CN110438540A - 表面处理铜箔及使用其的积层板、印刷配线板、电子机器、以及印刷配线板的制造方法 - Google Patents

表面处理铜箔及使用其的积层板、印刷配线板、电子机器、以及印刷配线板的制造方法 Download PDF

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Publication number
CN110438540A
CN110438540A CN201910729255.4A CN201910729255A CN110438540A CN 110438540 A CN110438540 A CN 110438540A CN 201910729255 A CN201910729255 A CN 201910729255A CN 110438540 A CN110438540 A CN 110438540A
Authority
CN
China
Prior art keywords
copper foil
mentioned
printing distributing
roughening
distributing board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910729255.4A
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English (en)
Chinese (zh)
Inventor
新井英太
三木敦史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of CN110438540A publication Critical patent/CN110438540A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0692—Regulating the thickness of the coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
CN201910729255.4A 2012-06-11 2013-06-11 表面处理铜箔及使用其的积层板、印刷配线板、电子机器、以及印刷配线板的制造方法 Pending CN110438540A (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2012-131993 2012-06-11
JP2012131993 2012-06-11
JP2013-003865 2013-01-11
JP2013003865 2013-01-11
JP2013-008532 2013-01-21
JP2013008532A JP5417538B1 (ja) 2012-06-11 2013-01-21 表面処理銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
CN201380030544.6A CN104364426A (zh) 2012-06-11 2013-06-11 表面处理铜箔及使用其的积层板、印刷配线板、电子机器、以及印刷配线板的制造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201380030544.6A Division CN104364426A (zh) 2012-06-11 2013-06-11 表面处理铜箔及使用其的积层板、印刷配线板、电子机器、以及印刷配线板的制造方法

Publications (1)

Publication Number Publication Date
CN110438540A true CN110438540A (zh) 2019-11-12

Family

ID=49758242

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201910729255.4A Pending CN110438540A (zh) 2012-06-11 2013-06-11 表面处理铜箔及使用其的积层板、印刷配线板、电子机器、以及印刷配线板的制造方法
CN201380030544.6A Pending CN104364426A (zh) 2012-06-11 2013-06-11 表面处理铜箔及使用其的积层板、印刷配线板、电子机器、以及印刷配线板的制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201380030544.6A Pending CN104364426A (zh) 2012-06-11 2013-06-11 表面处理铜箔及使用其的积层板、印刷配线板、电子机器、以及印刷配线板的制造方法

Country Status (5)

Country Link
JP (1) JP5417538B1 (ja)
KR (1) KR101751622B1 (ja)
CN (2) CN110438540A (ja)
TW (1) TWI566647B (ja)
WO (1) WO2013187420A1 (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5204908B1 (ja) * 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
JP5885790B2 (ja) * 2013-08-20 2016-03-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、電子機器の製造方法、並びに、プリント配線板の製造方法
TWI587757B (zh) * 2013-09-20 2017-06-11 Mitsui Mining & Smelting Co Copper foil, copper foil with carrier foil, and copper clad laminate
JP5756547B1 (ja) * 2014-04-28 2015-07-29 株式会社Ｓｈカッパープロダクツ 表面処理銅箔及び積層板
JP2016191698A (ja) * 2015-03-31 2016-11-10 新日鉄住金化学株式会社 銅張積層板及び回路基板
JP2017015531A (ja) * 2015-06-30 2017-01-19 新日鉄住金化学株式会社 銅張積層板及び回路基板
JP6782561B2 (ja) * 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JPWO2017051897A1 (ja) * 2015-09-24 2018-08-30 Ｊｘ金属株式会社 金属箔、離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
CN108697006B (zh) * 2017-03-31 2021-07-16 Ｊｘ金属株式会社 表面处理铜箔、附载体铜箔、积层体、印刷配线板的制造方法及电子机器的制造方法
WO2018193935A1 (ja) * 2017-04-17 2018-10-25 住友金属鉱山株式会社 導電性基板、導電性基板の製造方法
CN110382745B (zh) * 2017-05-19 2021-06-25 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板
KR102349377B1 (ko) * 2019-12-19 2022-01-12 일진머티리얼즈 주식회사 표면처리 동박, 이의 제조방법, 이를 포함한 동박적층판, 및 이를 포함한 프린트 배선판
JP7050859B2 (ja) * 2020-06-15 2022-04-08 日鉄ケミカル＆マテリアル株式会社 銅張積層板の製造方法
CN114107985B (zh) * 2021-11-12 2024-06-18 中航光电科技股份有限公司 一种耐海洋环境复合材料镀覆层的镀覆工艺

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JP2849059B2 (ja) * 1995-09-28 1999-01-20 日鉱グールド・フォイル株式会社 印刷回路用銅箔の処理方法
JP4090467B2 (ja) * 2002-05-13 2008-05-28 三井金属鉱業株式会社 チップオンフィルム用フレキシブルプリント配線板
JP2004098659A (ja) * 2002-07-19 2004-04-02 Ube Ind Ltd 銅張積層板及びその製造方法
TWI298988B (en) * 2002-07-19 2008-07-11 Ube Industries Copper-clad laminate
TW200535259A (en) * 2004-02-06 2005-11-01 Furukawa Circuit Foil Treated copper foil and circuit board
CN100515167C (zh) * 2004-02-17 2009-07-15 日矿金属株式会社 具有黑化处理表面或层的铜箔
CN101146933B (zh) * 2005-03-31 2010-11-24 三井金属矿业株式会社 电解铜箔及电解铜箔的制造方法、采用该电解铜箔得到的表面处理电解铜箔、采用该表面处理电解铜箔的覆铜层压板及印刷电路板
JP2007046095A (ja) 2005-08-09 2007-02-22 Mitsubishi Shindoh Co Ltd 銅箔およびその表面処理方法
JP2007268596A (ja) * 2006-03-31 2007-10-18 Nikko Kinzoku Kk 粗化処理用銅合金箔
JP2007332418A (ja) * 2006-06-15 2007-12-27 Fukuda Metal Foil & Powder Co Ltd 表面処理銅箔
KR20080063159A (ko) * 2006-12-28 2008-07-03 미쓰이 긴조꾸 고교 가부시키가이샤 가요성 프린트 배선 기판 및 반도체 장치
JP5588607B2 (ja) * 2007-10-31 2014-09-10 三井金属鉱業株式会社 電解銅箔及びその電解銅箔の製造方法
EP2351876A1 (en) * 2008-11-25 2011-08-03 JX Nippon Mining & Metals Corporation Copper foil for printed circuit

Also Published As

Publication number Publication date
JP2014148692A (ja) 2014-08-21
TW201406228A (zh) 2014-02-01
JP5417538B1 (ja) 2014-02-19
WO2013187420A1 (ja) 2013-12-19
KR101751622B1 (ko) 2017-06-27
CN104364426A (zh) 2015-02-18
KR20150024393A (ko) 2015-03-06
TWI566647B (zh) 2017-01-11

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