CN110476198B - 显示装置 - Google Patents
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- CN110476198B CN110476198B CN201780088894.6A CN201780088894A CN110476198B CN 110476198 B CN110476198 B CN 110476198B CN 201780088894 A CN201780088894 A CN 201780088894A CN 110476198 B CN110476198 B CN 110476198B
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Abstract
提供一种能够在柔性显示器中抑制由弯曲区域的配线发热引起的负面影响的显示装置。该显示装置包括:具有显示区域和弯曲区域的基材;配置在所述基材上,且以从所述显示区域直至所述弯曲区域的方式配置的配线;和在所述弯曲区域中以与所述配线所配置的位置对应的方式形成的散热层。
Description
技术领域
本发明涉及显示装置。
背景技术
近年来,在有机电致发光(EL)显示装置和液晶显示装置等的具有显示区域的显示装置中,使用具有挠性的基材从而能够使显示面板弯曲的柔性显示器的开发正在进展。
例如,如下述专利文献1所公开的,提出了使集成电路(IC)和柔性印刷电路板(FPC)的安装部向显示区域的背面一侧弯曲来实现窄边框化。
现有技术文献
专利文献
专利文献1:日本特开2016-31499号公报。
发明内容
发明要解决的技术问题
例如,在显示面板中配线被配置在基材上。但是,有可能在上述弯曲区域附近发生因配线的发热而引起的显示面板的破损。
本发明是鉴于上述问题而完成的,其目的在于提供一种抑制了由弯曲区域的配线发热所引起的负面影响的显示装置。
用于解决问题的技术手段
本发明的有机EL显示装置包括:具有显示区域和弯曲区域的基材;配线,其配置在所述基材上,且以从所述显示区域直至所述弯曲区域的方式配置;和散热层,其在所述弯曲区域中以与所述配线所配置的位置对应的方式形成。
附图说明
图1是表示本发明的一个实施方式的有机EL显示装置的概略结构的示意图。
图2是表示图1所示的有机EL显示装置的显示面板的一例的示意性的平面图。
图3是表示图2的III-III截面的一例的图。
图4是表示图2的A-A截面的一例的图。
图5是表示图2的B-B截面的一例的图。
图6是表示图2的被虚线包围的区域C的配线的排列状态的一例的平面图。
图7A是表示配线与散热层的关系的一例的平面图。
图7B是表示配线与辐射层的关系的一例的截面图。
图8是表示本发明的另一个实施方式中的配线与辐射层的关系的截面图。
具体实施方式
以下,对于本发明的实施方式,参考附图进行说明。另外,以下公开的内容只是一例,本领域技术人员可以容易得出的在保持发明主旨下的适当变更,当然包含在本发明的范围中。另外,附图中,有时为了使说明更加明确,而与实际的方式相比,对于各部分的宽度、厚度、形状等示意性地进行表示,但这只是一例,并不限定本发明的解释。另外,在本说明书和各图中,对于与已有的基于附图说明过的要素同样的要素,有时附加同一符号并适当省略详细的说明。
图1是以有机EL显示装置为例示出本发明的一个实施方式的显示装置的概略结构的示意图。有机EL显示装置2包括显示图像的像素阵列部4和驱动像素阵列部4的驱动部。有机EL显示装置2是使用树脂薄膜作为基材的柔性显示器,在由该树脂薄膜构成的基材上形成薄膜晶体管(TFT)和有机发光二极管(OLED)等的层叠结构。另外,图1中示出的概略图是一例,本实施方式并不限定于此。
在像素阵列部4中,OLED6和像素电路8与像素对应地呈矩阵状配置。像素电路8由多个TFT10、12和电容器14构成。
上述驱动部包括扫描线驱动电路20、影像线驱动电路22、驱动电源电路24和控制装置26,驱动像素电路8以控制OLED6的发光。
扫描线驱动电路20与按像素的水平方向的每个排列(像素行)设置的扫描信号线28连接。扫描线驱动电路20与从控制装置26输入的时序信号相应地顺序选择扫描信号线28,对选择的扫描信号线28施加使点亮TFT10接通的电压。
影像线驱动电路22与按像素的垂直方向的每个排列(像素列)设置的影像信号线30连接。影像线驱动电路22从控制装置26输入影像信号,与由扫描线驱动电路20进行的扫描信号线28的选择相应地,对各影像信号线30输出与选择的像素行的影像信号相应的电压。该电压在选择的像素行中经由点亮TFT10被写入电容器14中。驱动TFT12对OLED6供给与写入的电压相应的电流,由此,与选择的扫描信号线28对应的像素的OLED6发光。
驱动电源电路24与按每个像素列设置的驱动电源线32连接,经由驱动电源线32和选择的像素行的驱动TFT12对OLED6供给电流。
此处,OLED6的下部电极与驱动TFT12连接。另一方面,各OLED6的上部电极由对于全部像素的OLED6共用的电极构成。使下部电极构成为阳极(anode)的情况下,输入高电位,上部电极成为阴极(cathode)而输入低电位。使下部电极构成为阴极(cathode)的情况下,输入低电位,上部电极成为阳极(anode)而输入高电位。
图2是表示图1所示的有机EL显示装置的显示面板的一例的示意性的平面图。在显示面板40的显示区域42中设置图1所示的像素阵列部4,如上所述,在像素阵列部4中排列OLED6。如上所述构成OLED6的上部电极对于各像素共用地形成,覆盖整个显示区域42。
在矩形的显示面板40的一边设置有部件安装区域46,配置与显示区域42连接的配线。在部件安装区域46中,搭载构成驱动部的驱动器IC48,或者连接FPC50。FPC50与控制装置26和其他电路20、22、24等连接,或者在其上搭载IC。
图3是表示图2的III-III截面的一例的图。显示面板40具有在由树脂薄膜构成的基材70上层叠有形成TFT72等的电路层74、OLED6和将OLED6密封的密封层106等的结构。作为构成基材70的树脂薄膜,例如使用聚酰亚胺类树脂薄膜。在密封层106上形成保护层(未图示)。本实施方式中,像素阵列部4是顶部发光型,由OLED6产生的光向与基材70一侧相反的一侧(图3中的上方)出射。另外,有机EL显示装置2中的彩色化方式是滤色片方式的情况下,例如,在密封层106与保护层(未图示)之间、或者对置基板一侧配置滤色片。通过使由OLED6生成的白色光通过该滤色片,生成例如红色(R)、绿色(G)、蓝色(B)的光。
在显示区域42的电路层74中形成上述像素电路8、扫描信号线28、影像信号线30、驱动电源线32等。驱动部的至少一部分能够在基材70上作为电路层74在与显示区域42相邻的区域中形成。如上所述,能够将构成驱动部的驱动器IC48和FPC50在部件安装区域46中与电路层74的配线116连接。
如图3所示,在基材70上配置由无机绝缘材料形成的基底层80。作为无机绝缘材料,例如使用氮化硅(SiNy)、氧化硅(SiOx)和它们的复合体。
在显示区域42中,隔着基底层80,在基材70上形成作为顶栅型的TFT72的沟道部和源极及漏极部的半导体区域82。半导体区域82例如由多晶硅(p-Si)形成。半导体区域82例如通过在基材70上设置半导体层(p-Si膜),对该半导体层进行图案化,有选择地保留电路层74中使用的场所而形成。
在TFT72的沟道部上,隔着栅极绝缘膜84配置栅极电极86。栅极绝缘膜84代表性地由TEOS形成。栅极电极86例如对通过溅射等形成的金属膜进行图案化而形成。在栅极电极86上,以覆盖栅极电极86的方式配置层间绝缘层88。层间绝缘层88例如由上述无机绝缘材料形成。对于作为TFT72的源极及漏极部的半导体区域82(p-Si),通过离子注入而掺入杂质,进而形成与它们电连接的源极电极90a和漏极电极90b,构成TFT72。
在TFT72上配置层间绝缘膜92。在层间绝缘膜92的表面配置有配线94。配线94例如通过对由溅射等形成的金属膜进行图案化而形成。能够使用形成配线94的金属膜和在形成栅极电极86、源极电极90a和漏极电极90b中使用的金属膜,例如以多层配线结构形成配线116和图1所示的扫描信号线28、影像信号线30、驱动电源线32。在其上用树脂材料等形成平坦化膜96和钝化膜98,在显示区域42中,在钝化膜98上形成OLED6。钝化膜98例如由SiNy等无机绝缘材料形成。
OLED6包括下部电极100、有机材料层102和上部电极104。有机材料层102具体而言包括空穴输送层、发光层、电子输送层等。OLED6代表性的是使下部电极100、有机材料层102和上部电极104从基材70一侧起按该顺序层叠而形成的。本实施方式中,下部电极100是OLED6的阳极(anode),上部电极104是阴极(cathode)。
当图3所示的TFT72是具有n沟道的驱动TFT12时,下部电极100与TFT72的源极电极90a连接。具体而言,上述平坦化膜96形成后,形成用于将下部电极100与TFT72连接的接触孔110,例如通过对在平坦化膜96表面和接触孔110内形成的导电体部111进行图案化,而按每个像素形成与TFT72连接的下部电极100。下部电极例如由ITO(Indium Tin Oxide)、IZO(Indium Zinc Oxide)等透射性导电材料、Ag、Al等金属形成。
在上述结构上配置有使像素分离的肋112。例如,在下部电极100形成后,在像素边界形成肋112,在被肋112包围的像素的有效区域(下部电极100露出的区域)中层叠有机材料层102和上部电极104。上部电极104例如由Mg与Ag的超薄合金或ITO、IZO等透射性导电材料形成。
在上部电极104上以覆盖整个显示区域42的方式配置有密封层106。密封层106具有顺次包括第一密封膜161、密封平坦化膜160和第二密封膜162的层叠结构。第一密封膜161和第二密封膜162由无机材料(例如无机绝缘材料)形成。具体而言,通过用化学气相沉积(CVD)法使SiNy膜成膜而形成。密封平坦化膜160使用有机材料(例如固化性树脂组成物等树脂材料)形成。另一方面,在弯曲区域120和部件安装区域46中不配置密封层106。
图4是表示图2的A-A截面的一例的图,图5是表示图2的B-B截面的一例的图,图6是表示图2的被虚线包围的区域C的配线的排列状态的一例的平面图。
图4具体地示出了边框区域44周边的概略截面图。边框区域44是包围显示区域42的区域,与显示区域42相比,例如在不具有TFT72和OLED6这一点上不同。在边框区域44的电路层74中形成有电配线等。而且,在电路层74上隔着钝化膜98配置有密封层106。在边框区域44中形成有包围显示区域42的隔堤97,以覆盖隔堤97的方式形成有第一密封膜161和第二密封膜162。密封平坦化膜160被收容在隔堤97的内侧(显示区域42一侧)。
图5具体而言示出了弯曲区域120周边的沿着影像信号线30的概略截面图。显示面板40如图3所示,可以使基材70保持平面状地制造,但是例如被保存在有机EL显示装置2的壳体中时,在显示区域42的外侧设置弯曲区域120,使部件安装区域46配置在显示区域42的背面一侧。
在弯曲区域120中,优选将由无机绝缘材料形成的层(例如基底层80、层间绝缘层88、层间绝缘膜92、钝化膜98)省略或使其薄膜化。这是因为由无机绝缘材料形成的层具有易于因弯曲而破损的倾向。图示的例子中,在弯曲区域120中,在薄膜化后(具体而言,通过蚀刻等部分地形成有薄层区域80a)的基底层80上配置有配线116。
为了应对显示面板40的弯曲,在弯曲区域120中,配线116(扫描信号线28、影像信号线30、驱动电源线32)如图6所示,具有波形的弯曲形状。弯曲形状在图示例的波形以外,例如也可以采用栅格/网格型等。
驱动电源线32通常是直线状,配线宽度被设定为几百μm~几mm的较宽的宽度,但其在弯曲区域120的配线宽度例如设定为几μm~十几μm的较窄的宽度。如图6所示,以弯曲区域120为边界,驱动电源线32的宽度从宽度宽切换为宽度窄。
图7A是表示配线与散热层的关系的一例的平面图,图7B是表示配线与辐射层的关系的一例的截面图。在弯曲区域120中,在配线116(驱动电源线32)上,隔着平坦化膜(树脂膜)96形成有散热层108。散热层108例如由金属材料形成。散热层108例如能够在形成OLED6的电极时形成。具体而言,能够在形成下部电极(anode)100时,用构成下部电极的金属(例如Ag、Al)形成。
散热层108沿着与配线116的配线方向交叉的方向形成。图示例中,例如从抑制由弯曲引起的断裂的观点考虑,多个散热层108隔开规定的间隔地形成为并排状。该情况下,散热层108的宽度例如被设定为几μm~几十μm。散热层108的长度例如被设定为大于驱动电源线32的宽度。也可以与图示的例子不同,例如较宽地形成1个散热层,也可以形成具有规定的图案的散热层。散热层108优选以至少与配线宽度从宽度宽切换为宽度窄的部位对应的方式形成。
在弯曲区域120中,例如,因配线116的弯曲,而使配线长度延长,配线电阻增加。另外,因为使配线116在薄膜化后的基底层80上排列,所以配线能够如上所述地形成得宽度窄。因此,在弯曲区域120中,易于发生由发热引起的负面影响。特别是,可能在宽度窄且切换为弯曲形状的部位(具体而言,是配线宽度切换为窄宽度后向前几mm的场所)局部地发热。另一方面,基底层80和平坦化膜96的热容较小。如上所述,通过配置散热层108,可以促进散热,抑制由发热引起的负面影响。另外,例如与设置散热片等其他部件的方式相比,通过形成散热层108,能够更有助于抑制制造成本和面板的薄型化。
图示例中,在配线116上配置的树脂膜96的厚度比显示区域42的平坦化膜96的厚度薄。关于在配线116上配置的树脂膜96的厚度,例如可以考虑显示面板40的弯曲状态、配线116的发热的散热程度等适当地确定。
图8是本发明的另一个实施方式中的弯曲区域的截面图。本实施方式中,在散热层108与配线116相比配置在基材70一侧这一点上与上述实施方式不同。具体而言,在基底层80上形成散热层108,以覆盖散热层108的方式形成层间绝缘膜92,在层间绝缘膜92上配置配线116。该情况下,散热层108例如能够在显示区域42中形成栅极电极86时形成。
本发明不限定于上述实施方式,能够进行各种变形。例如,能够使用与上述实施方式中示出的结构实质上相同的结构、实现相同的作用效果的结构或者能够达成相同的目的的结构来进行置换。
Claims (9)
1.一种显示装置,其特征在于,包括:
具有显示区域和弯曲区域的基材;
配线,其配置在所述基材上,且以从所述显示区域直至所述弯曲区域的方式配置;和
散热层,其在所述弯曲区域中以与所述配线所配置的位置对应的方式形成,
在所述弯曲区域中,与所述弯曲区域之外的区域相比,所述配线形成得宽度窄,
所述散热层以与所述配线中的所述形成得宽度窄的部位对应的方式形成。
2.如权利要求1所述的显示装置,其特征在于:
所述配线包含驱动电源线,
所述散热层以至少与所述驱动电源线所配置的位置对应的方式形成。
3.如权利要求1所述的显示装置,其特征在于:
在所述弯曲区域中,所述配线具有弯曲形状。
4.如权利要求1所述的显示装置,其特征在于:
具有配置在所述基材上的含有无机绝缘材料的层,
所述含有无机绝缘材料的层在所述弯曲区域中形成有厚度薄的薄层区域,
所述配线在所述薄层区域中配置在含有无机绝缘材料的层上。
5.如权利要求1所述的显示装置,其特征在于:
所述散热层沿着与所述配线的配线方向交叉的方向形成。
6.如权利要求1所述的显示装置,其特征在于:
所述散热层隔开规定间隔地形成为并排状。
7.如权利要求1所述的显示装置,其特征在于:
所述散热层含有金属材料。
8.如权利要求1所述的显示装置,其特征在于:
在所述配线与所述散热层之间配置有由热容比所述散热层的形成材料小的材质形成的层。
9.如权利要求8所述的显示装置,其特征在于:
由热容比所述散热层的形成材料小的材质形成的层含有无机绝缘材料和/或树脂材料。
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2019
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2021
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US11222940B2 (en) | 2022-01-11 |
US20200013850A1 (en) | 2020-01-09 |
WO2018173415A1 (ja) | 2018-09-27 |
US20220028959A1 (en) | 2022-01-27 |
CN110476198A (zh) | 2019-11-19 |
US11765951B2 (en) | 2023-09-19 |
JP6817862B2 (ja) | 2021-01-20 |
JP2018159893A (ja) | 2018-10-11 |
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