CN110416074A - 一种单晶硅的刻蚀方法及刻蚀液 - Google Patents
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Abstract
本发明公开了一种单晶硅的刻蚀方法及刻蚀液,刻蚀液由如下比例的成分组成:乙醇胺20~35%;没食子酸3.5~6.5%;哌啶0.1~0.3%;含氟表面活性剂0.005~0.01%;过氧化氢1.0~2.0%;去离子水余量。配制如上所述的刻蚀液后,未抛光的p型单晶硅硅片,放入氢氟酸、硝酸与去离子水混合液中浸泡,然后用去离子冲洗;将处理过的硅片浸泡于刻蚀液中反应,反应完成后,取出硅片,用去离子水冲洗,最后用氮气吹干。本发明可以获得低反射率的金字塔结构绒面,同时具有无碱金属污染、成本低廉、环境友好等特点,在高效单晶硅太阳能电池行业有巨大的潜在应用和推广价值。
Description
技术领域
本发明属于太阳能电池技术领域,特别是涉及一种单晶硅的刻蚀方法及刻蚀液。
背景技术
为了减少太阳光在单晶硅太阳能电池表面的反射,通常采用化学湿法腐蚀对单晶硅进行刻蚀,利用单晶硅的各性异性特点,不同晶面具有不同的腐蚀速率,从而使得硅片表面具有金字塔结构的绒面。入射光照射到没有制绒的硅片时,经过一次反射。后离开硅片表面,而照射到具有绒面结构的硅片表面时,入射光通常经过多次反射后才离开硅片表面。光线每经过一次反射,硅片就增加一次吸收,因此,表面具有绒面结构的硅片与未制绒的硅片相比,可以增加光的吸收,减少反射,从而达到提高单晶硅太阳能电池效率的目的。
单晶硅制绒的化学湿法腐蚀所用的刻蚀液主要分为两类,一类是包括氢氧化钾、氢氧化钠等无机碱-异丙醇,另一类是有机碱溶液,包括EPW(乙二胺、邻苯二酚和水)、TMAH(氢氧化四甲基胺)和联胺((N2H4))等。对于氢氧化钾-异丙醇水溶液而言,氢氧化钾首先将硅氧化成含水的硅化合物,然后再与异丙醇发生反应,最后形成可溶解的硅络合物,使得硅原子不断地离开硅表面。对于EPW腐蚀液而言,乙二胺和水把硅氧化成含水的硅化合物,而邻苯二酚起到络合剂的作用,反应生成物可以溶解于EPW腐蚀液中。在这些有机和无机腐蚀液中,OH-离子对腐蚀硅起到了关键作用,不同的腐蚀液具有不同的腐蚀速率、微结构的形貌和均匀性、表面残留沉积物等。
考虑到经济成本,目前光伏产业的单晶硅制绒主要采用无机碱-异丙醇水溶液体系,在这些碱溶液中含有碱金属离子(如钾、钠等),而金属离子很难通过后续的化学清洗进行彻底去除。对于高效的晶体硅太阳能电池来说,随着电池效率的提升,由于制绒引入的金属离子污染对电池的效率的影响会越来越大。采用有机碱对单晶硅刻蚀制绒,则不存在碱金属离子的污染,因此,采用有机碱取代无机碱对硅片制绒,是高效晶体硅太阳能电池的必然选择趋势。EPW腐蚀液的腐蚀性能良好,但容易氧化而失效,较易导致不溶沉淀物的出现,而且邻苯二酚是一种有毒腐蚀性强的物质。TMAH腐蚀液具有优良各项异性选择性,是一种非常具有发展潜力的腐蚀液,但绒面中凸角结构的削角较严重,而且价格昂贵。联氨是剧毒药品,必须在良好的通风条件下进行操作。
发明内容
本发明的目的是提供一种效果更好的单晶硅的刻蚀方法,以及刻蚀液。
为此,本发明采用的技术方案是这样的:单晶硅的刻蚀液,由如下比例的成分组成:乙醇胺20~35%;没食子酸3.5~6.5%;哌啶0.1~0.3%;含氟表面活性剂0.005~0.01%;过氧化氢1.0~2.0%;去离子水余量。
其中,所述的含氟表面活性剂为PF-154N氟表面活性剂。
本发明还采用这样的技术方案:单晶硅的刻蚀方法,包括下列步骤:
1)配制如上所述的刻蚀液,搅拌混合均匀;
2)取未抛光的p型单晶硅硅片,放入氢氟酸、硝酸与去离子水混合液(浓度为40wt%的HF:68wt%的HNO3:H2O的体积比为1:8:3)中在室温下浸泡3~5min,然后用去离子冲洗;
3)将步骤2)处理过的硅片浸泡于步骤1)所得的刻蚀液中,反应温度为85~90℃,反应时间为10~15min;反应完成后,取出硅片,用去离子水冲洗,最后用氮气吹干。
本发明采用的乙醇胺,分子式为C2H4OH)NH2,室温下为无色透明液体,沸点是170.5℃,是一种有机强碱,可溶解于水、甲醇、乙醇、丙酮,在工业上广泛用于催化剂、清洗剂和腐蚀剂。乙醇胺作为单晶硅刻蚀剂,是一种无毒、对环境友好、选择性好的各向异性腐蚀剂。在乙醇胺/水的刻蚀溶液中,为了控制刻蚀液与硅的反应速度,调节绒面结构的形貌、尺寸和均匀性等,通常需要添加双功能酚醛络合剂。尽管邻苯二酚是一种非常好的活性硅络合剂,但是它有毒且腐蚀性强。在羟基苯甲酸中,没食子酸是最具活性、最便宜和最环保的络合剂。没食子酸,亦称五倍子酸,分子式为C7H6O5,白色或浅褐色针状结晶或粉末,是自然界存在的一种多酚类化合物,在医药化工行业有广泛的应用。本发明可以获得低反射率的金字塔结构绒面,同时具有无碱金属污染、成本低廉、环境友好等特点,在高效单晶硅太阳能电池行业有巨大的潜在应用和推广价值。
附图说明
以下结合附图和本发明的实施方式来作进一步详细说明
图1为常规氢氧化钾–异丙醇–水溶液与乙醇胺–没食子酸–水溶液对金刚线切割单晶硅制绒后反射率;
曲线S1为常规氢氧化钾–异丙醇–水溶液对金刚线切割单晶硅制绒后反射率;曲线S2为乙醇胺–没食子酸–水溶液对金刚线切割单晶硅制绒后反射率。
具体实施方式
1.主要实验原材料和仪器设备
乙醇胺(C2H4OH)NH2):分析纯,上海麦克林生化科技有限公司;
没食子酸(C7H6O5):99%,上海麦克林生化科技有限公司;
吡啶((CH2)5NH):99%,湖南华腾制药有限公司;
PF-154N:氟表面活性剂,广州昊毅化工科技有限公司;
氢氟酸、硝酸:分析纯,上海国药集团
去离子水:电阻率大于18.2MΩ.cm;
电热恒温水槽:控温范围,室温~99℃;控温精度,0.1℃;上海一恒科学仪器有限公司。
2.乙醇胺–没食子酸–水溶液刻蚀剂的配制
按以下质量百分比量取原材料,并按先后顺序依次加入,然后搅拌均匀:乙醇胺20~35%;没食子酸3.5~6.5%;哌啶0.1~0.3%;PF-154N氟表面活性剂0.005~0.01%;过氧化氢1.0~2.0%;余量为去离子水。
3.硅片损伤层去除
实验用的硅片为金刚线切割的、双面未抛光的p型单晶硅硅片,面积为4×4cm2,厚度为180μm,晶面取向为(100),电阻率为2~5Ω.cm。硅片放入氢氟酸、硝酸与去离子水混合液(浓度为40wt%的HF:68wt%的HNO3:H2O的体积比为1:8:3)中在室温下浸泡3~5min,去除硅片表面损伤层及金刚线划痕。然后用去离子冲洗。
4.硅片制绒
把损伤层去除后的硅片浸泡于乙醇胺–没食子酸–水溶液刻蚀剂中,反应温度为85~90℃,反应时间为10~15min。反应完成后,取出硅片,用去离子水冲洗,最后用氮气吹干。
利用扫描电子显微镜(SEM)观察制绒后硅片表面的形貌,发现其表面已经全部被金字塔形状的微结构覆盖,金字塔的平均尺寸为1~2μm,而且具有很好的均匀性和平整性。利用紫外–可见–近红外分光光度计测量制绒后硅片表面的反射率,测量结果如图1所示。为了对比,利用氢氧化钾–异丙醇–水溶液的常规刻蚀剂对经过同样的损伤层去除以后的金刚线切割单晶硅进行制绒,制绒参数为:制绒液主要由浓度为1.0wt%氢氧化钠、8wt%异丙醇的水溶液组成,温度和时间分别80℃和40min。从图1可以看出,乙醇胺–没食子酸–水溶液制绒以后的硅片在300~1100nm波长范围内的平均反射率为12.56%,而氢氧化钾–异丙醇–水溶液制绒的平均反射率为13.79%。因此,与常规的氢氧化钾–异丙醇–水溶液的常规刻蚀剂相比,利用本实施例提出的乙醇胺–没食子酸–水溶液的制绒后硅片平均反射率要低1.23%,而且制绒时间也已缩短50%左右。
Claims (3)
1.单晶硅的刻蚀液,其特征在于:由如下比例的成分组成:乙醇胺20~35%;没食子酸3.5~6.5%;哌啶0.1~0.3%;含氟表面活性剂0.005~0.01%;过氧化氢1.0~2.0%;去离子水余量。
2.如权利要求1所述的单晶硅的刻蚀液,其特征在于:所述的含氟表面活性剂为PF-154N氟表面活性剂。
3.单晶硅的刻蚀方法,其特征在于:使用权利要求1~2任一项所述的刻蚀液,包括下列步骤:
1)配制权利要求1~2任一项所述的刻蚀液,搅拌混合均匀;
2)取未抛光的p型单晶硅硅片,放入氢氟酸、硝酸与去离子水混合液中,在室温下浸泡3~5min,然后用去离子冲洗;其中,混合液中浓度为40wt%的HF:68wt%的HNO3:H2O的体积比为1:8:3;
3)将步骤2)处理过的硅片浸泡于步骤1)所得的刻蚀液中,反应温度为85~90℃,反应时间为10~15min;反应完成后,取出硅片,用去离子水冲洗,最后用氮气吹干。
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3891735B2 (ja) * | 1998-08-05 | 2007-03-14 | 三星電子株式会社 | アルコキシn−ヒドロキシアルキルアルカンアミドからなるレジスト除去剤、レジスト除去用組成物、これらの製造方法及びこれらを用いたレジスト除去方法 |
CN101812688A (zh) * | 2009-02-19 | 2010-08-25 | 比亚迪股份有限公司 | 一种刻蚀液及刻蚀方法 |
CN102108557A (zh) * | 2011-01-27 | 2011-06-29 | 巨力新能源股份有限公司 | 一种制备单晶硅绒面的方法 |
CN106400017A (zh) * | 2015-08-03 | 2017-02-15 | 三菱瓦斯化学株式会社 | 蚀刻液和使用其的蚀刻方法和使用该蚀刻方法得到的基板 |
CN108411364A (zh) * | 2018-04-03 | 2018-08-17 | 锦州华昌光伏科技有限公司 | 一种低反射率单晶硅的制绒工艺 |
-
2019
- 2019-07-09 CN CN201910614567.0A patent/CN110416074A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3891735B2 (ja) * | 1998-08-05 | 2007-03-14 | 三星電子株式会社 | アルコキシn−ヒドロキシアルキルアルカンアミドからなるレジスト除去剤、レジスト除去用組成物、これらの製造方法及びこれらを用いたレジスト除去方法 |
CN101812688A (zh) * | 2009-02-19 | 2010-08-25 | 比亚迪股份有限公司 | 一种刻蚀液及刻蚀方法 |
CN102108557A (zh) * | 2011-01-27 | 2011-06-29 | 巨力新能源股份有限公司 | 一种制备单晶硅绒面的方法 |
CN106400017A (zh) * | 2015-08-03 | 2017-02-15 | 三菱瓦斯化学株式会社 | 蚀刻液和使用其的蚀刻方法和使用该蚀刻方法得到的基板 |
CN108411364A (zh) * | 2018-04-03 | 2018-08-17 | 锦州华昌光伏科技有限公司 | 一种低反射率单晶硅的制绒工艺 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111876157A (zh) * | 2020-06-30 | 2020-11-03 | 镇江润晶高纯化工科技股份有限公司 | 一种tmah蚀刻液的制备蚀刻方法 |
CN112608799A (zh) * | 2020-12-29 | 2021-04-06 | 广东省科学院化工研究所 | 一种单晶硅片清洗剂及其应用 |
CN112813501A (zh) * | 2020-12-29 | 2021-05-18 | 广东省科学院化工研究所 | 一种单晶硅片制绒添加剂及其应用 |
CN112608799B (zh) * | 2020-12-29 | 2022-05-24 | 广东省科学院化工研究所 | 一种单晶硅片清洗剂及其应用 |
CN112899791A (zh) * | 2021-01-19 | 2021-06-04 | 阎新燕 | 一种金刚线切割单晶硅片用制绒剂及其制备方法 |
CN113980580A (zh) * | 2021-12-24 | 2022-01-28 | 绍兴拓邦电子科技有限公司 | 一种单晶硅片的碱刻蚀抛光方法 |
CN113980580B (zh) * | 2021-12-24 | 2022-04-08 | 绍兴拓邦新能源股份有限公司 | 一种单晶硅片的碱刻蚀抛光方法 |
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