JP7203037B2 - 固体半導体ダイを含む電子機器 - Google Patents

固体半導体ダイを含む電子機器 Download PDF

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JP7203037B2
JP7203037B2 JP2019553062A JP2019553062A JP7203037B2 JP 7203037 B2 JP7203037 B2 JP 7203037B2 JP 2019553062 A JP2019553062 A JP 2019553062A JP 2019553062 A JP2019553062 A JP 2019553062A JP 7203037 B2 JP7203037 B2 JP 7203037B2
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layer
die
array
dies
liner
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JP2020516069A5 (https=
JP2020516069A (ja
Inventor
マハジャン，アンキット
エル． ペクロフスキー，ミカイル
エス． ステイ，マシュー
シー． ドッズ，ショーン
ジェイ． メッツラー，トーマス
アール．ディー． スミス，マシュー
エー． シャー，セーガー
ヨン イ，ジェ
エフ． ポッチ，ジェイムズ
ダブリュ． バートン，ロジャー
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
    • H10W10/014—Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/17—Isolation regions comprising dielectric materials formed using trench refilling with dielectric materials, e.g. shallow trench isolations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/093—Manufacture or treatment of dielectric parts thereof by modifying materials of the dielectric parts
    • H10W20/097—Manufacture or treatment of dielectric parts thereof by modifying materials of the dielectric parts by thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2019553062A 2017-03-31 2018-03-22 固体半導体ダイを含む電子機器 Active JP7203037B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762479796P 2017-03-31 2017-03-31
US62/479,796 2017-03-31
PCT/IB2018/051949 WO2018178821A2 (en) 2017-03-31 2018-03-22 Electronic devices including solid semiconductor dies

Publications (3)

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JP2020516069A JP2020516069A (ja) 2020-05-28
JP2020516069A5 JP2020516069A5 (https=) 2021-04-30
JP7203037B2 true JP7203037B2 (ja) 2023-01-12

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JP2019553062A Active JP7203037B2 (ja) 2017-03-31 2018-03-22 固体半導体ダイを含む電子機器

Country Status (6)

Country Link
US (1) US11114599B2 (https=)
EP (1) EP3602642A4 (https=)
JP (1) JP7203037B2 (https=)
CN (1) CN110462855A (https=)
TW (1) TWI765017B (https=)
WO (1) WO2018178821A2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110573230B (zh) 2017-04-28 2022-09-06 3M创新有限公司 基于热电装置的空气过滤监测
US11450797B2 (en) 2017-12-08 2022-09-20 3M Innovative Properties Company Differential thermoelectric device
EP4094289A1 (en) 2020-01-24 2022-11-30 3M Innovative Properties Company Electrical connections to embedded electronic components

Citations (2)

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US20130175696A1 (en) 2007-12-14 2013-07-11 Stats Chippac, Ltd. Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief
JP2014093342A (ja) 2012-11-01 2014-05-19 Mitsubishi Electric Corp 絶縁基板および半導体装置

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JPH0818109A (ja) * 1994-06-24 1996-01-19 Seiko Instr Inc 熱電素子とその製造方法
US6297441B1 (en) 2000-03-24 2001-10-02 Chris Macris Thermoelectric device and method of manufacture
TWI481087B (zh) * 2010-01-20 2015-04-11 Nat I Lan University Flexible thermoelectric energy converter and its manufacturing method
KR20110087547A (ko) * 2010-01-26 2011-08-03 도레이첨단소재 주식회사 내열성 점착시트를 이용한 반도체 장치의 제조방법
JP6064861B2 (ja) 2013-03-05 2017-01-25 株式会社デンソー 熱電変換装置の製造方法
CN103390613B (zh) * 2013-08-14 2016-08-10 中国科学院长春光学精密机械与物理研究所 高发光均匀性的密排列led面阵器件及制备方法
CN104425395A (zh) * 2013-08-20 2015-03-18 日月光半导体制造股份有限公司 半导体封装件及其制造方法
US9240392B2 (en) * 2014-04-09 2016-01-19 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co., Ltd. Method for fabricating embedded chips
US20150303172A1 (en) * 2014-04-22 2015-10-22 Broadcom Corporation Reconstitution techniques for semiconductor packages
US10103037B2 (en) * 2014-05-09 2018-10-16 Intel Corporation Flexible microelectronic systems and methods of fabricating the same
US10347798B2 (en) * 2015-06-01 2019-07-09 Intematix Corporation Photoluminescence material coating of LED chips
US9401350B1 (en) * 2015-07-29 2016-07-26 Qualcomm Incorporated Package-on-package (POP) structure including multiple dies
US20170033272A1 (en) * 2015-07-31 2017-02-02 Stmicroelectronics S.R.L. Method to make a flexible thermoelectric generator device and related devices
US10206288B2 (en) 2015-08-13 2019-02-12 Palo Alto Research Center Incorporated Bare die integration with printed components on flexible substrate
KR101842426B1 (ko) * 2015-08-26 2018-05-14 주하이 어드밴스드 칩 캐리어스 앤드 일렉트로닉 서브스트레이트 솔루션즈 테크놀러지즈 컴퍼니 리미티드 내장형 다이 패키지, 칩 패키지 제조방법, 다층 인터포저 및 칩 패키지
KR102443361B1 (ko) * 2015-09-03 2022-09-19 삼성디스플레이 주식회사 표시 장치
KR102047736B1 (ko) 2016-06-23 2019-11-25 쓰리엠 이노베이티브 프로퍼티즈 컴파니 가요성 열전 모듈
WO2017222862A1 (en) 2016-06-23 2017-12-28 3M Innovative Properties Company Flexible thermoelectric module
KR102414392B1 (ko) 2016-06-23 2022-06-30 쓰리엠 이노베이티브 프로퍼티즈 컴파니 열전 테이프
CN106601661B (zh) * 2017-01-09 2019-08-27 京东方科技集团股份有限公司 转印装置及转印方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130175696A1 (en) 2007-12-14 2013-07-11 Stats Chippac, Ltd. Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief
JP2014093342A (ja) 2012-11-01 2014-05-19 Mitsubishi Electric Corp 絶縁基板および半導体装置

Also Published As

Publication number Publication date
WO2018178821A3 (en) 2019-02-07
TWI765017B (zh) 2022-05-21
US20200105991A1 (en) 2020-04-02
TW201904098A (zh) 2019-01-16
JP2020516069A (ja) 2020-05-28
EP3602642A4 (en) 2020-12-23
EP3602642A2 (en) 2020-02-05
WO2018178821A2 (en) 2018-10-04
CN110462855A (zh) 2019-11-15
US11114599B2 (en) 2021-09-07

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