CN1103351A - 制造塑料制品的方法和设备 - Google Patents
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Abstract
一种用废料制造塑料制品的方法和设备,它通过
将损耗因素高于0.005,对射频辐射有高吸收性能的
热塑性塑料切割成碎片;将这些碎片与至少一种其它
的材料颗粒混合;把上述混合物堆放在支承表面上;
以及在该混合物上照射射频辐射,其照射量大致足以
通过电介质加热,使热塑性塑料碎片的外表面软化,
与此同时,向混合物施加压力,以便用烧结的方式使
混合物粘结在一起。
Description
本发明涉及生产塑料制品的方法和设备,特别是,本发明可用于废塑料的回收,因此,本说明书将在下文中就此进行说明。
日常生活中塑料使用的增加,产生了严重的处理塑料的问题,这是因为大部分类型的塑料分解起来都很困难。为了缓解废物处理和环境污染问题,而且也为了减少对塑料的原始材料和其它原料(如,木材)在生产各种产品时的需求量,从而降低上述产品的成本,人们一直在不断努力研制回收废塑料的方法。
本发明的一个目的是提供制造塑料制品的一种方法,它包括:将损耗因数高于0.005的热塑性塑料,例如对射频辐射有高吸收性能的热塑性塑料,切割成碎片,所切割成的碎片的大部分在其最大尺寸方向的大小为2-10mm;将这些热塑性塑料碎片与至少一种其它粒状物料混合;将这些混合物堆放于支承表面上;用射频辐射照射混合物,通过电介质加热主要使这些热塑性塑料碎片的外表面软化;同时,向混合物施加压力,用烧结的方式使混合物粘结在一起。
一种材料的“损耗因数”的定义是:材料的功率因数乘以电介常数,它决定了在射频辐射状态下材料中产生的热量的多少。一种特别适用的材料是聚乙烯塑料。它的损耗因数在0.0054到0.32的范围内,其它可应用的高损耗因数材料有:丙烯酸类树酯,它们的损耗因数在0.056到0.1范围内;还有各种聚碳酸酯,它们的损耗因数大约可达0.009。
上述混合物中还可以包括一种有机塑料,其损耗因数低于0.005,也就是对射频辐射的吸收能力较低。这后一种材料也被切割成碎片,这些碎片的大部分在最大尺寸方向的大小为2-10mm,上述其它材料的例子有:损耗因数为0.00046-0.00072的聚乙烯,损耗因数为0.00025的聚苯乙烯,以及损耗因数约为0.00085的聚丙烯。混合物中吸收射频辐射的能力较低的材料也是热塑性塑料,由于在射频辐射吸收能力高的材料内所产生的热量,它的外表面也被软化了。增添的对射频辐射吸收能力低的材料也可以是热固性材料,在这种情况下,已被软化的热塑性塑料起粘结剂的作用,将热固性塑料碎片粘结在一起。
因此,本发明的方法就能通过烧结各种不同的废塑料的混合物,制造出坚固的固体制品,而这些不同的废塑料在熔融和混合在一起时,可能是互不相容的。上述混合物中也可以含有各种可能存在于废塑料中,而要清除它们需要很高费用的其它材料(例如:石子,金属,木头,纸,玻璃等等)。因此,这样一种方法特别适用于回收多种不同类型的废塑料。
本发明的另一个目的,是提供一种制造塑料制品的设备,这种设备也特别适用于塑料的回收,它包括:一个沿设备长度方向延伸的工作台;在工作台上方沿长度方向运动的第一传送带;位于第一传送带的上方,与它成一个角度,并且在同一个方向一起运动的第二传送带,上述角度使第二传送带从第一传送带的一端汇合到其相反的另一端;以及许多对沿着两条传送带的长度方向上隔开间距,并夹着两条传送带的射频电极。
本发明更进一步的特点及优点将从下文的描述中清楚地表现出来。下面参照附图,作为一个例子,详细描述本发明。附图中:
图1是用图解来说明的一种根据本发明的回收塑料的设备;
图2表示根据本发明的回收塑料的分阶段方法;
图3是用图解来说明的另一种根据本发明的回收塑料的设备;
图4是图3中的设备的局部放大图;
图5说明在图3、图4的设备中使用的一种射频电极。
图1所示的设备包括:一条位于工作台8上方,由滚筒4,6驱动的循环传送带2。回收的塑料可以是从各种来源获取的未经捡选的废料,但必须至少含有一种损耗因数大于0.005,具有较高的吸收射频辐射性能的热塑性塑料。
废塑料切割成许多种大小不同碎片,大部分碎片在最大尺寸方向上的大小为2mm-10mm。切碎的碎片混合在一起,并经三个料斗10、12、14供给在工作台8上方运行的传送带2。在第二层碎片经第二料斗12供入以前,经料斗10供入的混合物由压实滚子16把它在传送带2上压实成第一层。而在第从第三料斗14供入混合物,在第二层上形成第三层之前,由料斗12供入的混合物被第二压实滚子18在第一层上压实。然后,传送带2上的三层混合物穿过盖在传送带2上方的压力滚子20和在传送带与支承着传送带的工作台8下方的射频加热装置22之间。或者换一种方式,射频加热可以由一对射频电极实施,这一对电极夹着传送带和紧靠在压力滚子2的前面的混合物。
射频加热装置22通过电介质加热主要使混合物加热到足以使热塑性塑料碎片的外表面软化的程度。压力滚子2对着在工作台8上运行的传送带,将塑料碎片压在一起,从而将塑料碎片粘结成为连续的塑料板。
图1中的设备还包括位于已加工好的塑料板上方的切断刀24。该切断刀24随着塑料板从设备上送出,由驱动装置26驱动,并由一速度传感器28使它与塑料板同步,以便将其切断成需要的任意长度。
堆放在传送带上的混合料至少包含一种损耗因数高于0.005,从而对射频辐射具有高吸收性能的热塑性塑料碎片。混合物最好还另外包含至少一种损耗因数低于0.005,从而对射频辐射具有低吸收性能的有机塑料。
例如,这些塑料可以是包含有切割成碎片的硬质聚氯乙烯、聚乙烯、聚苯乙烯和/或聚碳酸酯等的废料,而这些碎片的尺寸大部分在2-10mm之间;射频加热装置22可以在射频范围内工作,例如13.56MHZ或27.12MHZ,或在微波范围内工作,例如,915或2450MHZ。这种频率应能借助于电介质加热把塑料碎片加热到110°-200℃,主要是使这些碎片的外表面软化。压实滚子22施加压力的范围为0.5-3KGm/cm2。
下面是图1所示设备中使用的塑料碎片混合物的一个例子(列出各组成分的重量含量比例):
聚氯乙烯(硬质的) 33%
聚乙烯 33%
聚苯乙烯 28%
聚碳酸酯 6%
混合物还可以包含对射频辐射具有高吸收性能的无机材料的颗粒。为达到这种目的,最有用的材料是硅酸铝。由于这种材料能高效地吸收射频辐射,所以能把热能高度集中在塑料碎片的交界面上。当用硅酸铝时,它在混合物中的重量比例最好是0.5-5.0%。下面是另一个含有硅酸铝的混合物的例子。
聚氯乙烯(硬质的) 32%
聚乙烯 32%
聚苯乙烯 27%
聚碳酸酯 6%
硅酸铝 3%
混合物还可以含有其它的添加剂,例如某种液态材料,加热后,它就聚合起来将塑料碎片粘结在一起。这种粘结材料的一个例子是一种环氧树脂单体,它能很容易地涂布或湿润塑料碎片的外表面,在室温下或加热到50-100℃温度时,它就聚合,将切割成的碎片粘结在一起。所用的液态粘合剂也可以是具有较低熔融点的(例如,120℃)的热塑性树脂,这样,当它被加热时,它就熔融,并很容易地湿润切碎的塑料碎片,而当混合物冷却后,就将混合物粘结在一起。
很明显,用图1所示的设备制造出来的板,它的外表层的一面或两面可以用新塑料在现场烧结成比较薄的一层,或者使用预制好的薄板,而用回收的塑料(例如,上述组成中的一种)作为一层或多层比较厚的中间层。在这种结构中,最后制成的层叠板,虽然相当大的一部分,甚至大部分实际上是用回收的废塑料制成的,但却具有新塑料的外观。此外,薄金属箔或木片(胶合板),也可以取代塑料板或薄膜制作外表层。
图2描绘了一种方法,其中,一种或多种类型的上述被回收的塑料的混合物被切成碎片,在一个用射频辐射能够穿透的材料制成的模具204内,在予制好的塑料板202上面堆放成夹层200的形状。接着,把另一片予制好的塑料板206放置在塑料碎片层200上面,然后合上打开的模具的顶板208。组装好的组件用射频辐射加热,主要使塑料碎片200的外表面软化,也使两块塑料板202和206的内表面软化。在两块模板204的208之间加压,将前述各种塑料粘结成一整块板,或者形状比较平坦的固态制品。
这样,如此制成的板就具有塑料的外观,因为它的一个或两个外表面都是用新塑料制成的。然而,它体积中的大部分却是用再生塑料制成的。在有些情况下,可用金属箔或薄木板层代替塑料制作其一个或两个外表面。
图3-5表示可以采用的设备的另一种形式。如图3所示,该设备包括沿设备纵向延伸的工作台300;沿工作台纵向运动的第一循环传送带301;位于传送带301上方与其对齐并一起运动的第二循环传送带302。传送带302与传送带301成一个角度,这个角度使传送带302在设备的进口端303处与传送带301离开一个距离,而在设备的出口端304处与传送带301汇合,同时,在传送带302与传送带301之间仍隔开一个距离,此距离等于用该设备制造的板的厚度。
塑料混合物借助于精确的称量给料器或其它给料器经一个或多个料斗305堆放在传送带301上,每个料斗都装备有一个压实滚子306。如有需要,可分别通过供料滚子309、310把预制好的板307、308铺在已经堆放在传送带301上的材料的相对两面。
沿两条传送带长度方向纵向隔开分布的多对射频电极311-316,夹着两条传送带301,302,这样,如图4所示,成对电极311包括位于下传送带301下方并与其接触的下部电极311a,和位于上传送带302上方并与其接触的上部电极311b。这些电极确定了上传送带302相对于下传送带301所形成的收敛角。制作传送带的材料必须坚固,柔软易弯,电绝缘,并且能够透过射频辐射。传送带301,302最好用低介电常数包履的玻璃纤维材料,例如,聚四氟乙烯包覆的玻璃纤维制作。
为了减少电极板(如,311a,311b)和传送带301,302之间的摩擦,所有的电极板上最好都开有许多开口,如图5中320所示,这些开口与压缩空气源相连,以便在电极与传送带之间形成薄薄的空气垫(厚度最好小于0.1mm)。图3中用示意方式以317表示压缩空气源,以318-320表示将压缩空气导至射频电极311-3116的导管。
图3还示意地表示出六对电极311~316相应的六个射频发生器321-326。最好每个射频发生器具有最大为50KW的输出功率。它们在供电后,可产生所需的温度分布情况,例如当设备上被加热的混合物从入口端303移动到出口端304时,逐步提高混合物温度。例如,可以控制上述射频发生器,使它在进口端303处把混合物加热到20℃而在出口端304处使混合物达到最高温度120℃-180℃,这个温度足以软化吸收射频辐射性能高的塑料(例如,聚氯乙烯)碎片的外表面。上传送带301在其出口处施加的压力最好在0.3~1.2kg/cm2之间,这个压力足以用烧结的方式将软化的颗粒和混合物的其它组分粘结在一起。
Claims (11)
1、一种制造塑料制品的方法,它包括下列步骤:
将损耗因数高于0.005,例如,对射频辐射具有高吸收性能的热塑性塑料切割成碎片,所切割成的碎片的大部分在其最大尺寸方向的大小为2-10mm;
将上述热塑性塑料碎片与至少一种其它粒状物料混合;
将上述混合物堆放在支承表面上;
用射频辐射照射混合物,通过电介质加热,主要使上述热塑性塑料碎片的外表面软化;
同时,向混合物施加压力,用烧结的方式使混合物粘结在一起。
2、如权利要求1所述的方法,其特征在于,上述至少一种其它材料是损耗因数低于0.005,因而对射频辐射的吸收性能低的有机塑料,并且,这些有机塑料也被切成碎片,其中大部分碎片在最大尺寸方向的大小为2-10mm。
3、如权利要求1或权利要求2所述的方法,其特征在于,上述混合物还包含一种具有高射频辐射吸收性能的无机材料颗粒。
4、如权利要求3所述的方法,其特征在于,上述无机材料颗粒是硅酸铝颗粒。
5、如权利要求1至4中任一项所述的方法,其特征在于,上述混合物在用上述射频辐射加热前,在上述支承表面上堆放成许多层。
6、如权利要求1至5中任一项所述的方法,其特征在于上述混合物堆放于在工作台上沿长度方向运动的第一传送带的支承表面上,并且,当上述混合物用上述射频辐射加热时,用一条第二传送带对上述混合物施加压力,第二传送带在上述第一传送带上方,和它成一个角度,并且和它对齐,一起运动,上述角度把这两条传送带从第一传送带的把混合物堆放在它上面的一端汇合到第一传送带的相反的一端。
7、如权利要求6所述的方法,其特征在于,上述射频辐射由许多对夹着上述两条传送带以及在传送带上加热的混合物的射频电极提供,上述许多对射频电极沿两条传送带的长度方向隔开距离,并且,当混合物从上述第一传送带的一端移动到相对应的另一端时,通以电流,按照预定的温度分布曲线,逐渐提高被加热的混合物的温度。
8、如权利要求7所述的方法,其特征在于,压缩空气经过上述射频电极上的开口输入,以便在各电极和两条传送带之间产生薄的空气垫。
9、一种制造塑料制品的设备,它包括:一个沿设备纵向延伸的工作台;一条在上述工作台上沿纵向运动的第一传送带;一条与第一传送带一起运动,和它对齐的第二传送带,两条传送带成一个角度,使第二传送带从第一传送带的一端汇合到相反的另一端;以及许多对沿两条传送带长度方向隔开距离,并且夹着上述两条传送带的射频电极。
10、如权利要求9所述的设备,其特征在于,上述射频电极上开有许多开口,并与压缩空气源相联,以便在电极与两条传送带之间产生薄薄的空气垫。
11、一种烧结的塑料制品,它包括对射频辐射具有高吸收性能的有机塑料碎片,其中至少混合一种其它的材料,并且是按照权利要求1-8中任何一种方法制造的。
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IL106,460 | 1993-07-23 | ||
IL10646093A IL106460A (en) | 1993-07-23 | 1993-07-23 | Method of recycling plastic materials |
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CN1103351A true CN1103351A (zh) | 1995-06-07 |
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US (1) | US5589260A (zh) |
EP (1) | EP0638404A1 (zh) |
JP (1) | JPH07148735A (zh) |
CN (1) | CN1103351A (zh) |
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- 1993-07-23 IL IL10646093A patent/IL106460A/xx not_active IP Right Cessation
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1994
- 1994-07-19 US US08/277,184 patent/US5589260A/en not_active Expired - Fee Related
- 1994-07-21 EP EP19940111403 patent/EP0638404A1/en not_active Withdrawn
- 1994-07-22 JP JP17126294A patent/JPH07148735A/ja active Pending
- 1994-07-22 CN CN94107458A patent/CN1103351A/zh active Pending
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IL106460A (en) | 1997-09-30 |
EP0638404A1 (en) | 1995-02-15 |
US5589260A (en) | 1996-12-31 |
JPH07148735A (ja) | 1995-06-13 |
IL106460A0 (en) | 1993-11-15 |
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