CN110372392A - 一种陶瓷基板的烧结方法 - Google Patents

一种陶瓷基板的烧结方法 Download PDF

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CN110372392A
CN110372392A CN201910589029.0A CN201910589029A CN110372392A CN 110372392 A CN110372392 A CN 110372392A CN 201910589029 A CN201910589029 A CN 201910589029A CN 110372392 A CN110372392 A CN 110372392A
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sintering
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彭海
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Wuxi Yuan Nuclear Microelectronics LLC
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Abstract

本发明公开了一种陶瓷基板的烧结方法，其特征在于，包括(1)混料：按重量份数计，取陶瓷粉末放入磨筒中研磨成浆料，然后加入1份分散剂，15～20份烧结助剂，得到混合料、(2)制作陶瓷坯片：通过流延的方法制得陶瓷坯片、(3)制作生坯组、(4)排胶去粘、(5)二次烧结成型、(6)降温取物，通过在将陶瓷基板进行在烧结炉中经过一次低温烧结后，然后将炉内温度上升到指定温度后进行二次烧结，两次烧结材料生长完全、结晶性好，再次高温烧结粒度增大，同时也可修饰表面形貌、降低比表面积、降低金属单质含量，同时也可以略微增大粒子粒度。

Description

一种陶瓷基板的烧结方法
技术领域：
本发明涉及陶瓷加工技术领域，特别涉及一种陶瓷基板的烧结方法。
背景技术：
陶瓷是陶器和瓷器的总称。人们早在约8000年前的新石器时代就发明了陶器。常见的陶瓷材料有粘土、氧化铝、高岭土等。陶瓷材料一般硬度较高，但可塑性较差。除了使用于食器、装饰上外，陶瓷在科学、技术的发展中亦扮演着重要角色。陶瓷原料是地球原有的大量资源黏土经过淬取而成，陶瓷基板是指铜箔在高温下直接键合到氧化铝或氮化铝陶瓷基片表面上的特殊工艺板，所制成的超薄复合基板具有优良电绝缘性能，高导热特性，优异的软钎焊性和高的附着强度，并可像PCB板一样能刻蚀出各种图形，具有很大的载流能力。因此，陶瓷基板已成为大功率电力电子电路结构技术和互连技术的基础材料。
但是在目前的陶瓷基板烧结过程中，烧结温度一直是基本不动的，从烧结开始至烧结结束一直是恒温的，这种情况下，陶瓷的材料内部会有晶格缺陷，使得陶瓷基板在后期烧结完成后使用效果降低。
发明内容：
本发明的目的就在于为了解决上述问题而提供一种陶瓷基板的烧结方法，解决了现有技术存在的不足。
为了解决上述问题，本发明提供了一种技术方案：
一种陶瓷基板的烧结方法，包括如下步骤：
(1)混料：按重量份数计，取陶瓷粉末放入磨筒中研磨成浆料，然后加入1份分散剂，15～20份烧结助剂，得到混合料；
(2)制作陶瓷坯片：通过流延的方法制得陶瓷坯片；
(3)制作生坯组：将5-8片陶瓷坯片直接堆叠，放入密封袋真空包装，在等静压机进行层压，获得5-8层堆叠的陶瓷生坯组；将5-8层堆叠的陶瓷生坯组进行冲孔、用填孔导体浆料填孔，在5-8层堆叠的陶瓷生坯组的顶面和底面分别用印刷导体浆料印刷电路图形，然后在自动成型压机上模压成型，获得待烧陶瓷生坯组；
(4)排胶去粘：将待烧陶瓷生坯组放入排胶炉中进行两步排胶去粘；获得烧结中间过渡体；
(5)二次烧结成型：将陶瓷中间过渡体放置烧结炉中，陶瓷中间过渡体在烧结炉中先通过低温进行一次烧结，然后对烧结炉进行升温，使得陶瓷中间过渡体在烧结炉上升到指定温度后进行二次烧结；
(6)降温取物：两次烧结完成后，将烧结炉降温，当温度低于100℃后，取出烧结物，即可获得共烧陶瓷基板。
作为优选，所述陶瓷粉末的组成成分为：氮化铝50～64份、氮化硼30～40份、氧化铍10～20份、氧化铝30～40份、石墨烯纳米颗粒2～4份、氟化钙5～15份、羟甲基纤维素3～6份、去离子水15～20份、硅粉5～10份、增塑剂1份、粘结剂1份。
作为优选，所述陶瓷坯片的厚度应控制在0.5mm以下。
作为优选，所述分散剂的成分聚异丁烯多丁二酰亚胺类无灰添加剂。
作为优选，所述烧结助剂的成分为CaO、MgO的混合物。
作为优选，所述降温取物(6)的过程中，降温速率为10-15℃/min、气流量为300-4500NL/min。
本发明的有益效果：通过在将陶瓷基板进行在烧结炉中经过一次低温烧结后，然后将炉内温度上升到指定温度后进行二次烧结，两次烧结材料生长完全、结晶性好，再次高温烧结粒度增大，同时也可修饰表面形貌、降低比表面积、降低金属单质含量，同时也可以略微增大粒子粒度。
具体实施方式：
本具体实施方式采用以下技术方案：一种陶瓷基板的烧结方法，包括如下步骤：
(1)混料：按重量份数计，取陶瓷粉末放入磨筒中研磨成浆料，然后加入1份分散剂，15～20份烧结助剂，得到混合料；
(2)制作陶瓷坯片：通过流延的方法制得陶瓷坯片；
(3)制作生坯组：将5-8片陶瓷坯片直接堆叠，放入密封袋真空包装，在等静压机进行层压，获得5-8层堆叠的陶瓷生坯组；将5-8层堆叠的陶瓷生坯组进行冲孔、用填孔导体浆料填孔，在5-8层堆叠的陶瓷生坯组的顶面和底面分别用印刷导体浆料印刷电路图形，然后在自动成型压机上模压成型，获得待烧陶瓷生坯组；
(4)排胶去粘：将待烧陶瓷生坯组放入排胶炉中进行两步排胶去粘；获得烧结中间过渡体；
(5)二次烧结成型：将陶瓷中间过渡体放置烧结炉中，陶瓷中间过渡体在烧结炉中先通过低温进行一次烧结，然后对烧结炉进行升温，使得陶瓷中间过渡体在烧结炉上升到指定温度后进行二次烧结；
(6)降温取物：两次烧结完成后，将烧结炉降温，当温度低于100℃后，取出烧结物，即可获得共烧陶瓷基板。
其中，所述陶瓷粉末的组成成分为：氮化铝50～64份、氮化硼30～40份、氧化铍10～20份、氧化铝30～40份、石墨烯纳米颗粒2～4份、氟化钙5～15份、羟甲基纤维素3～6份、去离子水15～20份、硅粉5～10份、增塑剂1份、粘结剂1份。
其中，所述陶瓷坯片的厚度应控制在0.5mm以下。
其中，所述分散剂的成分聚异丁烯多丁二酰亚胺类无灰添加剂。
其中，所述烧结助剂的成分为CaO、MgO的混合物。
其中，所述降温取物(6)的过程中，降温速率为10-15℃/min、气流量为300-4500NL/min。
本发明的有益效果：通过在将陶瓷基板进行在烧结炉中经过一次低温烧结后，然后将炉内温度上升到指定温度后进行二次烧结，两次烧结材料生长完全、结晶性好，再次高温烧结粒度增大，同时也可修饰表面形貌、降低比表面积、降低金属单质含量，同时也可以略微增大粒子粒度。
以上显示和描述了本发明的基本原理和主要特征和本发明的优点，本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是说明本发明的原理，在不脱离本发明精神和范围的前提下，本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明范围内，本发明要求保护范围。

Claims (6)

1.一种陶瓷基板的烧结方法，其特征在于，包括如下步骤：
(1)混料：按重量份数计，取陶瓷粉末放入磨筒中研磨成浆料，然后加入1份分散剂，15～20份烧结助剂，得到混合料；
(2)制作陶瓷坯片：通过流延的方法制得陶瓷坯片；
(3)制作生坯组：将5-8片陶瓷坯片直接堆叠，放入密封袋真空包装，在等静压机进行层压，获得5-8层堆叠的陶瓷生坯组；将5-8层堆叠的陶瓷生坯组进行冲孔、用填孔导体浆料填孔，在5-8层堆叠的陶瓷生坯组的顶面和底面分别用印刷导体浆料印刷电路图形，然后在自动成型压机上模压成型，获得待烧陶瓷生坯组；
(4)排胶去粘：将待烧陶瓷生坯组放入排胶炉中进行两步排胶去粘；获得烧结中间过渡体；
(5)二次烧结成型：将陶瓷中间过渡体放置烧结炉中，陶瓷中间过渡体在烧结炉中先通过低温进行一次烧结，然后对烧结炉进行升温，使得陶瓷中间过渡体在烧结炉上升到指定温度后进行二次烧结；
(6)降温取物：两次烧结完成后，将烧结炉降温，当温度低于100℃后，取出烧结物，即可获得共烧陶瓷基板。
2.根据权利要求1所述的一种陶瓷基板的烧结方法，其特征在于：陶瓷粉末的组成成分为：氮化铝50～64份、氮化硼30～40份、氧化铍10～20份、氧化铝30～40份、石墨烯纳米颗粒2～4份、氟化钙5～15份、羟甲基纤维素3～6份、去离子水15～20份、硅粉5～10份、增塑剂1份、粘结剂1份。
3.根据权利要求1所述的一种陶瓷基板的烧结方法，其特征在于：陶瓷坯片的厚度应控制在0.5mm以下。
4.根据权利要求1所述的一种陶瓷基板的烧结方法，其特征在于：分散剂的成分聚异丁烯多丁二酰亚胺类无灰添加剂。
5.根据权利要求1所述的一种陶瓷基板的烧结方法，其特征在于：烧结助剂的成分为CaO、MgO的混合物。
6.根据权利要求1所述的一种陶瓷基板的烧结方法，其特征在于：其特征在于：降温取物(6)的过程中，降温速率为10-15℃/min、气流量为300-4500NL/min。
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