopted, the tensile property can be enhanced within a certain range, if the measurement condition of the measured object is under the condition of large deformation, the limited tensile is still not enough, and the temperature measurement point can be caused to drift, so that the temperature measurement position is inaccurate; (2) the thermal diffusion coefficient of the flexible polymer substrate material widely adopted at present is low, so that the thermal diffusion time from an object to be detected to a sensitive unit above the substrate is too long, and the temperature sensitive unit cannot sense the temperature change of the object to be detected in time.
Aiming at the existing flexible temperature sensor, the flexible temperature sensor combining the flexible material cavity and the liquid metal is realized, the structure can not only solve the problems of temperature measuring point drift and overlong thermal diffusion time under large deformation, but also realize multi-point temperature measurement, and the temperature difference of different temperature measuring points can be reflected without mutual influence among the temperature measuring points.
Disclosure of Invention
The invention aims to provide a flexible temperature sensor and a preparation method thereof, aiming at solving the problems in the prior art, the sensor can realize the purposes that a plurality of temperature measuring points are not influenced mutually, the temperature measuring sensitivity is high and the temperature measuring points are not changed under different conditions of stretching and shrinking, particularly large deformation of a measured object and the like through the combination of a flexible cavity and liquid metal in the structure.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a flexible temperature sensor comprising: the comb-shaped flexible substrate comprises a first flexible substrate, a first packaging layer, a second flexible substrate and a second packaging layer, wherein the first flexible substrate is comb-shaped, an external electrode, a lead and a temperature measuring electrode are arranged on the first flexible substrate, the external electrode is arranged on a comb handle of the first flexible substrate and used for being connected with external equipment, and the temperature measuring electrode is arranged at the tail end of comb teeth and connected with the external electrode through the lead; the liquid metal temperature measurement device is characterized in that n cavities containing liquid metal and uniformly distributed are arranged on the second flexible substrate, the temperature measurement electrode is located in the center of each cavity, the first packaging layer is used for protecting the wires and the temperature measurement electrode and avoiding contact with the liquid metal, and the second packaging layer covers the surface of the second flexible substrate to enable the liquid metal not to leak and is fixedly connected with the first flexible substrate and the second flexible substrate.
Furthermore, the number n of the cavities is more than or equal to 2, and the thickness between adjacent cavities is more than 3 mm.
Further, the first flexible substrate material and the first packaging layer material are both Polyimide (PI), and the thickness of the first flexible substrate material and the thickness of the first packaging layer material are both 15-25 micrometers; the second packaging layer is made of Polydimethylsiloxane (PDMS) and the thickness of the second packaging layer is 0.8-1.2 mm; the external electrode and the lead are made of gold (Au), the thickness of the external electrode and the lead is 120nm, and the temperature measuring electrode is made of platinum (Pt); the liquid metal is gallium-indium alloy with the melting point lower than room temperature, and preferably gallium-indium alloy with the melting point of 16 ℃.
Further, the second flexible substrate material is Polydimethylsiloxane (PDMS), polybutylene adipate/terephthalate (PBAT), hydrogenated styrene-butadiene block copolymer (SEBS), or the like.
Further, the temperature measuring electrode is of a serpentine structure and has a thickness of 125 nm.
A preparation method of a flexible temperature sensor comprises the following steps:
step 1, ultrasonically cleaning a polyimide film by sequentially adopting acetone, absolute ethyl alcohol and deionized water;
step 2, preparing an external electrode, a lead and a temperature measuring electrode on the cleaned polyimide film by combining photoetching and magnetron sputtering;
step 3, shielding the external electrode part by using a polyimide adhesive tape, then spin-coating a layer of liquid polyimide on the surface of the sample, baking to imidize the liquid polyimide and form a solid film, and using the solid film as a first packaging layer for protecting the connecting wire and the temperature measuring electrode;
step 4, removing the shielded polyimide adhesive tape, and cutting the polyimide film of the electrode and the lead prepared in the step 3 to form a comb-shaped structure;
step 5, preparing a second flexible substrate provided with a cavity, pouring liquid metal into the cavity, and freezing and solidifying;
step 6, overlapping the comb teeth of the first flexible substrate and the second flexible substrate to enable the temperature measuring electrode to be positioned in the center of the cavity;
and 7, encapsulating the second flexible substrate by adopting the same flexible material, and then curing to form a second encapsulation layer, thus obtaining the flexible temperature sensor.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. according to the invention, the cavity is arranged on the flexible substrate, the liquid metal is filled in the cavity, and the device structure of the temperature measuring electrode is placed on the cavity, so that the device can work under large deformation, and the temperature measuring electrode is suspended above the liquid metal, so that the temperature measuring position cannot generate relative displacement under large deformation to generate drift of a temperature measuring point; meanwhile, due to the introduction of the liquid metal, the temperature response speed of the flexible temperature sensor is improved due to the high thermal diffusion coefficient of the liquid metal.
2. A plurality of cavities are arranged on the flexible substrate, so that the sensor can realize simultaneous temperature measurement of a plurality of temperature measurement points in the area, and the temperature measurement points are not affected by each other.
Drawings
Fig. 1 is a schematic structural diagram of an external electrode and a gold wire of a flexible temperature sensor according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a platinum temperature measuring electrode of the flexible temperature sensor according to the embodiment of the invention.
FIG. 3 is a schematic diagram of a position where an adhesive tape is required to shield in the step of manufacturing the flexible temperature sensor according to the embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a flexible material cavity of the flexible temperature sensor according to the embodiment of the invention.
FIG. 5 is a schematic diagram of the overall structure of a flexible temperature sensor according to an embodiment of the present invention;
the temperature measuring device comprises a polyimide substrate 1, a gold wire 2, a platinum temperature measuring electrode 3, a flexible material cavity 4 and liquid metal 5.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the following embodiments and accompanying drawings.
A flexible temperature sensor comprising: the comb-shaped liquid metal temperature measurement device comprises a first flexible substrate, a first packaging layer, a second flexible substrate and a second packaging layer, wherein the first flexible substrate is of a comb-shaped structure, an external electrode, a lead and a temperature measurement electrode are arranged on the first flexible substrate, the external electrode is arranged on a comb handle of the first flexible substrate and used for being connected with external equipment, the temperature measurement electrode is arranged at the tail end of comb teeth and is connected with the external electrode through the lead, n cavities containing liquid metal and evenly distributed are arranged on the second flexible substrate, the temperature measurement electrode is suspended in the center of the cavities, the first packaging layer is used for protecting the lead and the temperature measurement electrode, and the second packaging layer covers the surface of the second flexible substrate to enable the liquid metal not to leak outwards and is fixedly connected with the first flexible substrate and the second flexible substrate.
A preparation method of a flexible temperature sensor comprises the following steps:
step 1, using a polyimide film with the thickness of 25 mu m as a first flexible substrate, and carrying out ultrasonic cleaning on acetone, absolute ethyl alcohol and deionized water in sequence;
step 2, adhering the polyimide film to the glass substrate by using a flat double-sided adhesive tape to ensure that the polyimide film is always flat, and then heating the polyimide film on a constant-temperature heating table at 100 ℃ for 10 minutes to remove moisture on the surface;
step 3, photoresist is spin-coated on the polyimide film processed in the step 2, patterns of a metal wire and an external electrode part of the sensor are obtained by utilizing a photoetching technology, and then a gold wire and an external electrode with the thickness of 120nm are prepared by sputtering by adopting a magnetron sputtering method and taking gold as a target material;
step 4, repeating the step 3, and sputtering to prepare a platinum temperature measuring electrode with the thickness of 125nm by using platinum as a sputtering target material;
step 5, carrying out attached shielding treatment on the external electrode part of the gold wire by using a polyimide adhesive tape, spin-coating a layer of liquid polyimide with the thickness of 15 microns on the surface of the sample in a spin-coating mode, and then placing the sample in a drying oven at 180 ℃ for 3 hours to solidify the liquid polyimide to serve as a first packaging layer for protecting the gold wire and the platinum electrode;
step 6, placing the sample treated in the step 5 in an acetone solution, heating in water bath at 40 ℃ for 5 hours to enable the polyimide film to fall off from the double-sided adhesive tape on the glass substrate, and enabling the polyimide adhesive tape in the step 5 to fall off, wherein the external electrode part is exposed intact;
step 7, cutting the sample processed in the step 6 to form a comb-shaped structure, wherein the external electrode is positioned on a comb handle of the first flexible substrate, and the temperature measuring electrode is positioned at the tail end of the comb teeth;
and 8, adopting the mass ratio of the polydimethylsiloxane to the curing agent of 10: 1, preparing, pouring the PDMS into a prepared mould at the uncured stage of the PDMS, and curing to obtain a second flexible substrate with a PDMS cavity as shown in the fourth figure;
step 9, pouring gallium-indium alloy with the melting point of 16 ℃ into the groove of the PDMS cavity obtained in the step 8, filling the PDMS groove with liquid metal, and then putting the PDMS groove into a refrigerator for 30 minutes to solidify the liquid metal;
step 10, overlapping the short shaft of the first flexible substrate and the second flexible substrate to enable the temperature measuring electrode to be positioned in the center of the cavity;
and 7, encapsulating the second flexible substrate by adopting uncured PDMS, curing to form a second encapsulation layer, and fixedly connecting the first flexible substrate and the second flexible substrate by using liquid metal without leakage to obtain the flexible temperature sensor.
While the invention has been described with reference to specific embodiments, any feature disclosed in this specification may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise; all of the disclosed features, or all of the method or process steps, may be combined in any combination, except mutually exclusive features and/or steps.
Claims (8)
1. The utility model provides a flexible temperature sensor, its characterized in that includes first flexible basement, first encapsulation layer, the flexible basement of second and second encapsulation layer, first flexible basement is the pectination, is provided with the temperature measurement electrode on it, the temperature measurement electrode sets up in the broach end, set up n evenly distributed's cavity that contains liquid metal on the flexible basement of second, the temperature measurement electrode is located the cavity center, first encapsulation layer covers the temperature measurement electrode for protect the temperature measurement electrode, the second encapsulation layer covers and makes liquid metal not leak and fixed connection first flexible basement and the flexible basement of second in the flexible basement surface of second.
2. The flexible temperature sensor according to claim 1, wherein the number n of cavities is greater than or equal to 2, and the thickness between adjacent cavities is greater than 3 mm.
3. The flexible temperature sensor according to claim 1, wherein the first flexible substrate is further provided with an external electrode and a lead, the external electrode is arranged on the comb handle of the first flexible substrate and used for connecting with external equipment, the lead is used for connecting the temperature measuring electrode with the external electrode, and the first packaging layer also covers the lead connected with the temperature measuring electrode and used for protecting the lead.
4. The flexible temperature sensor of claim 3, wherein the first flexible base material and the first encapsulation layer material are both polyimide and have a thickness of 15-25 μm; the second packaging layer is made of polydimethylsiloxane, and the thickness of the second packaging layer is 0.8-1.2 mm; the external electrodes and the lead are made of gold and have the thickness of 120 nm; the temperature measuring electrode material is platinum, and the liquid metal is gallium-indium alloy with the melting point lower than room temperature.
5. A flexible temperature sensor according to claim 4, wherein the gallium-indium alloy having a melting point below room temperature is in particular a gallium-indium alloy having a melting point of 16 ℃.
6. The flexible temperature sensor of claim 1, wherein the second flexible substrate material is polydimethylsiloxane, polybutylene adipate/terephthalate, or a hydrogenated styrene-butadiene block copolymer.
7. The flexible temperature sensor of claim 1, wherein the temperature sensing electrode is a serpentine structure having a thickness of 125 nm.
8. A method for preparing a flexible temperature sensor according to any one of claims 1 to 7, comprising the steps of:
step 1, ultrasonically cleaning a polyimide film by sequentially adopting acetone, absolute ethyl alcohol and deionized water;
step 2, preparing an external electrode, a lead and a temperature measuring electrode on the cleaned polyimide film by combining photoetching and magnetron sputtering;
step 3, shielding the external electrode part by using a polyimide adhesive tape, then spin-coating a layer of liquid polyimide on the surface of the sample, baking to imidize the liquid polyimide and form a solid film, and using the solid film as a first packaging layer for protecting the connecting wire and the temperature measuring electrode;
step 4, removing the shielded polyimide adhesive tape, and cutting the polyimide film of the electrode and the lead prepared in the step 3 to form a comb-shaped structure;
step 5, preparing a second flexible substrate provided with a cavity, pouring liquid metal into the cavity, and freezing and solidifying;
step 6, overlapping the comb teeth of the first flexible substrate and the second flexible substrate to enable the temperature measuring electrode to be positioned in the center of the cavity;
and 7, encapsulating the second flexible substrate by adopting the same flexible material, and then curing to form a second encapsulation layer, thus obtaining the flexible temperature sensor.
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| CN111110233B (en) * | 2019-12-24 | 2022-10-11 | 浙江清华柔性电子技术研究院 | Multi-interface flexible electrode |
| CN114018425A (en) * | 2021-11-04 | 2022-02-08 | 辽宁佳宇电子产品有限公司 | Flexible thin film platinum resistance sensor and preparation method thereof |
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