CN114018425A - Flexible thin film platinum resistance sensor and preparation method thereof - Google Patents
Flexible thin film platinum resistance sensor and preparation method thereof Download PDFInfo
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- CN114018425A CN114018425A CN202111300475.9A CN202111300475A CN114018425A CN 114018425 A CN114018425 A CN 114018425A CN 202111300475 A CN202111300475 A CN 202111300475A CN 114018425 A CN114018425 A CN 114018425A
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims abstract description 165
- 229910052697 platinum Inorganic materials 0.000 title claims abstract description 82
- 239000010409 thin film Substances 0.000 title claims description 15
- 238000002360 preparation method Methods 0.000 title description 8
- 229920001721 polyimide Polymers 0.000 claims abstract description 79
- 239000004642 Polyimide Substances 0.000 claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000000565 sealant Substances 0.000 claims abstract description 12
- 239000003292 glue Substances 0.000 claims abstract description 5
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 14
- 239000010408 film Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 10
- WRMNZCZEMHIOCP-UHFFFAOYSA-N 2-phenylethanol Chemical compound OCCC1=CC=CC=C1 WRMNZCZEMHIOCP-UHFFFAOYSA-N 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical group CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 6
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 4
- GWHLJVMSZRKEAQ-UHFFFAOYSA-N 3-(2,3-dicarboxyphenyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(C=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O GWHLJVMSZRKEAQ-UHFFFAOYSA-N 0.000 claims description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 4
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 4
- 229940049964 oleate Drugs 0.000 claims description 4
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 4
- -1 polydimethylsiloxane Polymers 0.000 claims description 4
- SFAZBJLFDAGITE-UHFFFAOYSA-N C1(C=2C(C(=O)O1)=CC=CC2)=O.C2(=CC=CC=C2)C#C Chemical compound C1(C=2C(C(=O)O1)=CC=CC2)=O.C2(=CC=CC=C2)C#C SFAZBJLFDAGITE-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 2
- ZHDTXTDHBRADLM-UHFFFAOYSA-N hydron;2,3,4,5-tetrahydropyridin-6-amine;chloride Chemical compound Cl.NC1=NCCCC1 ZHDTXTDHBRADLM-UHFFFAOYSA-N 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 238000003892 spreading Methods 0.000 claims description 2
- 230000007480 spreading Effects 0.000 claims description 2
- UEXCJVNBTNXOEH-UHFFFAOYSA-N Ethynylbenzene Chemical group C#CC1=CC=CC=C1 UEXCJVNBTNXOEH-UHFFFAOYSA-N 0.000 claims 2
- 229920001730 Moisture cure polyurethane Polymers 0.000 claims 2
- 238000004377 microelectronic Methods 0.000 abstract description 2
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- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
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- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- VACCAVUAMIDAGB-UHFFFAOYSA-N sulfamethizole Chemical compound S1C(C)=NN=C1NS(=O)(=O)C1=CC=C(N)C=C1 VACCAVUAMIDAGB-UHFFFAOYSA-N 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to the technical field of micro-electronic machinery, and particularly discloses a flexible film platinum resistance sensor, which comprises a flexible platinum resistance sensor substrate, wherein the flexible platinum resistance sensor substrate comprises a polyimide substrate layer, a platinum resistance wire intermediate layer and a polyimide covering layer, the platinum resistance wire intermediate layer comprises a platinum resistance wire and sealant, two ends of the platinum resistance wire are connected with leads, and the connection part of the platinum resistance wire and the leads is positioned in the platinum resistance wire intermediate layer; the polyimide substrate layer and the polyimide covering layer are made of polyimide films with the thickness of 0.03-0.05 mm; the thickness of the middle layer of the platinum resistance wire is 0.05-0.08 mm, and the sealant is polyimide glue. In the flexible film platinum resistance sensor, the substrate of the platinum resistance sensor is soft and light, can be tightly attached to the surface of a measured object, avoids measurement errors caused by the fact that the sensor cannot be in tight contact with a complex surface, and is high in test accuracy and good in stability.
Description
Technical Field
The invention belongs to the technical field of micro-electronic machinery, and particularly relates to a flexible film platinum resistance sensor and a preparation method thereof.
Background
In order to monitor the state of each system of the rail vehicle, various sensors are widely applied to each area of the vehicle, wherein the temperature sensor is the most common sensor, and the platinum resistance temperature sensor is the most common temperature sensor used by the temperature sensor. The platinum resistor is used as a temperature measuring sensor and has the advantages of large measuring range, good stability, high indicating value reproducibility, oxidation resistance and the like. At present, nearly one third of film platinum resistance sensors at home and abroad are made by sputtering and depositing metal platinum on a ceramic substrate in a vacuum state and then modulating resistance by laser. At present, the platinum resistance temperature measuring sensor is commonly used, because the ceramic substrate is hard in texture and large in heat capacity, the ceramic substrate is not suitable for measuring the temperature of a curved surface and long in thermal response time, a temperature test result has large errors, and system components in a vehicle are basically curved surfaces or irregular surfaces. In addition, the structural tightness of the film resistance sensor is not enough, so that the interior of the sensor is affected with damp and breaks down in the actual operation of a vehicle, and false alarm or flash alarm of high and low temperatures is caused. Therefore, the development of the flexible film platinum resistance sensor with good sealing performance, moisture resistance and water resistance plays an important role in accurately and rapidly monitoring the temperature of the vehicle system.
Disclosure of Invention
The flexible film platinum resistance sensor has good flexibility, is moisture-proof and waterproof, is convenient for monitoring the temperature of a complex surface, and has short response time and accurate temperature measurement.
In order to achieve the purpose, the invention provides a flexible film platinum resistance sensor which comprises a flexible platinum resistance sensor substrate, wherein the flexible platinum resistance sensor substrate comprises a polyimide substrate layer, a platinum resistance wire intermediate layer and a polyimide covering layer, the platinum resistance wire intermediate layer comprises a platinum resistance wire and sealant, two ends of the platinum resistance wire are connected with leads, and the connection part of the platinum resistance wire and the leads is positioned in the platinum resistance wire intermediate layer; the polyimide substrate layer and the polyimide covering layer are made of polyimide films with the thickness of 0.03-0.05 mm; the thickness of the middle layer of the platinum resistance wire is 0.05-0.08 mm, and the sealant is polyimide.
A preparation method of the flexible thin film platinum resistance sensor comprises the following steps:
(1) dissolving 50-65 parts by weight of polyimide prepolymer in 40-50 parts by weight of organic solvent, adding 1-3 parts by weight of polydimethylsiloxane and 0.5-1.2 parts by weight of phenethyl alcohol oleate, and stirring and uniformly mixing to obtain a polyimide adhesive;
(2) coating a polyimide adhesive on a polyimide film of a base material layer, arranging a platinum resistance wire on the polyimide film of the base material layer, and then drying;
(3) coating a polyimide adhesive on one side of the covering layer polyimide film, and drying;
(4) and (3) laying the cover layer polyimide film obtained in the step (3) above the base material layer polyimide film obtained in the step (2), wherein the glue spreading surface of the cover layer polyimide film faces downwards, and then performing vacuum bag pressing and curing to obtain the flexible platinum resistance sensor substrate.
Preferably, in the above method for manufacturing a flexible thin film platinum resistance sensor, the polyimide prepolymer is a phenylacetylene-terminated polyimide prepolymer synthesized from pyromellitic dianhydride, 4, 4-diaminodiphenyl ether and phenylacetylene phthalic anhydride, and the pyromellitic dianhydride is 3,3 ', 4,4' -biphenyltetracarboxylic dianhydride and 2,2 ', 3, 3' -biphenyltetracarboxylic dianhydride. Due to the non-coplanar non-linear structure of the biphenyl tetracid dianhydride, the symmetry and the regularity of the polymer are destroyed, and meanwhile, the ether bond is introduced, so that the rigidity of the polyimide molecular chain can be effectively reduced, the flexibility of the molecular chain is increased, the polyimide aggregation structure is changed into a random structure, the polyimide prepolymer has lower melt viscosity, the adhesive is easy to infiltrate the adhered substance, and the adhesive property is improved; water or alcohol micromolecules are not generated in the curing process of the polyimide prepolymer, and the cured sealant does not generate pores and has good sealing effect.
Preferably, in the method for manufacturing the flexible thin film platinum resistance sensor, the molecular weight of the polyimide prepolymer is 2000-3000. The smaller the molecular weight of the polyimide prepolymer, the lower the melt viscosity, the more favorable the impregnation of the surface of the adhered object to improve the adhesion performance, but when the molecular weight is too low, the crosslinking density is obviously increased after the curing, so that the flexibility of the cured sealant is sharply reduced and the sealant is brittle, and therefore, the proper molecular weight of the polyimide prepolymer needs to be selected.
Preferably, in the above method for manufacturing a flexible thin film platinum resistance sensor, the organic solvent is N, N-dimethylformamide, N-methylpyrrolidone, chloroform, or N, N-dimethylacetamide.
Preferably, in the above method for manufacturing a flexible thin film platinum resistance sensor, in the steps (2) and (3), the drying parameters are as follows: drying by air blast for 1-2 h at 100-120 ℃.
Preferably, in the above method for manufacturing a flexible thin film platinum resistance sensor, in the step (4), the curing process is: firstly, heating to 230-250 ℃ at the speed of 2-3 ℃/min and keeping for 2-3 h; then, the temperature is increased to 370-380 ℃ at a rate of 2-3 ℃/min and kept for 1-2 h.
Compared with the prior art, the invention has the following beneficial effects:
1. in the flexible film platinum resistance sensor, the platinum resistance wire is flatly covered on the polyimide film substrate, and then a layer of polyimide film is covered on the platinum resistance wire. The polyimide film has the characteristics of high-strength insulation and radiation resistance, small thermal expansion coefficient and long-term use at the temperature of 200 ℃ below zero to 200 ℃, and can be widely applied to system temperature monitoring of vehicles and the like.
2. In the flexible film platinum resistance sensor, the polyimide film has small heat capacity, so that the sensor has short thermal response time, large platinum wire flat distribution surface, strong impact resistance, reliable quality and high resistance value precision.
3. In the flexible film platinum resistance sensor, the platinum resistance wire is protected by polyimide sealant, so that the platinum resistance wire is prevented from being affected with damp and being corroded by water or other chemical substances, the resistance value precision is kept unchanged, the temperature measurement accuracy is improved, the reliability of the film platinum resistance sensor is greatly improved, the long-term stability is better, and the service life is prolonged.
4. In the preparation method of the flexible film platinum resistance sensor, the polyimide prepolymer is used as the adhesive, so that the adhesive has low solution viscosity, is easy to infiltrate the adhered objects and has good adhesive property; water or alcohol micromolecules are not generated in the curing process of the polyimide prepolymer, and pores are not generated in the curing process, so that the cured sealant has a good sealing effect. The whole preparation process is relatively simple and is convenient for large-scale application.
Drawings
FIG. 1 is a schematic cross-sectional view of a flexible platinum resistance sensor substrate in an embodiment of the invention.
Fig. 2 is a top view of a flexible platinum resistive sensor substrate in an embodiment of the invention.
Detailed Description
The following detailed description of specific embodiments of the invention is provided, but it should be understood that the scope of the invention is not limited to the specific embodiments.
Examples
As shown in fig. 1 and fig. 2, the present embodiment provides a flexible thin film platinum resistance sensor, which includes a flexible platinum resistance sensor substrate, where the flexible platinum resistance sensor substrate includes a polyimide cover layer 1 located on a surface layer, a platinum resistance wire middle layer 2, and a bottom polyimide base material layer 3, and the polyimide cover layer 1 and the polyimide base material layer 3 are made of a polyimide thin film with a thickness of 0.05 mm. The platinum resistance wire middle layer 2 comprises a platinum resistance wire 4 and sealant 5, two ends of the platinum resistance wire 4 are connected with leads 6, and the connection part of the platinum resistance wire and the leads is positioned in the platinum resistance wire middle layer 2 to protect the connection part; the thickness of platinum resistance wire intermediate layer is 0.06mm, and sealed 5 is polyimide, and sealed 5 encapsulates platinum resistance wire 4, prevents that steam and impurity from getting into, improves flexible film platinum resistance sensor's reliability and long-term stability.
The embodiment also provides a preparation method of the flexible thin film platinum resistance sensor, which comprises the following steps:
(1) dissolving 55 parts by weight of polyimide prepolymer (with the molecular weight of 3000) in 50 parts by weight of organic solvent, adding 2 parts by weight of polydimethylsiloxane and 0.8 part by weight of phenethyl alcohol oleate, and uniformly stirring to obtain a polyimide adhesive; polydimethylsiloxane and phenethyl alcohol oleate in the polyimide adhesive have defoaming and soaking effects, so that the polyimide adhesive is favorably attached to a polyimide film, and the film is prevented from warping during drying;
(2) tiling and fixing a polyimide film of a base material layer on a flat plate, coating a polyimide adhesive on the polyimide film of the base material layer, arranging a platinum resistance wire on the polyimide film of the base material layer, and performing forced air drying at 100 ℃ for 2 hours;
(3) coating a polyimide adhesive on one surface of a covering layer polyimide film, and drying by blowing at 100 ℃ for 2 hours;
(4) then, the covering layer polyimide film obtained in the step (3) is laid above the base material layer polyimide film in the step (2), the glue coating surface of the covering layer polyimide film faces downwards, vacuum bag pressing and curing are carried out, the temperature is increased to 240 ℃ at the speed of 3 ℃/min and is kept for 2 hours; and then continuously heating to 370 ℃ at the speed of 3 ℃/min and keeping for 1h to obtain the flexible platinum resistance sensor substrate.
The preparation method of the polyimide prepolymer comprises the following steps: adding 4,4 '-diamino diphenyl ether into N, N' -dimethyl ethyl phthalamine, stirring for dissolving, then adding 2,2 ', 3, 3' -biphenyl tetracarboxylic dianhydride, stirring for 4 hours, then adding 3,3 ', 4,4' -biphenyl tetracarboxylic dianhydride, stirring for 4 hours, wherein the molar ratio of the 2,2 ', 3, 3' -biphenyl tetracarboxylic dianhydride to the 3,3 ', 4,4' -biphenyl tetracarboxylic dianhydride is 1:1, finally adding phenylacetylene phthalic anhydride for end capping, stirring for 3 hours to obtain polyamide acid prepolymer solution, treating for 1 hour at 80 ℃, 100 ℃ and 150 ℃ respectively, and treating for 1 hour at 200 ℃ and 250 ℃ respectively under a vacuum environment to obtain the polyimide prepolymer.
The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain certain principles of the invention and its practical application to enable one skilled in the art to make and use various exemplary embodiments of the invention and various alternatives and modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.
Claims (7)
1. A flexible film platinum resistance sensor comprises a flexible platinum resistance sensor substrate and is characterized in that the flexible platinum resistance sensor substrate comprises a polyimide substrate layer, a platinum resistance wire middle layer and a polyimide covering layer, the platinum resistance wire middle layer comprises a platinum resistance wire and sealant, two ends of the platinum resistance wire are connected with leads, and the connection part of the platinum resistance wire and the leads is positioned in the platinum resistance wire middle layer; the polyimide substrate layer and the polyimide covering layer are made of polyimide films with the thickness of 0.03-0.05 mm; the thickness of the middle layer of the platinum resistance wire is 0.05-0.08 mm, and the sealant is polyimide glue.
2. A method of making a flexible thin film platinum resistance sensor as claimed in claim 1 comprising the steps of:
(1) dissolving 50-65 parts by weight of polyimide prepolymer in 40-50 parts by weight of organic solvent, adding 1-3 parts by weight of polydimethylsiloxane and 0.5-1.2 parts by weight of phenethyl alcohol oleate, and stirring and uniformly mixing to obtain a polyimide adhesive;
(2) coating a polyimide adhesive on a polyimide film of a base material layer, arranging a platinum resistance wire on the polyimide film of the base material layer, and then drying;
(3) coating a polyimide adhesive on one side of the covering layer polyimide film, and drying;
(4) and (3) laying the cover layer polyimide film obtained in the step (3) above the base material layer polyimide film obtained in the step (2), wherein the glue spreading surface of the cover layer polyimide film faces downwards, and then performing vacuum bag pressing and curing to obtain the flexible platinum resistance sensor substrate.
3. The method of making a flexible thin film platinum resistance sensor as claimed in claim 2 wherein the polyimide pre-polymer is a phenylacetylene terminated polyimide pre-polymer synthesized from pyromellitic dianhydride, 4, 4-diaminodiphenyl ether and phenylacetylene phthalic anhydride, the pyromellitic dianhydride being 3,3 ', 4,4' -biphenyltetracarboxylic dianhydride and 2,2 ', 3, 3' -biphenyltetracarboxylic dianhydride.
4. The method of claim 3, wherein the polyimide prepolymer has a molecular weight of 2000 to 3000.
5. The method of claim 2, wherein the organic solvent is N, N-dimethylformamide, N-methylpyrrolidone, chloroform, or N, N-dimethylacetamide.
6. The method for preparing a flexible thin film platinum resistance sensor according to claim 2, wherein in the steps (2) and (3), the drying parameters are as follows: drying by air blast for 1-2 h at 100-120 ℃.
7. The method for preparing the flexible thin film platinum resistance sensor according to claim 2, wherein in the step (4), the curing process comprises the following steps: firstly, heating to 230-250 ℃ at the speed of 2-3 ℃/min and keeping for 2-3 h; then, the temperature is increased to 370-380 ℃ at a rate of 2-3 ℃/min and kept for 1-2 h.
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| CN202111300475.9A CN114018425A (en) | 2021-11-04 | 2021-11-04 | Flexible thin film platinum resistance sensor and preparation method thereof |
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| CN108641665A (en) * | 2018-05-14 | 2018-10-12 | 中国科学院化学研究所 | A kind of polyimides adhesive and preparation method thereof |
| CN109798995A (en) * | 2019-01-17 | 2019-05-24 | 上海交通大学 | A kind of flexibility high sensitivity thin-film thermocouple type heat flow transducer and preparation method |
| CN110501086A (en) * | 2019-08-01 | 2019-11-26 | 电子科技大学 | A kind of flexibility temperature sensor and preparation method thereof |
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