CN207424859U - High-performance industrial control mainboard - Google Patents
High-performance industrial control mainboard Download PDFInfo
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- CN207424859U CN207424859U CN201721151493.4U CN201721151493U CN207424859U CN 207424859 U CN207424859 U CN 207424859U CN 201721151493 U CN201721151493 U CN 201721151493U CN 207424859 U CN207424859 U CN 207424859U
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Abstract
The utility model discloses a kind of high-performance industrial control mainboard, its central data processor is used for data processing, the platform management control module is used to control the input-output operation of peripheral components, the EC embedded controllers are responsible for power supply and switching on and shutting down sequential in control mainboard, the PCIE/SRIO protocol translations module is converted for PCIE protocol datas and SRIO protocol datas, and the PCI/PCIE protocol translations module is converted for PCI protocol datas and PCIE protocol datas；A switching switch is provided between CRT monitor and platform management control module, total port of the PCIE splitters is bi-directionally connected with central data processor by PCIE buses.The utility model high-performance industrial control mainboard is realized to be compatible with the product of numerous standards of industry, is had abundant industry standard interface, is substantially met a variety of demand of user, reduce design risk.
Description
Technical field
The utility model is related to a kind of high-performance industrial control mainboards, belong to digital information processing system technical field.
Background technology
Industrial control computer is a kind of using bus structures, production process and its electromechanical equipment, technological equipment is carried out
The instrument general name of Detection ＆ Controling, it has important computer attribute and feature, and the critical piece inside industrial computer is just
It is high-performance industrial control mainboard.The rich interface of industrial control mainboard, species are various.A industrial master board is divided into two parts, first, high
Fast core plate part, second is that peripheral interface expansion.But a kind of high-performance industrial control mainboard is developed, because involving core
The design of plate, it is necessary to R＆D cycle it is very long, risk is very high.
The content of the invention
The utility model aim is to provide a kind of high-performance industrial control mainboard, which overcomes existing mainboard
The defects of function is single, interface is limited realizes multi-functional, multiplex roles, expansible, facilitates the function of extended products, realize
It is compatible with the product of numerous standards of industry, there is abundant industry standard interface.
In order to achieve the above objectives, the technical solution adopted in the utility model is：A kind of high-performance industrial control mainboard, including circuit
Plate, the central data processor being installed on circuit board, platform management control module, EC embedded controllers, PCIE/SRIO associations
Discuss conversion module, PCI/PCIE protocol translations module, gigabit networking processing chip, on-board hard disk, CRT monitor, PCIE branches
Device, the memory on board being bi-directionally connected with central data processor and DDI memory expansion interface units, the central data processor are used
In data processing, the platform management control module is used to control the input-output operation of peripheral components, the embedded controls of EC
Device processed is responsible for power supply and switching on and shutting down sequential in control mainboard, and the PCIE/SRIO protocol translations module is used for PCIE agreement numbers
It is converted according to SRIO protocol datas, the PCI/PCIE protocol translations module turns for PCI protocol datas and PCIE protocol datas
It changes, for improving data transfer bandwidth and network speed, the memory on board is used to store CPU processing the gigabit networking processing chip
Intermediate data in the process, the DDI memory expansions interface unit are used to patch memory bar so as to exented memory capacity；
It is bi-directionally connected between the central data processor, platform management control module by DMI buses, the center number
It is bi-directionally connected according between processor, PCIE/SRIO protocol translation modules one end by PCIE buses, the platform management controls mould
Block, PCI/ PCIE protocol translation modules are bi-directionally connected between one end by PCIE buses, the platform management control module, thousand
It is bi-directionally connected between million network processes chip one end by PCIE buses, the EC embedded controllers, platform management control mould
It is bi-directionally connected between block by lpc bus, the on-board hard disk is connected to platform management control module；
The central data processor is connected with the 5th VPX connectors, and described PCIE/SRIO protocol translations module one end leads to
It crosses SRIO buses and is connected to the first VPX connectors, a SPI Flash is bi-directionally connected by spi bus and platform management control module,
This SPI Flash instructs for the BIOS of storing initial peripheral components, and the gigabit networking processing chip other end is connected with
RJ45 sockets and the 4th VPX connectors, the PCI/PCIE protocol translations module other end are connected with PMC connectors；
A switching switch is provided between the CRT monitor and platform management control module, the PCIE splitters
Total port is bi-directionally connected with central data processor by PCIE buses, first point of port of the PCIE splitters and second point
Port is connected to the 2nd VPX connectors by PCIE buses, and the 3rd point of port of the PCIE splitters passes through PCIE buses
It is bi-directionally connected with an XMC connectors, the platform management control module is connected to the 6th VPX connectors by HDA protocol bus；
The circuit board further comprises aluminium support plate, upper copper foil pattern layer and lower copper foil pattern layer, the aluminium support plate and upper
Between copper foil pattern layer there is upper insulation adhesive layer, there is lower insulation adhesive layer between the aluminium support plate and lower copper foil pattern layer,
Several horizontal through hole parallel and arranged at equal interval are provided in the middle part of the aluminium support plate and along its in-plane.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in said program, an EC flash memories are connected to the EC embedded controllers, this EC flash memory is used to store consolidating for EC
Part and it is responsible for the information timing management powered on.
In said program, a keyboard and mouse interface are connected to the EC embedded controllers.
In said program, the cross sectional shape of the horizontal through hole is regular hexagon shape through hole.
Since above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
1. the utility model high-performance industrial control mainboard, which overcomes the defects of existing main board function is single, interface is limited,
Multi-functional, multiplex roles are realized, facilitate the function of extended products, realizes and is compatible with the product of numerous standards of industry, had
Abundant industry standard interface substantially meets a variety of demand of user, reduces design risk, shortens research and development week
Phase.
The utility model high-performance industrial control mainboard, circuit board further comprise aluminium support plate, upper copper foil pattern layer and lower copper
Paper tinsel pattern layer has upper insulation adhesive layer, the aluminium support plate and lower copper foil pattern between the aluminium support plate and upper copper foil pattern layer
Between layer there is lower insulation adhesive layer, be conducive to increase heat dissipation area, aluminium support plate is conducive to the heat from copper foil layer device
It is quick to transfer, so as to be conducive to improve the service life of device, improve the reliability of product, in the middle part of the aluminium support plate and
Several horizontal through hole parallel and arranged at equal interval are provided with along its in-plane, the air-flow be conducive in metal substrate quickly flows
It is dynamic, so as to which more heats be taken out of.
Description of the drawings
Attached drawing 1 is the utility model high-performance industrial control mainboard structure diagram；
Attached drawing 2 is the partial structural diagram of attached drawing 1；
Attached drawing 3 is board structure of circuit schematic diagram in industrial control unit (ICU) mainboard.
In the figures above：1st, central data processor；2nd, platform management control module；3rd, EC embedded controllers；4、
PCIE/SRIO protocol translation modules；5th, PCI/PCIE protocol translations module；6th, gigabit networking processing chip；7th, on-board hard disk；8、
Memory on board；9th, DDI memory expansions interface unit；101st, the first VPX connectors；102nd, the 2nd VPX connectors；104th, the 4th VPX
Connector；105th, the 5th VPX connectors；106th, the 6th VPX connectors；11st, SPI Flash；12nd, RJ45 sockets；13rd, PMC connections
Device；14th, SATA interface device；15th, preposition USB joint；16th, USB jack；17th, EC flash memories；18th, keyboard and mouse interface；19、CRT
Display；20th, PCIE splitters；21st, switching switch；22nd, XMC connectors；23rd, HDA protocol bus；24th, hardware detecting module；
30th, circuit board；31st, aluminium support plate；32nd, upper copper foil pattern layer；33rd, upper insulation adhesive layer；34th, horizontal through hole；35th, lower copper foil pattern
Layer；36th, lower insulation adhesive layer.
Specific embodiment
The utility model is further described with reference to embodiment：
Embodiment 1：A kind of high-performance industrial control mainboard, at circuit board 20, the central data being installed on circuit board 30
Device 1, platform management control module 2, EC embedded controllers 3, PCIE/SRIO protocol translations module 4, PCI/PCIE agreements is managed to turn
Change module 5, gigabit networking processing chip 6, on-board hard disk 7, CRT monitor 19, PCIE splitters 20 and central data processor
1 memory on board 8 being bi-directionally connected and DDI memory expansions interface unit 9, the central data processor 1 is used for data processing, described
Platform management control module 2 is used to control the input-output operation of peripheral components, and the EC embedded controllers 3 are responsible for control master
Power supply and switching on and shutting down sequential on plate, the PCIE/SRIO protocol translations module 4 is for PCIE protocol datas and SRIO agreement numbers
According to conversion, the PCI/PCIE protocol translations module 5 is converted for PCI protocol datas and PCIE protocol datas, the kilomega network
Network processing chip 6 is for improving data transfer bandwidth and network speed, during the memory on board 8 is for storing in CPU processing procedures
Between data, the DDI memory expansions interface unit 9 is for patching memory bar so as to exented memory capacity；
It is bi-directionally connected between the central data processor 1, platform management control module 2 by DMI buses, the center
Data processor 1, PCIE/SRIO protocol translations module are bi-directionally connected between 4 one end by PCIE buses, the platform management control
Molding block 2, PCI/ PCIE protocol translations module are bi-directionally connected between 5 one end by PCIE buses, and the platform management controls mould
Block 2, gigabit networking processing chip are bi-directionally connected between 6 one end by PCIE buses, the EC embedded controllers 3, platform pipe
It is bi-directionally connected between reason control module 2 by lpc bus, the on-board hard disk 7 is connected to platform management control module 2；
The central data processor 1 is connected with the 5th VPX connectors 105, the PCIE/SRIO protocol translations module 4
The other end is connected to the first VPX connectors 101 by SRIO buses, and a SPI Flash 11 is controlled by spi bus and platform management
Module 2 is bi-directionally connected, this SPI Flash 11 instructs for the BIOS of storing initial peripheral components, and the gigabit networking handles core
6 other end of piece is connected with 12 and the 4th VPX connectors 104 of RJ45 sockets, and 5 other end of PCI/PCIE protocol translations module connects
It is connected to PMC connectors 13；
A switching switch 21, the PCIE branches are provided between the CRT monitor 19 and platform management control module 2
Total port of device 20 is bi-directionally connected with central data processor 1 by PCIE buses, first point of end of the PCIE splitters 20
Mouth and second point of port are connected to the 2nd VPX connectors 102, the 3rd point of end of the PCIE splitters 20 by PCIE buses
Mouth is bi-directionally connected by PCIE buses and an XMC connectors 22, and the platform management control module 2 passes through HDA protocol bus 23
It is connected to the 6th VPX connectors 106；
The circuit board 30 further comprises aluminium support plate 31, upper copper foil pattern layer 32 and lower copper foil pattern layer 35, the aluminium
There is upper insulation adhesive layer 33, between the aluminium support plate 31 and lower copper foil pattern layer 35 between support plate 31 and upper copper foil pattern layer 32
With lower insulation adhesive layer 36, it is parallel and arrange at equal intervals to be provided with several positioned at 31 middle part of the aluminium support plate and along its in-plane
The horizontal through hole 34 of row.
One SATA interface device 14 is connected to the platform management control module 2, this SATA interface device 14 extends for connecting
Hard disk.
One preposition 15 one end of USB joint is connected to the platform management control module 2, this preposition USB joint 15 it is another
End is connected with USB jack 16.
One the 4th VPX connectors 104 are connected to the gigabit networking processing chip 6.
Above-mentioned EC embedded controllers 3 are also associated with a hardware detecting module 24, this hardware detecting module 24 is used to monitor
The voltage and temperature parameter of all parts.
The adjacent horizontal through hole 34 at intervals of 60mm, the cross sectional shape of the horizontal through hole 34 is regular hexagon shape
Through hole.
Embodiment 2：A kind of high-performance industrial control mainboard, at circuit board 20, the central data being installed on circuit board 30
Device 1, platform management control module 2, EC embedded controllers 3, PCIE/SRIO protocol translations module 4, PCI/PCIE agreements is managed to turn
Change module 5, gigabit networking processing chip 6, on-board hard disk 7, CRT monitor 19, PCIE splitters 20 and central data processor
1 memory on board 8 being bi-directionally connected and DDI memory expansions interface unit 9, the central data processor 1 is used for data processing, described
Platform management control module 2 is used to control the input-output operation of peripheral components, and the EC embedded controllers 3 are responsible for control master
Power supply and switching on and shutting down sequential on plate, the PCIE/SRIO protocol translations module 4 is for PCIE protocol datas and SRIO agreement numbers
According to conversion, the PCI/PCIE protocol translations module 5 is converted for PCI protocol datas and PCIE protocol datas, the kilomega network
Network processing chip 6 is for improving data transfer bandwidth and network speed, during the memory on board 8 is for storing in CPU processing procedures
Between data, the DDI memory expansions interface unit 9 is for patching memory bar so as to exented memory capacity；
It is bi-directionally connected between the central data processor 1, platform management control module 2 by DMI buses, the center
Data processor 1, PCIE/SRIO protocol translations module are bi-directionally connected between 4 one end by PCIE buses, the platform management control
Molding block 2, PCI/ PCIE protocol translations module are bi-directionally connected between 5 one end by PCIE buses, and the platform management controls mould
Block 2, gigabit networking processing chip are bi-directionally connected between 6 one end by PCIE buses, the EC embedded controllers 3, platform pipe
It is bi-directionally connected between reason control module 2 by lpc bus, the on-board hard disk 7 is connected to platform management control module 2；
The central data processor 1 is connected with the 5th VPX connectors 105, the PCIE/SRIO protocol translations module 4
The other end is connected to the first VPX connectors 101 by SRIO buses, and a SPI Flash 11 is controlled by spi bus and platform management
Module 2 is bi-directionally connected, this SPI Flash 11 instructs for the BIOS of storing initial peripheral components, and the gigabit networking handles core
6 other end of piece is connected with 12 and the 4th VPX connectors 104 of RJ45 sockets, and 5 other end of PCI/PCIE protocol translations module connects
It is connected to PMC connectors 13；
A switching switch 21, the PCIE branches are provided between the CRT monitor 19 and platform management control module 2
Total port of device 20 is bi-directionally connected with central data processor 1 by PCIE buses, first point of end of the PCIE splitters 20
Mouth and second point of port are connected to the 2nd VPX connectors 102, the 3rd point of end of the PCIE splitters 20 by PCIE buses
Mouth is bi-directionally connected by PCIE buses and an XMC connectors 22, and the platform management control module 2 passes through HDA protocol bus 23
It is connected to the 6th VPX connectors 106；
The circuit board 30 further comprises aluminium support plate 31, upper copper foil pattern layer 32 and lower copper foil pattern layer 35, the aluminium
There is upper insulation adhesive layer 33, between the aluminium support plate 31 and lower copper foil pattern layer 35 between support plate 31 and upper copper foil pattern layer 32
With lower insulation adhesive layer 36, it is parallel and arrange at equal intervals to be provided with several positioned at 31 middle part of the aluminium support plate and along its in-plane
The horizontal through hole 34 of row.
One the 4th VPX connectors 104 are connected to the gigabit networking processing chip 6.
One EC flash memories 17 are connected to the EC embedded controllers 3, this EC flash memory 17 is used to store the firmware of EC and is responsible for
The information timing management powered on.
One keyboard and mouse interface 18 are connected to the EC embedded controllers 3.
The number of above-mentioned PCIE/SRIO protocol translations module 4 is 2, this 2 PCIE/SRIO protocol translations modules 4 connect
It is connected to the first VPX connectors 101.
The adjacent horizontal through hole 34 at intervals of 40mm, the cross sectional shape of the horizontal through hole 34 is regular hexagon shape
Through hole.
During using above-mentioned high-performance industrial control mainboard, the defects of existing main board function is single, interface is limited is which overcomed, is realized
Multi-functional, multiplex roles facilitate the function of extended products, realize and are compatible with the products of numerous standards of industry, have abundant
Industry standard interface, substantially meet a variety of demand of user, reduce design risk, shorten the R＆D cycle；Its
Secondary, circuit board further comprises aluminium support plate, upper copper foil pattern layer and lower copper foil pattern layer, the aluminium support plate and upper copper foil pattern
Between layer there is upper insulation adhesive layer, between the aluminium support plate and lower copper foil pattern layer there is lower insulation adhesive layer, be conducive to increase
Add heat dissipation area, aluminium support plate is conducive to quickly transfer the heat from copper foil layer device, so as to be conducive to improve making for device
With the service life, the reliability of product is improved, it is parallel and wait to be provided with several in the middle part of the aluminium support plate and along its in-plane
Spaced horizontal through hole, the air-flow be conducive in metal substrate quickly flow, so as to which more heats be taken out of.
Above-described embodiment is only the technical concepts and features for illustrating the utility model, and its object is to allow be familiar with technique
Personage can understand the content of the utility model and implement according to this, can not the scope of protection of the utility model be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover the scope of protection of the utility model it
It is interior.
Claims (4)
1. a kind of high-performance industrial control mainboard, it is characterised in that：Including circuit board（30）, be installed on circuit board（30）On central number
According to processor（1）, platform management control module（2）, EC embedded controllers（3）, PCIE/SRIO protocol translation modules（4）、
PCI/PCIE protocol translation modules（5）, gigabit networking processing chip（6）, on-board hard disk（7）, CRT monitor（19）, PCIE point
Road device（20）With central data processor（1）The memory on board being bi-directionally connected（8）With DDI memory expansion interface units（9）, it is described
Central data processor（1）For data processing, the platform management control module（2）For controlling the input of peripheral components defeated
Go out operation, the EC embedded controllers（3）The power supply and switching on and shutting down sequential being responsible in control mainboard, the PCIE/SRIO associations
Discuss conversion module（4）It is converted for PCIE protocol datas and SRIO protocol datas, the PCI/PCIE protocol translations module（5）With
It is converted in PCI protocol datas and PCIE protocol datas, the gigabit networking processing chip（6）For improve data transfer bandwidth and
Network speed, the memory on board（8）For storing the intermediate data in CPU processing procedures, the DDI memory expansions interface unit（9）
For patching memory bar so as to exented memory capacity；
The central data processor（1）, platform management control module（2）Between be bi-directionally connected by DMI buses, the center
Data processor（1）, PCIE/SRIO protocol translation modules（4）It is bi-directionally connected between one end by PCIE buses, the platform pipe
Manage control module（2）, PCI/ PCIE protocol translation modules（5）It is bi-directionally connected between one end by PCIE buses, the platform pipe
Manage control module（2）, gigabit networking processing chip（6）It is bi-directionally connected between one end by PCIE buses, the embedded controls of EC
Device processed（3）, platform management control module（2）Between be bi-directionally connected by lpc bus, the on-board hard disk（7）It is connected to platform
Management control module（2）；
The central data processor（1）It is connected with the 5th VPX connectors（105）, the PCIE/SRIO protocol translations module
（4）The other end is connected to the first VPX connectors by SRIO buses（101）, a SPI Flash（11）Pass through spi bus and platform
Management control module（2）It is bi-directionally connected, this SPI Flash（11）It is instructed for the BIOS of storing initial peripheral components, described thousand
Million network processes chips（6）The other end is connected with RJ45 sockets（12）With the 4th VPX connectors（104）, the PCI/PCIE associations
Discuss conversion module（5）The other end is connected with PMC connectors（13）；
The CRT monitor（19）With platform management control module（2）Between be provided with a switching switch（21）, the PCIE points
Road device（20）Total port and central data processor（1）It is bi-directionally connected by PCIE buses, the PCIE splitters（20）'s
First point of port and second point of port are connected to the 2nd VPX connectors by PCIE buses（102）, the PCIE splitters
（20）The 3rd point of port pass through PCIE buses and an XMC connectors（22）It is bi-directionally connected, the platform management control module（2）
Pass through HDA protocol bus（23）It is connected to the 6th VPX connectors（106）；
The circuit board（30）Further comprise aluminium support plate（31）, upper copper foil pattern layer（32）With lower copper foil pattern layer（35）, institute
State aluminium support plate（31）With upper copper foil pattern layer（32）Between have upper insulation adhesive layer（33）, the aluminium support plate（31）With lower copper foil
Pattern layer（35）Between have lower insulation adhesive layer（36）, positioned at the aluminium support plate（31）If middle part and being provided with along its in-plane
Dry horizontal through hole parallel and arranged at equal interval（34）.
2. high-performance industrial control mainboard according to claim 1, it is characterised in that：One EC flash memories（17）It is embedding to be connected to the EC
Enter formula controller（3）, this EC flash memory（17）For storing the firmware of EC and being responsible for the information timing management powered on.
3. high-performance industrial control mainboard according to claim 1, it is characterised in that：One keyboard and mouse interface（18）It is connected to
The EC embedded controllers（3）.
4. high-performance industrial control mainboard according to claim 1, it is characterised in that：The horizontal through hole（34）Cross sectional shape
For regular hexagon through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721151493.4U CN207424859U (en) | 2017-09-10 | 2017-09-10 | High-performance industrial control mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721151493.4U CN207424859U (en) | 2017-09-10 | 2017-09-10 | High-performance industrial control mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207424859U true CN207424859U (en) | 2018-05-29 |
Family
ID=62315851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721151493.4U Active CN207424859U (en) | 2017-09-10 | 2017-09-10 | High-performance industrial control mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207424859U (en) |
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2017
- 2017-09-10 CN CN201721151493.4U patent/CN207424859U/en active Active
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