CN110462855A - 包括固体半导体管芯的电子装置 - Google Patents
包括固体半导体管芯的电子装置 Download PDFInfo
- Publication number
- CN110462855A CN110462855A CN201880021460.9A CN201880021460A CN110462855A CN 110462855 A CN110462855 A CN 110462855A CN 201880021460 A CN201880021460 A CN 201880021460A CN 110462855 A CN110462855 A CN 110462855A
- Authority
- CN
- China
- Prior art keywords
- layer
- die
- array
- tube core
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
- H10W10/014—Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/10—Isolation regions comprising dielectric materials
- H10W10/17—Isolation regions comprising dielectric materials formed using trench refilling with dielectric materials, e.g. shallow trench isolations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/071—Manufacture or treatment of dielectric parts thereof
- H10W20/093—Manufacture or treatment of dielectric parts thereof by modifying materials of the dielectric parts
- H10W20/097—Manufacture or treatment of dielectric parts thereof by modifying materials of the dielectric parts by thermally treating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07231—Techniques
- H10W72/07232—Compression bonding, e.g. thermocompression bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762479796P | 2017-03-31 | 2017-03-31 | |
| US62/479,796 | 2017-03-31 | ||
| PCT/IB2018/051949 WO2018178821A2 (en) | 2017-03-31 | 2018-03-22 | Electronic devices including solid semiconductor dies |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110462855A true CN110462855A (zh) | 2019-11-15 |
Family
ID=63677765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880021460.9A Pending CN110462855A (zh) | 2017-03-31 | 2018-03-22 | 包括固体半导体管芯的电子装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11114599B2 (https=) |
| EP (1) | EP3602642A4 (https=) |
| JP (1) | JP7203037B2 (https=) |
| CN (1) | CN110462855A (https=) |
| TW (1) | TWI765017B (https=) |
| WO (1) | WO2018178821A2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110573230B (zh) | 2017-04-28 | 2022-09-06 | 3M创新有限公司 | 基于热电装置的空气过滤监测 |
| US11450797B2 (en) | 2017-12-08 | 2022-09-20 | 3M Innovative Properties Company | Differential thermoelectric device |
| EP4094289A1 (en) | 2020-01-24 | 2022-11-30 | 3M Innovative Properties Company | Electrical connections to embedded electronic components |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0818109A (ja) * | 1994-06-24 | 1996-01-19 | Seiko Instr Inc | 熱電素子とその製造方法 |
| CN103390613A (zh) * | 2013-08-14 | 2013-11-13 | 中国科学院长春光学精密机械与物理研究所 | 高发光均匀性的密排列led面阵器件及制备方法 |
| CN104332414A (zh) * | 2014-04-09 | 2015-02-04 | 珠海越亚封装基板技术股份有限公司 | 嵌入式芯片的制造方法 |
| CN104425395A (zh) * | 2013-08-20 | 2015-03-18 | 日月光半导体制造股份有限公司 | 半导体封装件及其制造方法 |
| CN105261595A (zh) * | 2014-04-22 | 2016-01-20 | 美国博通公司 | 用于半导体封装件的重构技术 |
| US20170025582A1 (en) * | 2015-06-01 | 2017-01-26 | Intematix Corporation | Photoluminescence material coating of led chips |
| US20170033272A1 (en) * | 2015-07-31 | 2017-02-02 | Stmicroelectronics S.R.L. | Method to make a flexible thermoelectric generator device and related devices |
| WO2017019866A1 (en) * | 2015-07-29 | 2017-02-02 | Qualcomm Incorporated | Package-on-package (pop) structure including multiple dies |
| KR20170026214A (ko) * | 2015-08-26 | 2017-03-08 | 주하이 어드밴스드 칩 캐리어스 앤드 일렉트로닉 서브스트레이트 솔루션즈 테크놀러지즈 컴퍼니 리미티드 | 개선된 칩 패키지 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6297441B1 (en) | 2000-03-24 | 2001-10-02 | Chris Macris | Thermoelectric device and method of manufacture |
| US8456002B2 (en) * | 2007-12-14 | 2013-06-04 | Stats Chippac Ltd. | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief |
| TWI481087B (zh) * | 2010-01-20 | 2015-04-11 | Nat I Lan University | Flexible thermoelectric energy converter and its manufacturing method |
| KR20110087547A (ko) * | 2010-01-26 | 2011-08-03 | 도레이첨단소재 주식회사 | 내열성 점착시트를 이용한 반도체 장치의 제조방법 |
| JP2014093342A (ja) | 2012-11-01 | 2014-05-19 | Mitsubishi Electric Corp | 絶縁基板および半導体装置 |
| JP6064861B2 (ja) | 2013-03-05 | 2017-01-25 | 株式会社デンソー | 熱電変換装置の製造方法 |
| US10103037B2 (en) * | 2014-05-09 | 2018-10-16 | Intel Corporation | Flexible microelectronic systems and methods of fabricating the same |
| US10206288B2 (en) | 2015-08-13 | 2019-02-12 | Palo Alto Research Center Incorporated | Bare die integration with printed components on flexible substrate |
| KR102443361B1 (ko) * | 2015-09-03 | 2022-09-19 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR102047736B1 (ko) | 2016-06-23 | 2019-11-25 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 가요성 열전 모듈 |
| WO2017222862A1 (en) | 2016-06-23 | 2017-12-28 | 3M Innovative Properties Company | Flexible thermoelectric module |
| KR102414392B1 (ko) | 2016-06-23 | 2022-06-30 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 열전 테이프 |
| CN106601661B (zh) * | 2017-01-09 | 2019-08-27 | 京东方科技集团股份有限公司 | 转印装置及转印方法 |
-
2018
- 2018-03-22 EP EP18778287.5A patent/EP3602642A4/en not_active Withdrawn
- 2018-03-22 JP JP2019553062A patent/JP7203037B2/ja active Active
- 2018-03-22 US US16/498,478 patent/US11114599B2/en active Active
- 2018-03-22 WO PCT/IB2018/051949 patent/WO2018178821A2/en not_active Ceased
- 2018-03-22 CN CN201880021460.9A patent/CN110462855A/zh active Pending
- 2018-03-30 TW TW107111156A patent/TWI765017B/zh not_active IP Right Cessation
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0818109A (ja) * | 1994-06-24 | 1996-01-19 | Seiko Instr Inc | 熱電素子とその製造方法 |
| CN103390613A (zh) * | 2013-08-14 | 2013-11-13 | 中国科学院长春光学精密机械与物理研究所 | 高发光均匀性的密排列led面阵器件及制备方法 |
| CN104425395A (zh) * | 2013-08-20 | 2015-03-18 | 日月光半导体制造股份有限公司 | 半导体封装件及其制造方法 |
| CN104332414A (zh) * | 2014-04-09 | 2015-02-04 | 珠海越亚封装基板技术股份有限公司 | 嵌入式芯片的制造方法 |
| CN105261595A (zh) * | 2014-04-22 | 2016-01-20 | 美国博通公司 | 用于半导体封装件的重构技术 |
| US20170025582A1 (en) * | 2015-06-01 | 2017-01-26 | Intematix Corporation | Photoluminescence material coating of led chips |
| WO2017019866A1 (en) * | 2015-07-29 | 2017-02-02 | Qualcomm Incorporated | Package-on-package (pop) structure including multiple dies |
| US20170033272A1 (en) * | 2015-07-31 | 2017-02-02 | Stmicroelectronics S.R.L. | Method to make a flexible thermoelectric generator device and related devices |
| KR20170026214A (ko) * | 2015-08-26 | 2017-03-08 | 주하이 어드밴스드 칩 캐리어스 앤드 일렉트로닉 서브스트레이트 솔루션즈 테크놀러지즈 컴퍼니 리미티드 | 개선된 칩 패키지 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7203037B2 (ja) | 2023-01-12 |
| WO2018178821A3 (en) | 2019-02-07 |
| TWI765017B (zh) | 2022-05-21 |
| US20200105991A1 (en) | 2020-04-02 |
| TW201904098A (zh) | 2019-01-16 |
| JP2020516069A (ja) | 2020-05-28 |
| EP3602642A4 (en) | 2020-12-23 |
| EP3602642A2 (en) | 2020-02-05 |
| WO2018178821A2 (en) | 2018-10-04 |
| US11114599B2 (en) | 2021-09-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20191115 |
|
| WD01 | Invention patent application deemed withdrawn after publication |