JP2020516069A5 - - Google Patents

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Publication number
JP2020516069A5
JP2020516069A5 JP2019553062A JP2019553062A JP2020516069A5 JP 2020516069 A5 JP2020516069 A5 JP 2020516069A5 JP 2019553062 A JP2019553062 A JP 2019553062A JP 2019553062 A JP2019553062 A JP 2019553062A JP 2020516069 A5 JP2020516069 A5 JP 2020516069A5
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JP
Japan
Prior art keywords
layer
array
main surface
dies
die
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JP2019553062A
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English (en)
Japanese (ja)
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JP7203037B2 (ja
JP2020516069A (ja
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Priority claimed from PCT/IB2018/051949 external-priority patent/WO2018178821A2/en
Publication of JP2020516069A publication Critical patent/JP2020516069A/ja
Publication of JP2020516069A5 publication Critical patent/JP2020516069A5/ja
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Publication of JP7203037B2 publication Critical patent/JP7203037B2/ja
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JP2019553062A 2017-03-31 2018-03-22 固体半導体ダイを含む電子機器 Active JP7203037B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762479796P 2017-03-31 2017-03-31
US62/479,796 2017-03-31
PCT/IB2018/051949 WO2018178821A2 (en) 2017-03-31 2018-03-22 Electronic devices including solid semiconductor dies

Publications (3)

Publication Number Publication Date
JP2020516069A JP2020516069A (ja) 2020-05-28
JP2020516069A5 true JP2020516069A5 (https=) 2021-04-30
JP7203037B2 JP7203037B2 (ja) 2023-01-12

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ID=63677765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019553062A Active JP7203037B2 (ja) 2017-03-31 2018-03-22 固体半導体ダイを含む電子機器

Country Status (6)

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US (1) US11114599B2 (https=)
EP (1) EP3602642A4 (https=)
JP (1) JP7203037B2 (https=)
CN (1) CN110462855A (https=)
TW (1) TWI765017B (https=)
WO (1) WO2018178821A2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110573230B (zh) 2017-04-28 2022-09-06 3M创新有限公司 基于热电装置的空气过滤监测
US11450797B2 (en) 2017-12-08 2022-09-20 3M Innovative Properties Company Differential thermoelectric device
EP4094289A1 (en) 2020-01-24 2022-11-30 3M Innovative Properties Company Electrical connections to embedded electronic components

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0818109A (ja) * 1994-06-24 1996-01-19 Seiko Instr Inc 熱電素子とその製造方法
US6297441B1 (en) 2000-03-24 2001-10-02 Chris Macris Thermoelectric device and method of manufacture
US8456002B2 (en) * 2007-12-14 2013-06-04 Stats Chippac Ltd. Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
TWI481087B (zh) * 2010-01-20 2015-04-11 Nat I Lan University Flexible thermoelectric energy converter and its manufacturing method
KR20110087547A (ko) * 2010-01-26 2011-08-03 도레이첨단소재 주식회사 내열성 점착시트를 이용한 반도체 장치의 제조방법
JP2014093342A (ja) 2012-11-01 2014-05-19 Mitsubishi Electric Corp 絶縁基板および半導体装置
JP6064861B2 (ja) 2013-03-05 2017-01-25 株式会社デンソー 熱電変換装置の製造方法
CN103390613B (zh) * 2013-08-14 2016-08-10 中国科学院长春光学精密机械与物理研究所 高发光均匀性的密排列led面阵器件及制备方法
CN104425395A (zh) * 2013-08-20 2015-03-18 日月光半导体制造股份有限公司 半导体封装件及其制造方法
US9240392B2 (en) * 2014-04-09 2016-01-19 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co., Ltd. Method for fabricating embedded chips
US20150303172A1 (en) * 2014-04-22 2015-10-22 Broadcom Corporation Reconstitution techniques for semiconductor packages
US10103037B2 (en) * 2014-05-09 2018-10-16 Intel Corporation Flexible microelectronic systems and methods of fabricating the same
US10347798B2 (en) * 2015-06-01 2019-07-09 Intematix Corporation Photoluminescence material coating of LED chips
US9401350B1 (en) * 2015-07-29 2016-07-26 Qualcomm Incorporated Package-on-package (POP) structure including multiple dies
US20170033272A1 (en) * 2015-07-31 2017-02-02 Stmicroelectronics S.R.L. Method to make a flexible thermoelectric generator device and related devices
US10206288B2 (en) 2015-08-13 2019-02-12 Palo Alto Research Center Incorporated Bare die integration with printed components on flexible substrate
KR101842426B1 (ko) * 2015-08-26 2018-05-14 주하이 어드밴스드 칩 캐리어스 앤드 일렉트로닉 서브스트레이트 솔루션즈 테크놀러지즈 컴퍼니 리미티드 내장형 다이 패키지, 칩 패키지 제조방법, 다층 인터포저 및 칩 패키지
KR102443361B1 (ko) * 2015-09-03 2022-09-19 삼성디스플레이 주식회사 표시 장치
KR102047736B1 (ko) 2016-06-23 2019-11-25 쓰리엠 이노베이티브 프로퍼티즈 컴파니 가요성 열전 모듈
WO2017222862A1 (en) 2016-06-23 2017-12-28 3M Innovative Properties Company Flexible thermoelectric module
KR102414392B1 (ko) 2016-06-23 2022-06-30 쓰리엠 이노베이티브 프로퍼티즈 컴파니 열전 테이프
CN106601661B (zh) * 2017-01-09 2019-08-27 京东方科技集团股份有限公司 转印装置及转印方法

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