CN207216497U

CN207216497U - Compact Industry Control mainboard

Info

Publication number: CN207216497U
Application number: CN201721151492.XU
Authority: CN
Inventors: 刘春�
Original assignee: Suzhou British Betty Electronic Technology Co Ltd
Current assignee: Suzhou British Betty Electronic Technology Co Ltd
Priority date: 2017-09-10
Filing date: 2017-09-10
Publication date: 2018-04-10
Anticipated expiration: 2027-09-10

Abstract

The utility model discloses a kind of compact Industry Control mainboard, including circuit board, the central data processor being installed on circuit board, platform management control module, EC embedded controllers, PCIE/SRIO protocol translations module, PCI/PCIE protocol translations module, gigabit networking process chip, on-board hard disk；Circuit board further comprises insulate cured plate, upper copper foil pattern layer and lower copper foil pattern layer, is provided with the long through-hole of at least one insertion metal long block in metal long block, and conductive pole insulate cured plate region between adjacent 2 metal long blocks；A part of module is installed on circuit board upper surface, and another part module is installed on circuit board lower surface.The utility model realizes compatible with the product of numerous standards of industry, be advantageous to quickly transmit the heat from communication mainboard, the air-flow for being advantageous to insulate in cured plate quickly flows, so as to which more heats be taken out of, be advantageous to improve the service life of device, improve the reliability of product.

Description

Compact Industry Control mainboard

Technical field

A kind of compact Industry Control mainboard is the utility model is related to, belongs to digital information processing system technical field.

Background technology

As society requires to improve to industrial equipment using multifarious, industrial equipment is gradually to multifunctional unit and small-sized Change development, the industrial equipment of traditional unification is difficult to meet the needs of modern industrial equipment.Industry Control mainboard is set as industry Standby core, also it is faced with multifunctional integrated challenge.Industrial control computer, it is that one kind uses bus structures, it is right Production process and its electromechanical equipment, technological equipment carry out the instrument general name of Detection ＆ Controling, and it has important computer attribute And feature, the critical piece inside industrial computer is exactly multifunctional industrial controller mainboard.The rich interface of industrial control mainboard, kind Class is various.A industrial master board is divided into two parts, when high-speed core plate part, second, peripheral interface expansion.But Develop a kind of multifunctional industrial controller mainboard because involve the design of core board, it is necessary to R＆D cycle it is very long, wind Danger is very high.

The content of the invention

The utility model purpose is to provide a kind of compact Industry Control mainboard, and the compact Industry Control mainboard overcomes The defects of existing main board function is single, interface is limited, multi-functional, multiplex roles, expansible are realized, facilitate the work(of extended products Can, realize compatible with the product of numerous standards of industry, there is abundant industry standard interface.

To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of compact Industry Control mainboard, including Circuit board, the central data processor being installed on circuit board, platform management control module, EC embedded controllers, PCIE/ SRIO protocol translations module, PCI/PCIE protocol translations module, gigabit networking process chip, on-board hard disk, CRT monitor, PCIE shunts, the memory on board being bi-directionally connected with central data processor and DDI memory expansion interface units, the central data Processor is used for data processing, and the platform management control module is used for the input-output operation for controlling peripheral components, the EC Embedded controller is responsible for power supply and switching on and shutting down sequential in control mainboard, and the PCIE/SRIO protocol translations module is used for PCIE protocol datas are changed with SRIO protocol datas, and the PCI/PCIE protocol translations module is used for PCI protocol datas and PCIE Protocol data is changed, and the gigabit networking process chip is used to improve data transfer bandwidth and network speed, and the memory on board is used for The intermediate data in CPU processing procedures is stored, the DDI memory expansions interface unit is used to patch memory bar so as to which exented memory holds Amount；

The circuit board further comprises insulate cured plate, upper copper foil pattern layer and lower copper foil pattern layer, and the insulation is admittedly Changing has upper insulation adhesive layer between plate and upper copper foil pattern layer, under having between the insulation cured plate and lower copper foil pattern layer Insulate adhesive layer, and the insulation cured plate is built-in with several spaced metal long blocks, and this metal long block both ends is exposed Go out the side end face of cured plate of insulating, the long through-hole of at least one insertion metal long block is provided with the metal long block, the insulation is solid Change plate and be provided with several vertical through hole, there is conductive pole in this vertical through hole, this conductive pole upper end and upper copper foil pattern layer conductance Logical, this conductive pole lower end conducts with lower copper foil pattern layer, and the conductive pole insulate solidification between adjacent 2 metal long blocks Plate region；

The central data processor, platform management control module, EC embedded controllers, PCIE/SRIO protocol translations A part of module is installed on circuit board in module, PCI/PCIE protocol translations module, gigabit networking process chip, PCIE shunts Upper surface, another part module are installed on circuit board lower surface.

Further improved scheme is as follows in above-mentioned technical proposal：

1. in such scheme, the central data processor, platform management control module, EC embedded controllers, PCIE/SRIO protocol translation modules are installed on circuit board upper surface, the PCI/PCIE protocol translations module, gigabit networking processing Chip, PCIE shunts are installed on circuit board lower surface.

2. in such scheme, the long through-hole quantity in the metal long block is 2.

3. in such scheme, the thickness ratio of the insulation solidification plate thickness and metal long block thickness is 10：（5~8）.

Because above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：

1. the utility model compact Industry Control mainboard, which overcome that existing main board function is single, interface is limited lacks Fall into, realize multi-functional, multiplex roles, facilitate the function of extended products, realize, tool compatible with the product of numerous standards of industry There is abundant industry standard interface, substantially meet a variety of demand of user, reduce design risk, shorten research and development week Phase.

2. the utility model compact Industry Control mainboard, its cured plate that insulate is built-in with several spaced gold Belong to long block, this metal long block both ends exposes the side end face of insulation cured plate, and at least one insertion is provided with the metal long block The long through-hole of metal long block, the conductive pole insulate cured plate region between adjacent 2 metal long blocks, and metal long block can be fast Speed absorbs heat caused by mainboard, and the long through-hole of at least one insertion metal long block is provided with metal long block, be also beneficial to by from The heat of communication mainboard quickly transmits, and the air-flow for being advantageous to insulate in cured plate quickly flows, so as to which more heats be taken out of, So as to be advantageous to improve the service life of device, the reliability of product is improved, secondly, its cured plate that insulate is provided with several and hung down Clear opening, there is conductive pole in this vertical through hole, this conductive pole upper end conducts with upper copper foil pattern layer, this conductive pole lower end and Lower copper foil pattern layer conducts, and has both improved the density of device layout, is advantageous to control panel and further reduces volume, it also avoid Short circuit of circuit etc., improve electrical reliability.

Brief description of the drawings

Accompanying drawing 1 is the utility model compact Industry Control mainboard structure schematic diagram；

The partial structural diagram of the accompanying drawing 1 of accompanying drawing 2；

Board structure of circuit schematic diagram in the utility model mainboard of accompanying drawing 3.

In the figures above：1st, central data processor；2nd, platform management control module；3rd, EC embedded controllers；4、 PCIE/SRIO protocol translation modules；5th, PCI/PCIE protocol translations module；6th, gigabit networking process chip；7th, on-board hard disk；8、 Memory on board；9th, DDI memory expansions interface unit；101st, the first VPX connectors；102nd, the 2nd VPX connectors；104th, the 4th VPX Connector；105th, the 5th VPX connectors；106th, the 6th VPX connectors；11st, SPI Flash；12nd, RJ45 sockets；13rd, PMC connections Device；14th, SATA interface device；15th, preposition USB joint；16th, USB；17th, EC flash memories；18th, keyboard and mouse interface；19、CRT Display；20th, PCIE shunts；21st, switching switch；22nd, XMC connectors；23rd, HDA protocol bus；24th, hardware detecting module； 30th, circuit board；31st, insulate cured plate；32nd, upper copper foil pattern layer；33rd, lower copper foil pattern layer；34th, upper insulation adhesive layer；35th, under Insulate adhesive layer；36th, metal long block；37th, long through-hole；38th, vertical through hole；39th, conductive pole.

Embodiment

The utility model is further described with reference to embodiment：

Embodiment 1：A kind of compact Industry Control mainboard, including circuit board 30, the central number that is installed on circuit board 30 According to processor 1, platform management control module 2, EC embedded controllers 3, PCIE/SRIO protocol translations module 4, PCI/PCIE associations Discuss at conversion module 5, gigabit networking process chip 6, on-board hard disk 7, CRT monitor 19, PCIE shunts 20 and central data The memory on board 8 and DDI memory expansions interface unit 9, the central data processor 1 that reason device 1 is bi-directionally connected are used for data processing, The platform management control module 2 is used for the input-output operation for controlling peripheral components, and the EC embedded controllers 3 are responsible for control Power supply and switching on and shutting down sequential on mainboard processed, the PCIE/SRIO protocol translations module 4 are used for PCIE protocol datas and assisted with SRIO Data conversion is discussed, the PCI/PCIE protocol translations module 5 is used for PCI protocol datas and changed with PCIE protocol datas, and described thousand Million network processes chips 6 are used to improve data transfer bandwidth and network speed, and the memory on board 8 is used to store in CPU processing procedures Intermediate data, the DDI memory expansions interface unit 9 is used to patch memory bar so as to exented memory capacity；

It is bi-directionally connected between the central data processor 1, platform management control module 2 by DMI buses, the center Data processor 1, PCIE/SRIO protocol translations module 4 are bi-directionally connected between one end by PCIE buses, the platform management control Molding block 2, PCI/ PCIE protocol translations module 5 are bi-directionally connected between one end by PCIE buses, and the platform management controls mould Block 2, gigabit networking process chip 6 are bi-directionally connected between one end by PCIE buses, the EC embedded controllers 3, platform pipe It is bi-directionally connected between reason control module 2 by lpc bus, the on-board hard disk 7 is connected to platform management control module 2；

The central data processor 1 is connected with the 5th VPX connectors 105, the PCIE/SRIO protocol translations module 4 The other end is connected to the first VPX connectors 101 by SRIO buses, and a SPI Flash 11 is controlled by spi bus and platform management Module 2 is bi-directionally connected, and the BIOS that this SPI Flash 11 is used for storing initial peripheral components is instructed, and the gigabit networking handles core The other end of piece 6 is connected with the VPX connectors 104 of RJ45 sockets 12 and the 4th, and the other end of PCI/PCIE protocol translations module 5 connects It is connected to PMC connectors 13；

Switching switch 21, the PCIE branches are provided between the CRT monitor 19 and platform management control module 2 Total port of device 20 is bi-directionally connected with central data processor 1 by PCIE buses, first point of end of the PCIE shunts 20 Mouth and second point of port are connected to the 2nd VPX connectors 102, the 3rd point of end of the PCIE shunts 20 by PCIE buses Mouth is bi-directionally connected by PCIE buses and an XMC connectors 22, and the platform management control module 2 passes through HDA protocol bus 23 It is connected to the 6th VPX connectors 106；

The circuit board 30 further comprises insulate cured plate 31, upper copper foil pattern layer 32 and lower copper foil pattern layer 33, institute Stating between insulation cured plate 31 and upper copper foil pattern layer 32 has upper insulation adhesive layer 34, the insulation cured plate 31 and lower copper foil There is lower insulation adhesive layer 35, the insulation cured plate 31 is built-in with several spaced metal long blocks between patterned layer 33 36, this both ends of metal long block 36 exposes the side end face of insulation cured plate 31, and being provided with least one in the metal long block 36 passes through The long through-hole 37 of logical metal long block 36, the insulation cured plate 31 are provided with several vertical through hole 38, had in this vertical through hole 38 There is conductive pole 39, this upper end of conductive pole 29 conducts with upper copper foil pattern layer 32, this lower end of conductive pole 39 and lower copper foil pattern layer 33 conduct, and the conductive pole 39 insulate the region of cured plate 31 between adjacent 2 metal long blocks 36；

The central data processor 1, platform management control module 2, EC embedded controllers 3, PCIE/SRIO agreements turn Change a part of module installation in module 4, PCI/PCIE protocol translations module 5, gigabit networking process chip 6, PCIE shunts 20 In the upper surface of circuit board 30, another part module is installed on the lower surface of circuit board 30.

One SATA interface device 14 is connected to the platform management control module 2, and this SATA interface device 14, which is used to connect, to be extended Hard disk.

One preposition one end of USB joint 15 is connected to the platform management control module 2, this preposition USB joint 15 it is another End is connected with USB 16.

One the 4th VPX connectors 104 are connected to the gigabit networking process chip 6.

Above-mentioned EC embedded controllers 3 are also associated with a hardware detecting module 24, and this hardware detecting module 24 is used to monitor The voltage and temperature parameter of all parts.

The thickness ratio of the above-mentioned thickness of insulation cured plate 31 and the thickness of metal long block 36 is 10：7.2.

Embodiment 2：A kind of compact Industry Control mainboard, including circuit board 30, the central number that is installed on circuit board 30 According to processor 1, platform management control module 2, EC embedded controllers 3, PCIE/SRIO protocol translations module 4, PCI/PCIE associations Discuss at conversion module 5, gigabit networking process chip 6, on-board hard disk 7, CRT monitor 19, PCIE shunts 20 and central data The memory on board 8 and DDI memory expansions interface unit 9, the central data processor 1 that reason device 1 is bi-directionally connected are used for data processing, The platform management control module 2 is used for the input-output operation for controlling peripheral components, and the EC embedded controllers 3 are responsible for control Power supply and switching on and shutting down sequential on mainboard processed, the PCIE/SRIO protocol translations module 4 are used for PCIE protocol datas and assisted with SRIO Data conversion is discussed, the PCI/PCIE protocol translations module 5 is used for PCI protocol datas and changed with PCIE protocol datas, and described thousand Million network processes chips 6 are used to improve data transfer bandwidth and network speed, and the memory on board 8 is used to store in CPU processing procedures Intermediate data, the DDI memory expansions interface unit 9 is used to patch memory bar so as to exented memory capacity；

The central data processor 1, platform management control module 2, EC embedded controllers 3, PCIE/SRIO agreements turn Change module 4 and be installed on the upper surface of circuit board 30, the PCI/PCIE protocol translations module 5, gigabit networking process chip 6, PCIE Shunt 20 is installed on the lower surface of circuit board 30.

The thickness ratio of the above-mentioned thickness of insulation cured plate 31 and the thickness of metal long block 36 is 10：6.5.

One EC flash memories 17 are connected to the EC embedded controllers 3, and this EC flash memory 17 is used for the firmware for storing EC and is responsible for Upper electric information timing management.

One keyboard and mouse interface 18 are connected to the EC embedded controllers 3.

The number of above-mentioned PCIE/SRIO protocol translations module 4 is 2, and this 2 PCIE/SRIO protocol translations modules 4 connect It is connected to the first VPX connectors 101.

During using above-mentioned compact Industry Control mainboard, the defects of existing main board function is single, interface is limited is which overcomed, Multi-functional, multiplex roles are realized, facilitate the function of extended products, realize compatible with the product of numerous standards of industry, are had Abundant industry standard interface, a variety of demand of user is substantially met, reduces design risk, shorten research and development week Phase；Secondly, its metal long block can quickly absorb heat caused by mainboard, and at least one insertion metal long block is provided with metal long block Long through-hole, be also beneficial to quickly transmit the heat from communication mainboard, the air-flow be advantageous in metal substrate quickly flows, So as to which more heats be taken out of, so as to be advantageous to improve the service life of device, the reliability of product is improved, again, its Both the density of device layout had been improved, has been advantageous to control panel and further reduces volume, short circuit of circuit etc. has been it also avoid, improves Electrical reliability.

For above-described embodiment only to illustrate technical concepts and features of the present utility model, its object is to allow be familiar with technique Personage can understand content of the present utility model and implement according to this, the scope of protection of the utility model can not be limited with this. All equivalent change or modifications made according to the utility model Spirit Essence, should all cover the scope of protection of the utility model it It is interior.

Claims

A kind of 1. compact Industry Control mainboard, it is characterised in that：Including circuit board（30）, be installed on circuit board（30）On in Entreat data processor（1）, platform management control module（2）, EC embedded controllers（3）, PCIE/SRIO protocol translation modules （4）, PCI/PCIE protocol translation modules（5）, gigabit networking process chip（6）, on-board hard disk（7）, CRT monitor（19）、 PCIE shunts（20）With central data processor（1）The memory on board being bi-directionally connected（8）With DDI memory expansion interface units （9）, the central data processor（1）For data processing, the platform management control module（2）For controlling peripheral components Input-output operation, the EC embedded controllers（3）The power supply and switching on and shutting down sequential being responsible in control mainboard, it is described PCIE/SRIO protocol translation modules（4）Changed for PCIE protocol datas and SRIO protocol datas, the PCI/PCIE agreements turn Change module（5）Changed for PCI protocol datas and PCIE protocol datas, the gigabit networking process chip（6）For improving number According to transmission bandwidth and network speed, the memory on board（8）For storing the intermediate data in CPU processing procedures, the DDI internal memories expand Open up interface unit（9）For patching memory bar so as to exented memory capacity；

The circuit board（30）Further comprise the cured plate that insulate（31）, upper copper foil pattern layer（32）With lower copper foil pattern layer （33）, the insulation cured plate（31）With upper copper foil pattern layer（32）Between there is upper insulation adhesive layer（34）, the insulation is admittedly Change plate（31）With lower copper foil pattern layer（33）Between there is lower insulation adhesive layer（35）, the insulation cured plate（31）If it is built-in with Dry spaced metal long block（36）, this metal long block（36）Both ends expose insulation cured plate（31）Side end face, The metal long block（36）Inside it is provided with least one insertion metal long block（36）Long through-hole（37）, the insulation cured plate（31） It is provided with several vertical through hole（38）, this vertical through hole（38）It is interior that there is conductive pole（39）, this conductive pole（29）Upper end and upper copper Paper tinsel patterned layer（32）Conduct, this conductive pole（39）Lower end and lower copper foil pattern layer（33）Conduct, the conductive pole（39）Position In adjacent 2 metal long blocks（36）Between insulate cured plate（31）Region；

The central data processor（1）, platform management control module（2）, EC embedded controllers（3）, PCIE/SRIO agreements Conversion module（4）, PCI/PCIE protocol translation modules（5）, gigabit networking process chip（6）, PCIE shunts（20）In one Sub-module is installed on circuit board（30）Upper surface, another part module are installed on circuit board（30）Lower surface.
2. compact Industry Control mainboard according to claim 1, it is characterised in that：The central data processor（1）、 Platform management control module（2）, EC embedded controllers（3）, PCIE/SRIO protocol translation modules（4）It is installed on circuit board （30）Upper surface, the PCI/PCIE protocol translations module（5）, gigabit networking process chip（6）, PCIE shunts（20）Installation In circuit board（30）Lower surface.
3. compact Industry Control mainboard according to claim 1, it is characterised in that：The metal long block（36）Interior length Through hole（37）Quantity is 2.
4. compact Industry Control mainboard according to claim 1, it is characterised in that：The insulation cured plate（31）Thickness With metal long block（36）The thickness ratio of thickness is 10：（5~8）.