CN110334045A - Expansible multiplex roles industrial control computer mainboard - Google Patents

Expansible multiplex roles industrial control computer mainboard Download PDF

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Publication number
CN110334045A
CN110334045A CN201910507636.8A CN201910507636A CN110334045A CN 110334045 A CN110334045 A CN 110334045A CN 201910507636 A CN201910507636 A CN 201910507636A CN 110334045 A CN110334045 A CN 110334045A
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China
Prior art keywords
pcie
bus
control module
platform management
management control
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Granted
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CN201910507636.8A
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Chinese (zh)
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CN110334045B (en
Inventor
刘春�
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Shanghai Changfeng Bizhuo Electronic Technology Co ltd
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Suzhou British Betty Electronic Technology Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
    • G06F13/4204—Bus transfer protocol, e.g. handshake; Synchronisation on a parallel bus
    • G06F13/4221—Bus transfer protocol, e.g. handshake; Synchronisation on a parallel bus being an input/output bus, e.g. ISA bus, EISA bus, PCI bus, SCSI bus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Abstract

The present invention discloses a kind of expansible multiplex roles industrial control computer mainboard, its central data processor is connected with the 5th VPX connector, described PCIE/SRIO protocol translation module one end is connected to the first VPX connector by SRIO bus, one SPI Flash is bi-directionally connected by spi bus and platform management control module, BIOS of this SPI Flash for storing initial peripheral components is instructed, and the gigabit networking processing chip other end is connected with RJ45 socket and the 4th VPX connector；Switching switch is provided between CRT monitor and platform management control module, total port of the PCIE splitter is bi-directionally connected with central data processor by PCIE bus, and the first point of port and second point of port of the PCIE splitter pass through PCIE bus and be connected to the 2nd VPX connector.Single, the limited defect of interface that the present invention overcomes existing main board functions, realizes multi-functional, multiplex roles, facilitates the function of extended products, realizes compatible with the product of numerous standards of industry.

Description

Expansible multiplex roles industrial control computer mainboard
Technical field
The present invention relates to a kind of expansible multiplex roles industrial control computer mainboards, belong to digital information processing system technical field.
Background technique
Industrial control computer is a kind of using bus structures, is carried out to production process and its electromechanical equipment, technological equipment The tool general name of Detection & Controling, it has important computer attribute and feature, and the main component inside industrial computer is just It is multifunctional industrial controller mainboard.The rich interface of industrial control mainboard, it is many kinds of.A industrial master board is divided into two parts, First is that high-speed core plate part, second is that peripheral interface expansion.But a kind of multifunctional industrial controller mainboard is developed, because For the design for involving core board, the R&D cycle needed is very long, and risk is very high.
Summary of the invention
It is an object of the present invention to provide a kind of expansible multiplex roles industrial control computer mainboard, the expansible multiplex roles industrial control computer mainboards gram It has taken that existing main board function is single, the limited defect of interface, has realized multi-functional, multiplex roles, expansible, facilitate extended products Function is realized and is compatible with the product of numerous standards of industry, has industry standard interface abundant.
In order to achieve the above objectives, the technical solution adopted by the present invention is that: a kind of expansible multiplex roles industrial control computer mainboard, including Central data processor, platform management control module, EC embedded controller, PCIE/SRIO protocol translation module, PCI/PCIE Protocol translation module, gigabit networking processing chip, on-board hard disk, CRT monitor, PCIE splitter and central data processor The memory on board and DDI memory expansion interface unit being bi-directionally connected, the central data processor are used for data processing, the platform Management control module is used to control the input-output operation of peripheral components, and the EC embedded controller is responsible in control mainboard Power supply and switching on and shutting down timing, the PCIE/SRIO protocol translation module are converted for PCIE protocol data and SRIO protocol data, The PCI/PCIE protocol translation module is converted for PCI protocol data and PCIE protocol data, and the gigabit networking handles core Piece is used for improve data transfer bandwidth and network speed, and the memory on board is used to store the intermediate data in CPU treatment process, described DDI memory expansion interface unit is for patching memory bar to exented memory capacity；
It is bi-directionally connected between the central data processor, platform management control module by DMI bus, at the central data Reason device, PCIE/SRIO protocol translation module are bi-directionally connected between one end by PCIE bus, the platform management control module, PCI/ PCIE protocol translation module is bi-directionally connected between one end by PCIE bus, the platform management control module, kilomega network Network processing chip one end between is bi-directionally connected by PCIE bus, the EC embedded controller, platform management control module it Between be bi-directionally connected by lpc bus, the on-board hard disk is connected to platform management control module；
The central data processor is connected with the 5th VPX connector, and described PCIE/SRIO protocol translation module one end passes through SRIO bus is connected to the first VPX connector, and a SPI Flash is bi-directionally connected by spi bus and platform management control module, this BIOS of the SPI Flash for storing initial peripheral components is instructed, and the gigabit networking processing chip other end is connected with RJ45 Socket and the 4th VPX connector, the PCI/PCIE protocol translation module other end are connected with PMC connector；
Switching switch, total end of the PCIE splitter are provided between the CRT monitor and platform management control module Mouth is bi-directionally connected with central data processor by PCIE bus, the first point of port and second point of port of the PCIE splitter The 2nd VPX connector is connected to by PCIE bus, the third of the PCIE splitter divides port to pass through PCIE bus and one XMC connector is bi-directionally connected, and the platform management control module is connected to the 6th VPX connector by HDA protocol bus；
The circuit board further comprises insulation cured plate, upper copper foil pattern layer and lower copper foil pattern layer, the insulation cured plate There is upper insulation adhesive layer between upper copper foil pattern layer, there is lower insulation between the insulation cured plate and lower copper foil pattern layer Adhesive layer, the insulation cured plate are built-in with several spaced metal long blocks, this metal long block both ends exposes absolutely The side end face of edge cured plate is provided with the long through-hole of at least one perforation metal long block, the insulation cured plate in the metal long block Several vertical through hole are provided with, there is conductive column in this vertical through hole, this conductive column upper end is conducted with upper copper foil pattern layer, this Conductive column lower end is conducted with lower copper foil pattern layer, and the conductive column insulate cured plate area between adjacent 2 metal long blocks Domain.
Further improved scheme is as follows in above-mentioned technical proposal:
1. in above scheme, a preposition USB joint one end is connected to the platform management control module, this preposition USB joint The other end is connected with USB jack.
2. in above scheme, a keyboard and mouse interface are connected to the EC embedded controller.
Since above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art:
1. the expansible multiplex roles industrial control computer mainboard of the present invention, single, the limited defect of interface which overcome existing main board functions, Multi-functional, multiplex roles are realized, the function of extended products is facilitated, realizes and is compatible with the product of numerous standards of industry, had Industry standard interface abundant substantially meets a variety of demand of user, reduces design risk, shortens research and development week Phase.
2. the expansible multiplex roles industrial control computer mainboard of the present invention, insulation cured plate is built-in with several spaced gold Belong to long block, this metal long block both ends exposes the side end face of insulation cured plate, and at least one perforation is provided in the metal long block The long through-hole of metal long block, the conductive column insulate cured plate region between adjacent 2 metal long blocks, and metal long block can be fast Speed absorbs the heat that mainboard generates, and the long through-hole of at least one perforation metal long block is provided in metal long block, is also beneficial to come from The heat of communication mainboard quickly transmits, and the air-flow for being conducive to insulate in cured plate quickly flows, so that more heats are taken out of, To be conducive to improve the service life of device, the reliability of product is improved, cured plate is provided with several and hangs down secondly, it insulate Clear opening has conductive column in this vertical through hole, this conductive column upper end is conducted with upper copper foil pattern layer, this conductive column lower end and Lower copper foil pattern layer conducts, and has both improved the density of device layout, is conducive to control panel and further reduces volume, also avoids The short circuit etc. of circuit, improves electrical reliability.
Detailed description of the invention
Attached drawing 1 is the expansible multiplex roles industrial control computer mainboard structural schematic diagram of the present invention；
The partial structural diagram of 2 attached drawing 1 of attached drawing；
Board structure of circuit schematic diagrames in the mainboard of the present invention of attached drawing 3；
Attached drawing 4 is the partial structural diagram of attached drawing 1.
In the figures above: 1, central data processor；2, platform management control module；3, EC embedded controller；4, PCIE/SRIO protocol translation module；5, PCI/PCIE protocol translation module；6, gigabit networking handles chip；7, on-board hard disk；8, Memory on board；9, DDI memory expansion interface unit；101, the first VPX connector；102, the 2nd VPX connector；104, the 4th VPX Connector；105, the 5th VPX connector；106, the 6th VPX connector；11, SPI Flash；12, RJ45 socket；13, PMC connection Device；14, SATA interface device；15, preposition USB joint；16, USB jack；17, EC flash memory；18, keyboard and mouse interface；19,CRT Display；20, PCIE splitter；21, switching switch；22, XMC connector；23, HDA protocol bus；24, hardware detecting module； 30, circuit board；31, insulate cured plate；32, upper copper foil pattern layer；33, lower copper foil pattern layer；34, upper insulation adhesive layer；35, under Insulate adhesive layer；36, metal long block；37, long through-hole；38, vertical through hole；39, conductive column.
Specific embodiment
The present invention will be further described below with reference to examples:
Embodiment: a kind of expansible multiplex roles industrial control computer mainboard, including central data processor 1, platform management control module 2, EC embedded controller 3, PCIE/SRIO protocol translation module 4, PCI/PCIE protocol translation module 5, gigabit networking handle chip 6, on-board hard disk 7, CRT monitor 19, PCIE splitter 20, the memory on board 8 being bi-directionally connected with central data processor 1 and DDI memory expansion interface unit 9, the central data processor 1 are used for data processing, and the platform management control module 2 is used for The input-output operation for controlling peripheral components, when the EC embedded controller 3 is responsible for power supply and switching on and shutting down in control mainboard Sequence, the PCIE/SRIO protocol translation module 4 are converted for PCIE protocol data and SRIO protocol data, the PCI/PCIE Protocol translation module 5 is converted for PCI protocol data and PCIE protocol data, and the gigabit networking processing chip 6 is for improving Data transfer bandwidth and network speed, the memory on board 8 are used to store the intermediate data in CPU treatment process, and the DDI memory expands Exhibition interface unit 9 is for patching memory bar to exented memory capacity；
It is bi-directionally connected between the central data processor 1, platform management control module 2 by DMI bus, the central data Processor 1, PCIE/SRIO protocol translation module are bi-directionally connected between 4 one end by PCIE bus, and the platform management controls mould Block 2, PCI/ PCIE protocol translation module are bi-directionally connected between 5 one end by PCIE bus, the platform management control module 2, Gigabit networking processing is bi-directionally connected between 6 one end of chip by PCIE bus, the EC embedded controller 3, platform management control It is bi-directionally connected between molding block 2 by lpc bus, the on-board hard disk 7 is connected to platform management control module 2；
The central data processor 1 is connected with the 5th VPX connector 105, and the PCIE/SRIO protocol translation module 4 is another End is connected to the first VPX connector 101 by SRIO bus, and a SPI Flash 11 passes through spi bus and platform management control module 2 are bi-directionally connected, and BIOS of this SPI Flash 11 for storing initial peripheral components is instructed, and the gigabit networking processing chip 6 is another One end is connected with RJ45 socket 12 and the 4th VPX connector 104, and 5 other end of PCI/PCIE protocol translation module is connected with PMC connector 13；
A switching switch 21, the PCIE splitter 20 are provided between the CRT monitor 19 and platform management control module 2 Total port be bi-directionally connected with central data processor 1 by PCIE bus, first point of port of the PCIE splitter 20 and Second point of port passes through PCIE bus and is connected to the 2nd VPX connector 102, and the third of the PCIE splitter 20 divides port logical It crosses PCIE bus to be bi-directionally connected with an XMC connector 22, the platform management control module 2 is connected by HDA protocol bus 23 To the 6th VPX connector 106；
The circuit board 30 further comprises insulation cured plate 31, upper copper foil pattern layer 32 and lower copper foil pattern layer 33, it is described absolutely There is upper insulation adhesive layer 34, the insulation cured plate 31 and lower copper foil pattern between edge cured plate 31 and upper copper foil pattern layer 32 There is lower insulation adhesive layer 35 between layer 33, the insulation cured plate 31 is built-in with several spaced metal long blocks 36, This 36 both ends of metal long block exposes the side end face of insulation cured plate 31, and at least one perforation is provided in the metal long block 36 The long through-hole 37 of metal long block 36, the insulation cured plate 31 are provided with several vertical through hole 38, have in this vertical through hole 38 Conductive column 39, this 29 upper end of conductive column are conducted with upper copper foil pattern layer 32, this 39 lower end of conductive column and lower copper foil pattern layer 33 It conducts, the conductive column 39 insulate 31 region of cured plate between adjacent 2 metal long blocks 36.
The thickness ratio of above-mentioned 31 thickness of insulation cured plate and 36 thickness of metal long block is 10:6.5.
One the 4th VPX connector 104 is connected to the gigabit networking processing chip 6.
One EC flash memory 17 is connected to the EC embedded controller 3, this EC flash memory 17 is used to store the firmware of EC and is responsible for The information timing management powered on.
One keyboard and mouse interface 18 are connected to the EC embedded controller 3.
The number of above-mentioned PCIE/SRIO protocol translation module 4 is 2, this 2 PCIE/SRIO protocol translation modules 4 connect It is connected to the first VPX connector 101.
The number of the PCIE/SRIO protocol translation module 4 is 2, this 2 PCIE/SRIO protocol translation modules 4 connect It is connected to the first VPX connector 101；One EC flash memory 17 is connected to the EC embedded controller 3, this EC flash memory 17 is for storing EC Firmware and be responsible for the information timing management powered on；Insulation 31 thickness of cured plate and the thickness ratio of 36 thickness of metal long block are 10:6.5.
One preposition 15 one end of USB joint is connected to the platform management control module 2, this preposition USB joint 15 it is another End is connected with USB jack 16.
When using above-mentioned expansible multiplex roles industrial control computer mainboard, which overcome existing main board functions is single, interface is limited Defect realizes multi-functional, multiplex roles, facilitates the function of extended products, realizes and is compatible with the product of numerous standards of industry, With industry standard interface abundant, a variety of demand of user is substantially met, design risk is reduced, shortens research and development Period；Secondly, its metal long block can quickly absorb the heat of mainboard generation, it is long that at least one perforation metal is provided in metal long block The long through-hole of block is also beneficial to quickly transmit the heat from communication mainboard, and the air-flow be conducive in metal substrate quickly flows It is dynamic, so that more heats be taken out of, to be conducive to improve the service life of device, the reliability of product is improved, again, Its density for both having improved device layout is conducive to control panel and further reduces volume, also avoids the short circuit etc. of circuit, improves Electrical reliability.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all according to the present invention Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.

Claims (3)

1. a kind of expansible multiplex roles industrial control computer mainboard, it is characterised in that: including circuit board (30), be installed on circuit board (30) Central data processor (1), platform management control module (2), EC embedded controller (3), PCIE/SRIO protocol translation mould Block (4), PCI/PCIE protocol translation module (5), gigabit networking processing chip (6), on-board hard disk (7), CRT monitor (19), PCIE splitter (20), the memory on board (8) being bi-directionally connected with central data processor (1) and DDI memory expansion interface unit (9), the central data processor (1) is used for data processing, and the platform management control module (2) is for controlling peripheral components Input-output operation, the EC embedded controller (3) be responsible for control mainboard on power supply and switching on and shutting down timing, it is described PCIE/SRIO protocol translation module (4) is converted for PCIE protocol data and SRIO protocol data, and the PCI/PCIE agreement turns Change module (5) to convert for PCI protocol data and PCIE protocol data, gigabit networking processing chip (6) is for improving number According to transmission bandwidth and network speed, the memory on board (8) is used to store the intermediate data in CPU treatment process, and the DDI memory expands Exhibition interface unit (9) is for patching memory bar to exented memory capacity；
The central data processor (1), platform management control module are bi-directionally connected between (2) by DMI bus, the center It is bi-directionally connected between data processor (1), PCIE/SRIO protocol translation module (4) one end by PCIE bus, the platform pipe It is bi-directionally connected between reason control module (2), PCI/ PCIE protocol translation module (5) one end by PCIE bus, the platform pipe Reason control module (2), gigabit networking processing are bi-directionally connected between chip (6) one end by PCIE bus, the embedded control of EC Device (3) processed, platform management control module are bi-directionally connected between (2) by lpc bus, and the on-board hard disk (7) is connected to platform Management control module (2)；
The central data processor (1) is connected with the 5th VPX connector (105), the PCIE/SRIO protocol translation module (4) other end is connected to the first VPX connector (101) by SRIO bus, and a SPI Flash (11) passes through spi bus and platform Management control module (2) is bi-directionally connected, and BIOS of this SPI Flash (11) for storing initial peripheral components is instructed, and described thousand Million network processes chip (6) other ends are connected with RJ45 socket (12) and the 4th VPX connector (104), the PCI/PCIE association View conversion module (5) other end is connected with PMC connector (13)；
Switching switch (21) is provided between the CRT monitor (19) and platform management control module (2), the PCIE divides Total port of road device (20) is bi-directionally connected with central data processor (1) by PCIE bus, the PCIE splitter (20) First point of port and second point of port pass through PCIE bus and are connected to the 2nd VPX connector (102), the PCIE splitter (20) third point port is bi-directionally connected by PCIE bus with an XMC connector (22), the platform management control module (2) The 6th VPX connector (106) is connected to by HDA protocol bus (23)；
The circuit board (30) further comprises insulation cured plate (31), upper copper foil pattern layer (32) and lower copper foil pattern layer (33), there is upper insulation adhesive layer (34), the insulation is solid between the insulation cured plate (31) and upper copper foil pattern layer (32) Changing has lower insulation adhesive layer (35) between plate (31) and lower copper foil pattern layer (33), the insulation cured plate (31) is if be built-in with Dry spaced metal long block (36), this metal long block (36) both ends expose the side end face of insulation cured plate (31), The long through-hole (37) of at least one perforation metal long block (36), the insulation cured plate (31) are provided in the metal long block (36) Several vertical through hole (38) are provided with, there are conductive column (39) in this vertical through hole (38), this conductive column (29) upper end and upper copper Foil pattern layer (32) conducts, this conductive column (39) lower end is conducted with lower copper foil pattern layer (33), conductive column (39) position Insulation cured plate (31) region between adjacent 2 metal long blocks (36)；
The number of the PCIE/SRIO protocol translation module (4) is 2, this 2 PCIE/SRIO protocol translation modules (4) connect It is connected to the first VPX connector (101)；One EC flash memory (17) is connected to the EC embedded controller (3), this EC flash memory (17) is used In the firmware for storing EC and it is responsible for the information timing management powered on；Insulation cured plate (31) thickness and metal long block (36) are thick The thickness ratio of degree is 10:6.5.
2. expansible multiplex roles industrial control computer mainboard according to claim 1, it is characterised in that: a preposition USB joint (15) One end is connected to the platform management control module (2), and the other end of this preposition USB joint (15) is connected with USB jack (16).
3. expansible multiplex roles industrial control computer mainboard according to claim 1, it is characterised in that: a keyboard and mouse interface (18) it is connected to the EC embedded controller (3).
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CN110309095B (en) 2021-08-06

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