CN207408938U - Industrial control mainboard system - Google Patents
Industrial control mainboard system Download PDFInfo
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- CN207408938U CN207408938U CN201721151496.8U CN201721151496U CN207408938U CN 207408938 U CN207408938 U CN 207408938U CN 201721151496 U CN201721151496 U CN 201721151496U CN 207408938 U CN207408938 U CN 207408938U
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- copper foil
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- 238000013519 translation Methods 0.000 claims abstract description 50
- 230000014616 translation Effects 0.000 claims abstract description 50
- 239000010410 layer Substances 0.000 claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000011889 copper foil Substances 0.000 claims abstract description 44
- 238000012545 processing Methods 0.000 claims abstract description 35
- 239000004411 aluminium Substances 0.000 claims abstract description 33
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 33
- 230000015654 memory Effects 0.000 claims abstract description 29
- 230000006855 networking Effects 0.000 claims abstract description 28
- 238000009413 insulation Methods 0.000 claims abstract description 21
- 239000012790 adhesive layer Substances 0.000 claims abstract description 15
- 241001269238 Data Species 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 230000006870 function Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 241000894007 species Species 0.000 description 1
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Abstract
The utility model discloses a kind of industrial control mainboard system, including central data processor, platform management control module, EC embedded controllers, PCIE/SRIO protocol translations module, PCI/PCIE protocol translations module, gigabit networking processing chip, on-board hard disk, the memory on board being bi-directionally connected with central data processor and the DDI memory expansion interface units being installed on circuit board；It is bi-directionally connected between central data processor, platform management control module by DMI buses, the central data processor, PCIE/SRIO protocol translation modules are bi-directionally connected between one end by PCIE buses；Circuit board further comprises aluminium support plate, upper copper foil pattern layer and lower copper foil pattern layer, has upper insulation adhesive layer between the aluminium support plate and upper copper foil pattern layer.The utility model industrial control mainboard system is realized to be compatible with the product of numerous standards of industry, has abundant industry standard interface, and is conducive to increase heat dissipation area and is improved the service life of device.
Description
Technical field
The utility model is related to a kind of industrial control computer mainboards, belong to digital information processing system technical field.
Background technology
As society improves industrial equipment using multifarious requirement, industrial equipment is gradually to multifunctional unit and small-sized
Change development, the industrial equipment of traditional unification is difficult to meet the needs of modern industrial equipment.Industry Control mainboard is set as industry
Standby core is also faced with multifunctional integrated challenge.
Industrial control computer mainboard is a kind of using bus structures, and production process and its electromechanical equipment, technological equipment are detected
With the instrument general name of control, it has important computer attribute and feature, and the critical piece inside industrial computer is exactly work
Control mainboard.The rich interface of industrial control mainboard, species are various.A industrial master board is divided into two parts, first, high-speed core plate
Part, second is that peripheral interface expansion.But a kind of industrial control computer mainboard is developed, because involving the design of core board, need
The R＆D cycle wanted is very long, and risk is very high.
The content of the invention
The utility model aim is to provide a kind of industrial control mainboard system, which overcomes existing main board function
Single, the defects of interface is limited, realizes multi-functional, multiplex roles, expansible, facilitates the function of extended products, and be conducive to increase
Add heat dissipation area and improve the service life of device, improve the reliability of product.
In order to achieve the above objectives, the technical solution adopted in the utility model is：A kind of industrial control mainboard system, including circuit
Plate, the central data processor being installed on circuit board, platform management control module, EC embedded controllers, PCIE/SRIO associations
It is double to discuss conversion module, PCI/PCIE protocol translations module, gigabit networking processing chip, on-board hard disk and central data processor
Memory on board and DDI memory expansion interface units to connection, the central data processor are used for data processing, the platform pipe
Reason control module is used to control the input-output operation of peripheral components, and the EC embedded controllers are responsible for the electricity in control mainboard
Source and switching on and shutting down sequential, the PCIE/SRIO protocol translations module are converted for PCIE protocol datas and SRIO protocol datas, institute
It states PCI/PCIE protocol translations module to convert for PCI protocol datas and PCIE protocol datas, the gigabit networking processing chip
For improving data transfer bandwidth and network speed, the memory on board is used to store the intermediate data in CPU processing procedures, described
DDI memory expansions interface unit is used to patch memory bar so as to exented memory capacity；
It is bi-directionally connected between the central data processor, platform management control module by DMI buses, the center number
It is bi-directionally connected according between processor, PCIE/SRIO protocol translation modules one end by PCIE buses, the platform management controls mould
Block, PCI/ PCIE protocol translation modules are bi-directionally connected between one end by PCIE buses, the platform management control module, thousand
It is bi-directionally connected between million network processes chip one end by PCIE buses, the EC embedded controllers, platform management control mould
It is bi-directionally connected between block by lpc bus, the on-board hard disk is connected to platform management control module；
The central data processor is connected with the 5th VPX connectors, the PCIE/SRIO protocol translations module other end
First VPX connectors are connected to by SRIO buses, a SPI Flash passes through spi bus and the two-way company of platform management control module
It connects, this SPI Flash instructs for the BIOS of storing initial peripheral components, and the gigabit networking processing chip other end is connected with
RJ45 sockets and the 4th VPX connectors, the PCI/PCIE protocol translations module other end are connected with PMC connectors；
The circuit board further comprises aluminium support plate, upper copper foil pattern layer and lower copper foil pattern layer, the aluminium support plate and upper
Between copper foil pattern layer there is upper insulation adhesive layer, there is lower insulation adhesive layer between the aluminium support plate and lower copper foil pattern layer,
The aluminium support plate is provided with several vertical through holes, and a conductive column is provided in this vertical through hole, this conductive column is with erecting
There is insulation fill stratum, the upper end of the conductive column is conducted with upper copper foil pattern layer, under the conductive column between clear opening
End is conducted with lower copper foil pattern layer；The central data processor, platform management control module, EC embedded controllers,
A part of module is installed in PCIE/SRIO protocol translations module, PCI/PCIE protocol translations module, gigabit networking processing chip
Circuit board upper surface, another part module are installed on circuit board lower surface.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in said program, a SATA interface device is connected to the platform management control module, this SATA interface device is used for
Connect the hard disk of extension.
2. in said program, a preposition USB joint one end is connected to the platform management control module, this preposition USB connects
The other end of head is connected with USB jack.
3. in said program, one the 4th VPX connectors are connected to the gigabit networking processing chip.
4. in said program, the angle of the vertical through hole and aluminium support plate is 90 °.
5. in said program, the thickness of the aluminium support plate is 500 ~ 2000 microns.
6. in said program, the central data processor, platform management control module, EC embedded controllers,
Central data processor in PCIE/SRIO protocol translations module, PCI/PCIE protocol translations module, gigabit networking processing chip,
Platform management control module, EC embedded controllers, PCIE/SRIO protocol translation modules are installed on circuit board upper surface, described
PCI/PCIE protocol translations module, gigabit networking processing chip（6）It is installed on circuit board lower surface.
Since above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
1. the utility model industrial control mainboard system which overcomes the defects of existing main board function is single, interface is limited, real
Multi-functional, multiplex roles are showed, have facilitated the function of extended products, realized and be compatible with the product of numerous standards of industry, had rich
Rich industry standard interface, substantially meets a variety of demand of user, reduces design risk, shorten the R＆D cycle.
2. the utility model double-side copper foil baseplate structure, circuit board further comprise aluminium support plate, upper copper foil pattern layer and
Lower copper foil pattern layer has upper insulation adhesive layer, the aluminium support plate and lower copper foil between the aluminium support plate and upper copper foil pattern layer
Between pattern layer there is lower insulation adhesive layer, be conducive to increase heat dissipation area, aluminium support plate is conducive to will be from copper foil layer device
Heat quickly transfers, and so as to be conducive to improve the service life of device, improves the reliability of product, secondly, aluminium support plate is opened
There are several vertical through holes, a conductive column is provided in this vertical through hole, between this conductive column and vertical through hole there is insulation to fill out
Layer is filled, the upper end of the conductive column is conducted with upper copper foil pattern layer, the lower end of the conductive column and lower copper foil pattern layer conductance
It is logical, the density of device layout is improved, is conducive to control panel and further reduces volume.
Description of the drawings
Attached drawing 1 is the utility model industrial control mainboard system structure diagram；
Attached drawing 2 is board structure of circuit schematic diagram in the utility model industrial control mainboard system.
In the figures above：1st, central data processor；2nd, platform management control module；3rd, EC embedded controllers；4、
PCIE/SRIO protocol translation modules；5th, PCI/PCIE protocol translations module；6th, gigabit networking processing chip；7th, on-board hard disk；8、
Memory on board；9th, DDI memory expansions interface unit；101st, the first VPX connectors；104th, the 4th VPX connectors；105th, the 5th VPX
Connector；11st, SPI Flash；12nd, RJ45 sockets；13rd, PMC connectors；14th, SATA interface device；15th, preposition USB joint；16、
USB jack；17th, EC flash memories；18th, keyboard and mouse interface；30th, circuit board；31st, aluminium support plate；32nd, upper copper foil pattern layer；33rd, on
Insulate adhesive layer；34th, vertical through hole；35th, lower copper foil pattern layer；36th, lower insulation adhesive layer；37th, conductive column；38th, insulation filling
Layer.
Specific embodiment
The utility model is further described with reference to embodiment：
Embodiment 1：A kind of industrial control mainboard system, including circuit board 30, the central data being installed on circuit board 30 processing
Device 1, platform management control module 2, EC embedded controllers 3, PCIE/SRIO protocol translations module 4, PCI/PCIE protocol translations
In the memory on board 8 and DDI that module 5, gigabit networking processing chip 6, on-board hard disk 7 and central data processor 1 are bi-directionally connected
Expansion interface device 9 is deposited, the central data processor 1 is used for data processing, and the platform management control module 2 is outer for controlling
The input-output operation of component is enclosed, the EC embedded controllers 3 are responsible for power supply and switching on and shutting down sequential in control mainboard, described
PCIE/SRIO protocol translations module 4 is converted for PCIE protocol datas and SRIO protocol datas, the PCI/PCIE protocol translations
Module 5 is converted for PCI protocol datas and PCIE protocol datas, and the gigabit networking processing chip 6 is used to improve data transmission
Bandwidth and network speed, the memory on board 8 are used to store the intermediate data in CPU processing procedures, the DDI memory expansions interface unit
9 are used to patch memory bar so as to exented memory capacity；
It is bi-directionally connected between the central data processor 1, platform management control module 2 by DMI buses, the center
Data processor 1, PCIE/SRIO protocol translations module are bi-directionally connected between 4 one end by PCIE buses, the platform management control
Molding block 2, PCI/ PCIE protocol translations module are bi-directionally connected between 5 one end by PCIE buses, and the platform management controls mould
Block 2, gigabit networking processing chip are bi-directionally connected between 6 one end by PCIE buses, the EC embedded controllers 3, platform pipe
It is bi-directionally connected between reason control module 2 by lpc bus, the on-board hard disk 7 is connected to platform management control module 2；
The central data processor 1 is connected with the 5th VPX connectors 105, the PCIE/SRIO protocol translations module 4
The other end is connected to the first VPX connectors 101 by SRIO buses, and a SPI Flash 11 is controlled by spi bus and platform management
Module 2 is bi-directionally connected, this SPI Flash 11 instructs for the BIOS of storing initial peripheral components, and the gigabit networking handles core
6 other end of piece is connected with 12 and the 4th VPX connectors 104 of RJ45 sockets, and 5 other end of PCI/PCIE protocol translations module connects
It is connected to PMC connectors 13.
The circuit board 30 further comprises aluminium support plate 31, upper copper foil pattern layer 32 and lower copper foil pattern layer 35, the aluminium
There is upper insulation adhesive layer 33, between the aluminium support plate 31 and lower copper foil pattern layer 35 between support plate 31 and upper copper foil pattern layer 32
With lower insulation adhesive layer 36, the aluminium support plate 31 is provided with several vertical through holes 34, and being provided with one in this vertical through hole 34 leads
Electric column 37 has insulation fill stratum 38, upper end and the upper copper foil of the conductive column 37 between this conductive column 37 and vertical through hole 34
Pattern layer 32 conducts, and the lower end of the conductive column 37 is conducted with lower copper foil pattern layer 35；The central data processor 1,
Platform management control module 2, EC embedded controllers 3, PCIE/SRIO protocol translations module 4, PCI/PCIE protocol translation modules
5th, a part of module is installed on 30 upper surface of circuit board in gigabit networking processing chip 6, and another part module is installed on circuit board
30 lower surfaces.
One SATA interface device 14 is connected to the platform management control module 2, this SATA interface device 14 extends for connecting
Hard disk.
One preposition 15 one end of USB joint is connected to the platform management control module 2, this preposition USB joint 15 it is another
End is connected with USB jack 16.
One the 4th VPX connectors 104 are connected to the gigabit networking processing chip 6.
Embodiment 2：A kind of industrial control mainboard system, including circuit board 30, the central data being installed on circuit board 30 processing
Device 1, platform management control module 2, EC embedded controllers 3, PCIE/SRIO protocol translations module 4, PCI/PCIE protocol translations
In the memory on board 8 and DDI that module 5, gigabit networking processing chip 6, on-board hard disk 7 and central data processor 1 are bi-directionally connected
Expansion interface device 9 is deposited, the central data processor 1 is used for data processing, and the platform management control module 2 is outer for controlling
The input-output operation of component is enclosed, the EC embedded controllers 3 are responsible for power supply and switching on and shutting down sequential in control mainboard, described
PCIE/SRIO protocol translations module 4 is converted for PCIE protocol datas and SRIO protocol datas, the PCI/PCIE protocol translations
Module 5 is converted for PCI protocol datas and PCIE protocol datas, and the gigabit networking processing chip 6 is used to improve data transmission
Bandwidth and network speed, the memory on board 8 are used to store the intermediate data in CPU processing procedures, the DDI memory expansions interface unit
9 are used to patch memory bar so as to exented memory capacity；
It is bi-directionally connected between the central data processor 1, platform management control module 2 by DMI buses, the center
Data processor 1, PCIE/SRIO protocol translations module are bi-directionally connected between 4 one end by PCIE buses, the platform management control
Molding block 2, PCI/ PCIE protocol translations module are bi-directionally connected between 5 one end by PCIE buses, and the platform management controls mould
Block 2, gigabit networking processing chip are bi-directionally connected between 6 one end by PCIE buses, the EC embedded controllers 3, platform pipe
It is bi-directionally connected between reason control module 2 by lpc bus, the on-board hard disk 7 is connected to platform management control module 2；
The central data processor 1 is connected with the 5th VPX connectors 105, the PCIE/SRIO protocol translations module 4
The other end is connected to the first VPX connectors 101 by SRIO buses, and a SPI Flash 11 is controlled by spi bus and platform management
Module 2 is bi-directionally connected, this SPI Flash 11 instructs for the BIOS of storing initial peripheral components, and the gigabit networking handles core
6 other end of piece is connected with 12 and the 4th VPX connectors 104 of RJ45 sockets, and 5 other end of PCI/PCIE protocol translations module connects
It is connected to PMC connectors 13.
The circuit board 30 further comprises aluminium support plate 31, upper copper foil pattern layer 32 and lower copper foil pattern layer 35, the aluminium
There is upper insulation adhesive layer 33, between the aluminium support plate 31 and lower copper foil pattern layer 35 between support plate 31 and upper copper foil pattern layer 32
With lower insulation adhesive layer 36, the aluminium support plate 31 is provided with several vertical through holes 34, and being provided with one in this vertical through hole 34 leads
Electric column 37 has insulation fill stratum 38, upper end and the upper copper foil of the conductive column 37 between this conductive column 37 and vertical through hole 34
Pattern layer 32 conducts, and the lower end of the conductive column 37 is conducted with lower copper foil pattern layer 35；The central data processor 1,
Platform management control module 2, EC embedded controllers 3, PCIE/SRIO protocol translations module 4, PCI/PCIE protocol translation modules
5th, a part of module is installed on 30 upper surface of circuit board in gigabit networking processing chip 6, and another part module is installed on circuit board
30 lower surfaces.
One the 4th VPX connectors 104 are connected to the gigabit networking processing chip 6.
One EC flash memories 17 are connected to the EC embedded controllers 3, this EC flash memory 17 is used to store the firmware of EC and is responsible for
The information timing management powered on.
One keyboard and mouse interface 18 are connected to the EC embedded controllers 3.
Above-mentioned central data processor 1, platform management control module 2, EC embedded controllers 3, PCIE/SRIO agreements turn
Change central data processor 1 in module 4, PCI/PCIE protocol translations module 5, gigabit networking processing chip 6, platform management control
Module 2, EC embedded controllers 3, PCIE/SRIO protocol translations module 4 are installed on 30 upper surface of circuit board, the PCI/PCIE
Protocol translation module 5, gigabit networking processing chip 6 are installed on 30 lower surface of circuit board.
During using above-mentioned industrial control mainboard system, the defects of existing main board function is single, interface is limited is which overcomed, is realized
Multi-functional, multiplex roles facilitate the function of extended products, realize and are compatible with the product of numerous standards of industry, have what is enriched
Industry standard interface substantially meets a variety of demand of user, reduces design risk, shorten the R＆D cycle；Secondly,
Its circuit board further comprises aluminium support plate, upper copper foil pattern layer and lower copper foil pattern layer, the aluminium support plate and upper copper foil pattern layer
Between have upper insulation adhesive layer, between the aluminium support plate and lower copper foil pattern layer have lower insulation adhesive layer, be conducive to increase
Heat dissipation area, aluminium support plate are conducive to quickly transfer the heat from copper foil layer device, so as to be conducive to improve the use of device
Service life improves the reliability of product, and again, aluminium support plate is provided with several vertical through holes, and one is provided in this vertical through hole
Conductive column has insulation fill stratum, the upper end of the conductive column and upper copper foil pattern layer electricity between this conductive column and vertical through hole
Conducting, the lower end of the conductive column conducts with lower copper foil pattern layer, improves the density of device layout, be conducive to control panel into
One step reduces volume.
Above-described embodiment is only the technical concepts and features for illustrating the utility model, and its object is to allow be familiar with technique
Personage can understand the content of the utility model and implement according to this, can not the scope of protection of the utility model be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover the scope of protection of the utility model it
It is interior.
Claims (6)
1. a kind of industrial control mainboard system, it is characterised in that：Including circuit board（30）, be installed on circuit board（30）On central data
Processor（1）, platform management control module（2）, EC embedded controllers（3）, PCIE/SRIO protocol translation modules（4）、PCI/
PCIE protocol translation modules（5）, gigabit networking processing chip（6）, on-board hard disk（7）With central data processor（1）Two-way company
The memory on board connect（8）With DDI memory expansion interface units（9）, the central data processor（1）It is described for data processing
Platform management control module（2）For controlling the input-output operation of peripheral components, the EC embedded controllers（3）It is responsible for control
Power supply and switching on and shutting down sequential on mainboard processed, the PCIE/SRIO protocol translations module（4）For PCIE protocol datas and SRIO
Protocol data is converted, the PCI/PCIE protocol translations module（5）It is converted for PCI protocol datas and PCIE protocol datas, institute
State gigabit networking processing chip（6）For improving data transfer bandwidth and network speed, the memory on board（8）For storing at CPU
Intermediate data during reason, the DDI memory expansions interface unit（9）For patching memory bar so as to exented memory capacity；
The central data processor（1）, platform management control module（2）Between be bi-directionally connected by DMI buses, the center
Data processor（1）, PCIE/SRIO protocol translation modules（4）It is bi-directionally connected between one end by PCIE buses, the platform pipe
Manage control module（2）, PCI/ PCIE protocol translation modules（5）It is bi-directionally connected between one end by PCIE buses, the platform pipe
Manage control module（2）, gigabit networking processing chip（6）It is bi-directionally connected between one end by PCIE buses, the embedded controls of EC
Device processed（3）, platform management control module（2）Between be bi-directionally connected by lpc bus, the on-board hard disk（7）It is connected to platform
Management control module（2）；
The central data processor（1）It is connected with the 5th VPX connectors（105）, the PCIE/SRIO protocol translations module
（4）The other end is connected to the first VPX connectors by SRIO buses（101）, a SPI Flash（11）Pass through spi bus and platform
Management control module（2）It is bi-directionally connected, this SPI Flash（11）It is instructed for the BIOS of storing initial peripheral components, described thousand
Million network processes chips（6）The other end is connected with RJ45 sockets（12）With the 4th VPX connectors（104）, the PCI/PCIE associations
Discuss conversion module（5）The other end is connected with PMC connectors（13）；
The circuit board（30）Further comprise aluminium support plate（31）, upper copper foil pattern layer（32）With lower copper foil pattern layer（35）, institute
State aluminium support plate（31）With upper copper foil pattern layer（32）Between have upper insulation adhesive layer（33）, the aluminium support plate（31）With lower copper foil
Pattern layer（35）Between have lower insulation adhesive layer（36）,
The aluminium support plate（31）It is provided with several vertical through holes（34）, this vertical through hole（34）Inside it is provided with a conductive column（37）,
This conductive column（37）With vertical through hole（34）Between have insulation fill stratum（38）, the conductive column（37）Upper end and upper copper foil
Pattern layer（32）It conducts, the conductive column（37）Lower end and lower copper foil pattern layer（35）It conducts；At the central data
Manage device（1）, platform management control module（2）, EC embedded controllers（3）, PCIE/SRIO protocol translation modules（4）、PCI/
PCIE protocol translation modules（5）, gigabit networking processing chip（6）Middle a part of module is installed on circuit board（30）Upper surface, separately
A part of module is installed on circuit board（30）Lower surface.
2. industrial control mainboard system according to claim 1, it is characterised in that：One SATA interface device（14）It is connected to described flat
Platform management control module（2）, this SATA interface device（14）For connecting the hard disk of extension.
3. industrial control mainboard system according to claim 1, it is characterised in that：One preposition USB joint（15）One end is connected to
The platform management control module（2）, this preposition USB joint（15）The other end be connected with USB jack（16）.
4. industrial control mainboard system according to claim 1, it is characterised in that：One the 4th VPX connectors（104）It is connected to institute
State gigabit networking processing chip（6）.
5. industrial control mainboard system according to claim 1, it is characterised in that：The vertical through hole（34）With aluminium support plate（31）
Angle be 90 °.
6. industrial control mainboard system according to claim 1, it is characterised in that：The aluminium support plate（31）Thickness for 500 ~
2000 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721151496.8U CN207408938U (en) | 2017-09-10 | 2017-09-10 | Industrial control mainboard system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721151496.8U CN207408938U (en) | 2017-09-10 | 2017-09-10 | Industrial control mainboard system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207408938U true CN207408938U (en) | 2018-05-25 |
Family
ID=62405886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721151496.8U Expired - Fee Related CN207408938U (en) | 2017-09-10 | 2017-09-10 | Industrial control mainboard system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207408938U (en) |
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2017
- 2017-09-10 CN CN201721151496.8U patent/CN207408938U/en not_active Expired - Fee Related
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Granted publication date: 20180525 |